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Produits Xilinx Inc.

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XCZU7CG-2FFVF1517E
Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock7 472
XCZU3EG-L1SFVA625I
Xilinx Inc.

IC FPGA 180 I/O 625FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 625-BFBGA, FCBGA
  • Supplier Device Package: 625-FCBGA (21x21)
paquet: 625-BFBGA, FCBGA
Stock4 624
XCZU2EG-L1SFVA625I
Xilinx Inc.

IC FPGA 180 I/O 625FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 625-BFBGA, FCBGA
  • Supplier Device Package: 625-FCBGA (21x21)
paquet: 625-BFBGA, FCBGA
Stock5 248
XC4036XL-1HQ208C
Xilinx Inc.

IC FPGA 160 I/O 208HQFP

  • Number of LABs/CLBs: 1296
  • Number of Logic Elements/Cells: 3078
  • Total RAM Bits: 41472
  • Number of I/O: 160
  • Number of Gates: 36000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP Exposed Pad
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP Exposed Pad
Stock5 568
hot XC4020XL-3HT144C
Xilinx Inc.

IC FPGA 113 I/O 144HQFP

  • Number of LABs/CLBs: 784
  • Number of Logic Elements/Cells: 1862
  • Total RAM Bits: 25088
  • Number of I/O: 113
  • Number of Gates: 20000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP Exposed Pad
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP Exposed Pad
Stock4 256
hot XC4003E-4PQ100C
Xilinx Inc.

IC FPGA 77 I/O 100QFP

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: 238
  • Total RAM Bits: 3200
  • Number of I/O: 77
  • Number of Gates: 3000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 100-BQFP
  • Supplier Device Package: 100-PQFP (14x20)
paquet: 100-BQFP
Stock15 600
hot XC7VX690T-L2FFG1157E
Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

  • Number of LABs/CLBs: 54150
  • Number of Logic Elements/Cells: 693120
  • Total RAM Bits: 54190080
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1157-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock5 808
XC5VTX150T-1FFG1156I
Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

  • Number of LABs/CLBs: 11600
  • Number of Logic Elements/Cells: 148480
  • Total RAM Bits: 8404992
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock7 136
XQ5VLX155T-1EF1136I
Xilinx Inc.

IC FPGA VIRTEX-5 155K 1136FBGA

  • Number of LABs/CLBs: 12160
  • Number of Logic Elements/Cells: 155648
  • Total RAM Bits: 7815168
  • Number of I/O: 640
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1136-BBGA, FCBGA
  • Supplier Device Package: 1136-FCBGA (35x35)
paquet: 1136-BBGA, FCBGA
Stock6 096
XC6VLX365T-L1FFG1156I
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

  • Number of LABs/CLBs: 28440
  • Number of Logic Elements/Cells: 364032
  • Total RAM Bits: 15335424
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.91 V ~ 0.97 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock2 464
XC7VX485T-2FFG1157C
Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

  • Number of LABs/CLBs: 37950
  • Number of Logic Elements/Cells: 485760
  • Total RAM Bits: 37969920
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1157-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock6 320
XC7V585T-1FFG1157I
Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

  • Number of LABs/CLBs: 45525
  • Number of Logic Elements/Cells: 582720
  • Total RAM Bits: 29306880
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1157-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock7 216
hot XC5VLX110T-1FF1136I
Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

  • Number of LABs/CLBs: 8640
  • Number of Logic Elements/Cells: 110592
  • Total RAM Bits: 5455872
  • Number of I/O: 640
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1136-BBGA, FCBGA
  • Supplier Device Package: 1136-FCBGA (35x35)
paquet: 1136-BBGA, FCBGA
Stock3 264
XQ5VFX70T-1EF1136M
Xilinx Inc.

IC FPGA VIRTEX-5FX 70K 1136-FBGA

  • Number of LABs/CLBs: 5600
  • Number of Logic Elements/Cells: 71680
  • Total RAM Bits: 5455872
  • Number of I/O: 640
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 1136-BBGA, FCBGA
  • Supplier Device Package: 1136-FCBGA (35x35)
paquet: 1136-BBGA, FCBGA
Stock7 744
XC7K355T-L2FFG901I
Xilinx Inc.

IC FPGA 300 I/O 901FCBGA

  • Number of LABs/CLBs: 27825
  • Number of Logic Elements/Cells: 356160
  • Total RAM Bits: 26357760
  • Number of I/O: 300
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 901-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock7 776
hot XC5VSX50T-2FFG665I
Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

  • Number of LABs/CLBs: 4080
  • Number of Logic Elements/Cells: 52224
  • Total RAM Bits: 4866048
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 665-BBGA, FCBGA
  • Supplier Device Package: 665-FCBGA (27x27)
paquet: 665-BBGA, FCBGA
Stock5 648
hot XC6VLX130T-2FFG1156C
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

  • Number of LABs/CLBs: 10000
  • Number of Logic Elements/Cells: 128000
  • Total RAM Bits: 9732096
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock4 704
XC6VLX75T-L1FF784I
Xilinx Inc.

IC FPGA 360 I/O 784FCBGA

  • Number of LABs/CLBs: 5820
  • Number of Logic Elements/Cells: 74496
  • Total RAM Bits: 5750784
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.91 V ~ 0.97 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (29x29)
paquet: 784-BBGA, FCBGA
Stock5 792
XC5VSX35T-2FF665C
Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

  • Number of LABs/CLBs: 2720
  • Number of Logic Elements/Cells: 34816
  • Total RAM Bits: 3096576
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 665-BBGA, FCBGA
  • Supplier Device Package: 665-FCBGA (27x27)
paquet: 665-BBGA, FCBGA
Stock4 592
XQ6SLX150T-DIE0628
Xilinx Inc.

IC FPGA SPARTAN 6 147K DIE

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: 1.2 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: Die
  • Supplier Device Package: Die
paquet: Die
Stock2 784
XC6SLX100T-N3FGG900C
Xilinx Inc.

IC FPGA 498 I/O 900FBGA

  • Number of LABs/CLBs: 7911
  • Number of Logic Elements/Cells: 101261
  • Total RAM Bits: 4939776
  • Number of I/O: 498
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
paquet: 900-BBGA
Stock7 120
XC6SLX25-L1FGG484C
Xilinx Inc.

IC FPGA 266 I/O 484FBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 266
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BBGA
Stock5 312
hot XC3S250E-4FT256C
Xilinx Inc.

IC FPGA 172 I/O 256FTBGA

  • Number of LABs/CLBs: 612
  • Number of Logic Elements/Cells: 5508
  • Total RAM Bits: 221184
  • Number of I/O: 172
  • Number of Gates: 250000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock9 348
XC6SLX9-L1CSG225C
Xilinx Inc.

IC FPGA 160 I/O 225CSBGA

  • Number of LABs/CLBs: 715
  • Number of Logic Elements/Cells: 9152
  • Total RAM Bits: 589824
  • Number of I/O: 160
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 225-LFBGA, CSPBGA
  • Supplier Device Package: 225-CSPBGA (13x13)
paquet: 225-LFBGA, CSPBGA
Stock5 040
XC7A15T-3FTG256E
Xilinx Inc.

IC FPGA ARTIX7 170 I/O 256FTBGA

  • Number of LABs/CLBs: 1300
  • Number of Logic Elements/Cells: 16640
  • Total RAM Bits: 921600
  • Number of I/O: 170
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock6 744
hot XC3S200AN-4FTG256I
Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

  • Number of LABs/CLBs: 448
  • Number of Logic Elements/Cells: 4032
  • Total RAM Bits: 294912
  • Number of I/O: 195
  • Number of Gates: 200000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock18 084
XCR3256XL-7PQG208C
Xilinx Inc.

IC CPLD 256MC 7NS 208QFP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 7.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 6000
  • Number of I/O: 164
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock5 008
XC7A12T-1CPG238C
Xilinx Inc.

XC7A12T-1CPG238C

  • Number of LABs/CLBs: 1000
  • Number of Logic Elements/Cells: 12800
  • Total RAM Bits: 737280
  • Number of I/O: 106
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 238-LFBGA, CSPBGA
  • Supplier Device Package: 236-CSBGA (10x10)
paquet: 238-LFBGA, CSPBGA
Stock6 832