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Produits Xilinx Inc.

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XCMECH-FF1152
Xilinx Inc.

FF1152 MECHANICAL SAMPLE

  • Type: Mechanical Sample
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock6 640
hot XC17S10PD8C
Xilinx Inc.

IC PROM PROG C-TEMP 3.3V 8-DIP

  • Programmable Type: OTP
  • Memory Size: 100kb
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
paquet: 8-DIP (0.300", 7.62mm)
Stock31 752
XCZU9EG-1FFVB1156E
Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock5 824
XCZU5EG-1SFVC784E
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
paquet: 784-BBGA, FCBGA
Stock6 656
XCZU2CG-L1SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
paquet: 784-BBGA, FCBGA
Stock3 296
hot XC2V1500-4BG575I
Xilinx Inc.

IC FPGA 392 I/O 575BGA

  • Number of LABs/CLBs: 1920
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 884736
  • Number of I/O: 392
  • Number of Gates: 1500000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 575-BBGA
  • Supplier Device Package: 575-BGA (31x31)
paquet: 575-BBGA
Stock6 372
XC2V8000-5FFG1517I
Xilinx Inc.

IC FPGA 1108 I/O 1517FCBGA

  • Number of LABs/CLBs: 11648
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 3096576
  • Number of I/O: 1108
  • Number of Gates: 8000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock4 688
XC2V500-5FGG256C
Xilinx Inc.

IC FPGA 172 I/O 256FBGA

  • Number of LABs/CLBs: 768
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 589824
  • Number of I/O: 172
  • Number of Gates: 500000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock6 960
hot XCV100E-6FG256I
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 81920
  • Number of I/O: 176
  • Number of Gates: 128236
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock6 016
hot XCS05-3VQ100I
Xilinx Inc.

IC FPGA 77 I/O 100VQFP

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: 238
  • Total RAM Bits: 3200
  • Number of I/O: 77
  • Number of Gates: 5000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
paquet: 100-TQFP
Stock15 900
hot XC4036XL-1BG432C
Xilinx Inc.

IC FPGA 288 I/O 432MBGA

  • Number of LABs/CLBs: 1296
  • Number of Logic Elements/Cells: 3078
  • Total RAM Bits: 41472
  • Number of I/O: 288
  • Number of Gates: 36000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
paquet: 432-LBGA, Metal
Stock6 128
XC6VLX365T-3FF1156C
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

  • Number of LABs/CLBs: 28440
  • Number of Logic Elements/Cells: 364032
  • Total RAM Bits: 15335424
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock5 536
XC6VSX315T-3FF1156C
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

  • Number of LABs/CLBs: 24600
  • Number of Logic Elements/Cells: 314880
  • Total RAM Bits: 25952256
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock6 896
XQ5VLX110-1EF676I
Xilinx Inc.

IC FPGA VIRTEX-5FX 110K 676-FBGA

  • Number of LABs/CLBs: 8640
  • Number of Logic Elements/Cells: 110592
  • Total RAM Bits: 4718592
  • Number of I/O: 440
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock2 416
XC4VLX60-12FF668C
Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

  • Number of LABs/CLBs: 6656
  • Number of Logic Elements/Cells: 59904
  • Total RAM Bits: 2949120
  • Number of I/O: 448
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 668-BBGA, FCBGA
  • Supplier Device Package: 668-FCBGA (27x27)
paquet: 668-BBGA, FCBGA
Stock7 728
hot XC2VP20-5FGG676C
Xilinx Inc.

IC FPGA 404 I/O 676FBGA

  • Number of LABs/CLBs: 2320
  • Number of Logic Elements/Cells: 20880
  • Total RAM Bits: 1622016
  • Number of I/O: 404
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
paquet: 676-BGA
Stock6 672
XC4VLX15-12SF363C
Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 13824
  • Total RAM Bits: 884736
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 363-FBGA, FCBGA
  • Supplier Device Package: 363-FCBGA (17x17)
paquet: 363-FBGA, FCBGA
Stock4 352
XC6SLX100T-3FG676I
Xilinx Inc.

IC FPGA 376 I/O 676FCBGA

  • Number of LABs/CLBs: 7911
  • Number of Logic Elements/Cells: 101261
  • Total RAM Bits: 4939776
  • Number of I/O: 376
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock2 560
hot XC3S1600E-4FGG400I
Xilinx Inc.

IC FPGA 304 I/O 400FBGA

  • Number of LABs/CLBs: 3688
  • Number of Logic Elements/Cells: 33192
  • Total RAM Bits: 663552
  • Number of I/O: 304
  • Number of Gates: 1600000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 400-BGA
  • Supplier Device Package: 400-FBGA (21x21)
paquet: 400-BGA
Stock31 200
hot XC3SD1800A-5FGG676C
Xilinx Inc.

IC FPGA 519 I/O 676FBGA

  • Number of LABs/CLBs: 4160
  • Number of Logic Elements/Cells: 37440
  • Total RAM Bits: 1548288
  • Number of I/O: 519
  • Number of Gates: 1800000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
paquet: 676-BGA
Stock5 680
hot XC3S1600E-4FG320I
Xilinx Inc.

IC FPGA 250 I/O 320FBGA

  • Number of LABs/CLBs: 3688
  • Number of Logic Elements/Cells: 33192
  • Total RAM Bits: 663552
  • Number of I/O: 250
  • Number of Gates: 1600000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 320-BGA
  • Supplier Device Package: 320-FBGA (19x19)
paquet: 320-BGA
Stock6 112
XA3S700A-4FGG400I
Xilinx Inc.

IC FPGA 311 I/O 400FBGA

  • Number of LABs/CLBs: 1472
  • Number of Logic Elements/Cells: 13248
  • Total RAM Bits: 368640
  • Number of I/O: 311
  • Number of Gates: 700000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 400-BGA
  • Supplier Device Package: 400-FBGA (21x21)
paquet: 400-BGA
Stock6 368
hot XC3S50-4VQ100I
Xilinx Inc.

IC FPGA 63 I/O 100VQFP

  • Number of LABs/CLBs: 192
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 73728
  • Number of I/O: 63
  • Number of Gates: 50000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
paquet: 100-TQFP
Stock9 792
hot XC3S1400A-4FTG256C
Xilinx Inc.

IC FPGA 161 I/O 256FTBGA

  • Number of LABs/CLBs: 2816
  • Number of Logic Elements/Cells: 25344
  • Total RAM Bits: 589824
  • Number of I/O: 161
  • Number of Gates: 1400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock94 236
hot XC3S200-4VQG100I
Xilinx Inc.

IC FPGA 63 I/O 100VQFP

  • Number of LABs/CLBs: 480
  • Number of Logic Elements/Cells: 4320
  • Total RAM Bits: 221184
  • Number of I/O: 63
  • Number of Gates: 200000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
paquet: 100-TQFP
Stock7 476
XC9572XV-7VQ44C
Xilinx Inc.

IC CPLD 72MC 7.5NS 44VQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 2.37 V ~ 2.62 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 72
  • Number of Gates: 1600
  • Number of I/O: 34
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-VQFP (10x10)
paquet: 44-TQFP
Stock6 608
XCR3128XL-6CSG144C
Xilinx Inc.

IC CPLD 128MC 144BGA

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 5.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 3000
  • Number of I/O: 108
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
paquet: 144-TFBGA, CSPBGA
Stock3 488
XCDAISY-CPG196
Xilinx Inc.

IC 196 BALL CHIP-SCALE BGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock6 880