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Produits Xilinx Inc.

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XCZU7EG-1FFVC1156E
Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock5 824
XCZU4EV-2SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
paquet: 784-BBGA, FCBGA
Stock4 880
XCZU3EG-L2SFVC784E
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
paquet: 784-BBGA, FCBGA
Stock2 736
XCZU3EG-2SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
paquet: 784-BBGA, FCBGA
Stock6 176
hot XC2V3000-4FF1152I
Xilinx Inc.

IC FPGA 720 I/O 1152FCBGA

  • Number of LABs/CLBs: 3584
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 1769472
  • Number of I/O: 720
  • Number of Gates: 3000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-CFCBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock4 560
hot XC6SLX150T-4FGG900C
Xilinx Inc.

IC FPGA 540 I/O 900FBGA

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: 540
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
paquet: 900-BBGA
Stock5 808
hot XC2S200E-6FG456C
Xilinx Inc.

IC FPGA 289 I/O 456FPGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 289
  • Number of Gates: 200000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
paquet: 456-BBGA
Stock97 104
XCV400E-7FG676I
Xilinx Inc.

IC FPGA 404 I/O 676FBGA

  • Number of LABs/CLBs: 2400
  • Number of Logic Elements/Cells: 10800
  • Total RAM Bits: 163840
  • Number of I/O: 404
  • Number of Gates: 569952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock5 936
hot XCS30XL-4TQ144C
Xilinx Inc.

IC FPGA 113 I/O 144TQFP

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 113
  • Number of Gates: 30000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock7 216
XC4003E-4PG120I
Xilinx Inc.

IC FPGA 80 I/O 120CPGA

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: 238
  • Total RAM Bits: 3200
  • Number of I/O: 80
  • Number of Gates: 3000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Through Hole
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 120-BCPGA
  • Supplier Device Package: 120-CPGA (34.55x34.55)
paquet: 120-BCPGA
Stock5 904
XC5210-6PQ240C
Xilinx Inc.

IC FPGA 196 I/O 240QFP

  • Number of LABs/CLBs: 324
  • Number of Logic Elements/Cells: 1296
  • Total RAM Bits: -
  • Number of I/O: 196
  • Number of Gates: 16000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
paquet: 240-BFQFP
Stock4 768
XC7VH580T-L2FLG1155E
Xilinx Inc.

IC FPGA 400 I/O 1155FCBGA

  • Number of LABs/CLBs: 45350
  • Number of Logic Elements/Cells: 580480
  • Total RAM Bits: 34652160
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: 1155-FCBGA (35x35)
paquet: -
Stock3 072
XC6VHX250T-2FF1154C
Xilinx Inc.

IC FPGA 320 I/O 1156FCBGA

  • Number of LABs/CLBs: 19680
  • Number of Logic Elements/Cells: 251904
  • Total RAM Bits: 18579456
  • Number of I/O: 320
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock4 016
hot XC5VLX155T-1FF1136C
Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

  • Number of LABs/CLBs: 12160
  • Number of Logic Elements/Cells: 155648
  • Total RAM Bits: 7815168
  • Number of I/O: 640
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1136-BBGA, FCBGA
  • Supplier Device Package: 1136-FCBGA (35x35)
paquet: 1136-BBGA, FCBGA
Stock5 488
hot XC2VP30-5FG676I
Xilinx Inc.

IC FPGA 416 I/O 676FBGA

  • Number of LABs/CLBs: 3424
  • Number of Logic Elements/Cells: 30816
  • Total RAM Bits: 2506752
  • Number of I/O: 416
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock6 640
XC5VFX30T-1FF665C
Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

  • Number of LABs/CLBs: 2560
  • Number of Logic Elements/Cells: 32768
  • Total RAM Bits: 2506752
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 665-BBGA, FCBGA
  • Supplier Device Package: 665-FCBGA (27x27)
paquet: 665-BBGA, FCBGA
Stock7 824
hot XC4VFX20-11FFG672I
Xilinx Inc.

IC FPGA 320 I/O 672FCBGA

  • Number of LABs/CLBs: 2136
  • Number of Logic Elements/Cells: 19224
  • Total RAM Bits: 1253376
  • Number of I/O: 320
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FCBGA (27x27)
paquet: 672-BBGA, FCBGA
Stock17 544
XC6SLX150T-3FG484I
Xilinx Inc.

IC FPGA 296 I/O 484FBGA

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BBGA
Stock5 840
XC6SLX75-L1FG676C
Xilinx Inc.

IC FPGA 408 I/O 676FCBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 408
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock4 064
XA6SLX45-3FGG484I
Xilinx Inc.

IC FPGA 316 I/O 484FGGBGA

  • Number of LABs/CLBs: 3411
  • Number of Logic Elements/Cells: 43661
  • Total RAM Bits: 2138112
  • Number of I/O: 316
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BBGA
Stock5 760
XC6SLX25-L1FT256C
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock6 560
XA6SLX16-3FTG256I
Xilinx Inc.

IC FPGA 186 I/O 256FTGBGA

  • Number of LABs/CLBs: 1139
  • Number of Logic Elements/Cells: 14579
  • Total RAM Bits: 589824
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock4 704
XC6SLX9-3FTG256I
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

  • Number of LABs/CLBs: 715
  • Number of Logic Elements/Cells: 9152
  • Total RAM Bits: 589824
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock7 744
XC2S30-5CSG144I
Xilinx Inc.

IC FPGA 92 I/O 144CSBGA

  • Number of LABs/CLBs: 216
  • Number of Logic Elements/Cells: 972
  • Total RAM Bits: 24576
  • Number of I/O: 92
  • Number of Gates: 30000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
paquet: 144-TFBGA, CSPBGA
Stock5 504
XC2C64A-7VQ100I
Xilinx Inc.

IC CPLD 64MC 6.7NS 100VQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.7ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1500
  • Number of I/O: 64
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
paquet: 100-TQFP
Stock3 392
XCVU9P-L2FSGD2104E
Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

  • Number of LABs/CLBs: 147780
  • Number of Logic Elements/Cells: 2586150
  • Total RAM Bits: 391168000
  • Number of I/O: 676
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.742 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 110°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (47.5x47.5)
paquet: 2104-BBGA, FCBGA
Stock4 000
XCVU160-3FLGB2104E
Xilinx Inc.

IC FPGA VIRTEX-U 2104FCBGA

  • Number of LABs/CLBs: 115800
  • Number of Logic Elements/Cells: 2026500
  • Total RAM Bits: 130969600
  • Number of I/O: 702
  • Number of Gates: -
  • Voltage - Supply: 0.970 V ~ 1.030 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (47.5x47.5)
paquet: 2104-BBGA, FCBGA
Stock3 296
XCKU3P-3FFVA676E
Xilinx Inc.

XCKU3P-3FFVA676E

  • Number of LABs/CLBs: 20340
  • Number of Logic Elements/Cells: 355950
  • Total RAM Bits: 31641600
  • Number of I/O: 256
  • Number of Gates: -
  • Voltage - Supply: 0.873 V ~ 0.927 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock2 704