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Produits Xilinx Inc. - Embarqué - FPGA (réseaux de portes programmables par l’utilisateur)

Dossiers 5 652
Page  175/202
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
XCV200-4FG456I
Xilinx Inc.

IC FPGA 284 I/O 456FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 284
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
paquet: 456-BBGA
Stock5 536
5292
57344
284
236666
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
456-BBGA
456-FBGA (23x23)
XCV200-4FG456C
Xilinx Inc.

IC FPGA 284 I/O 456FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 284
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
paquet: 456-BBGA
Stock4 608
5292
57344
284
236666
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
456-BBGA
456-FBGA (23x23)
XCV200-4FG256I
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 176
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock2 480
5292
57344
176
236666
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
256-BGA
256-FBGA (17x17)
hot XCV200-4FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 176
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock6 624
5292
57344
176
236666
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
hot XCV200-4BG352I
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 260
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
paquet: 352-LBGA, Metal
Stock21 600
5292
57344
260
236666
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
hot XCV200-4BG352C
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 260
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
paquet: 352-LBGA, Metal
Stock6 300
5292
57344
260
236666
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
352-LBGA, Metal
352-MBGA (35x35)
XCV200-4BG256I
Xilinx Inc.

IC FPGA 180 I/O 256BGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 180
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
paquet: 256-BBGA
Stock5 024
5292
57344
180
236666
2.375 V ~ 2.625 V
Surface Mount
-40°C ~ 100°C (TJ)
256-BBGA
256-PBGA (27x27)
hot XCV200-4BG256C
Xilinx Inc.

IC FPGA 180 I/O 256BGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 180
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
paquet: 256-BBGA
Stock17 484
5292
57344
180
236666
2.375 V ~ 2.625 V
Surface Mount
0°C ~ 85°C (TJ)
256-BBGA
256-PBGA (27x27)
XCV1600E-8FG900C
Xilinx Inc.

IC FPGA 700 I/O 900FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 700
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
paquet: 900-BBGA
Stock3 440
34992
589824
700
2188742
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
900-BBGA
900-FBGA (31x31)
hot XCV1600E-8FG860C
Xilinx Inc.

IC FPGA 660 I/O 860FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 660
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
paquet: 860-BGA
Stock4 384
34992
589824
660
2188742
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
XCV1600E-8FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 512
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
paquet: 680-LBGA Exposed Pad
Stock6 480
34992
589824
512
2188742
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV1600E-8FG1156C
Xilinx Inc.

IC FPGA 724 I/O 1156FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 724
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
paquet: 1156-BBGA
Stock3 520
34992
589824
724
2188742
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
1156-BBGA
1156-FBGA (35x35)
XCV1600E-8BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 404
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
paquet: 560-LBGA, Metal
Stock5 328
34992
589824
404
2188742
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV1600E-7FG900I
Xilinx Inc.

IC FPGA 700 I/O 900FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 700
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
paquet: 900-BBGA
Stock3 760
34992
589824
700
2188742
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
900-BBGA
900-FBGA (31x31)
XCV1600E-7FG900C
Xilinx Inc.

IC FPGA 700 I/O 900FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 700
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
paquet: 900-BBGA
Stock6 096
34992
589824
700
2188742
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
900-BBGA
900-FBGA (31x31)
XCV1600E-7FG860I
Xilinx Inc.

IC FPGA 660 I/O 860FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 660
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
paquet: 860-BGA
Stock3 088
34992
589824
660
2188742
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
XCV1600E-7FG860C
Xilinx Inc.

IC FPGA 660 I/O 860FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 660
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
paquet: 860-BGA
Stock3 744
34992
589824
660
2188742
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
XCV1600E-7FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 512
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
paquet: 680-LBGA Exposed Pad
Stock4 864
34992
589824
512
2188742
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV1600E-7FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 512
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
paquet: 680-LBGA Exposed Pad
Stock2 100
34992
589824
512
2188742
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)
XCV1600E-7FG1156I
Xilinx Inc.

IC FPGA 724 I/O 1156FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 724
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
paquet: 1156-BBGA
Stock5 200
34992
589824
724
2188742
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
1156-BBGA
1156-FBGA (35x35)
XCV1600E-7FG1156C
Xilinx Inc.

IC FPGA 724 I/O 1156FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 724
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
paquet: 1156-BBGA
Stock2 608
34992
589824
724
2188742
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
1156-BBGA
1156-FBGA (35x35)
XCV1600E-7BG560I
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 404
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
paquet: 560-LBGA, Metal
Stock7 072
34992
589824
404
2188742
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XCV1600E-7BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 404
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
paquet: 560-LBGA, Metal
Stock2 080
34992
589824
404
2188742
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XCV1600E-6FG900I
Xilinx Inc.

IC FPGA 700 I/O 900FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 700
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
paquet: 900-BBGA
Stock8 028
34992
589824
700
2188742
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
900-BBGA
900-FBGA (31x31)
hot XCV1600E-6FG900C
Xilinx Inc.

IC FPGA 700 I/O 900FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 700
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
paquet: 900-BBGA
Stock8 304
34992
589824
700
2188742
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
900-BBGA
900-FBGA (31x31)
XCV1600E-6FG860I
Xilinx Inc.

IC FPGA 660 I/O 860FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 660
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
paquet: 860-BGA
Stock7 856
34992
589824
660
2188742
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
XCV1600E-6FG860C
Xilinx Inc.

IC FPGA 660 I/O 860FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 660
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 860-BGA
  • Supplier Device Package: 860-FBGA (42.5x42.5)
paquet: 860-BGA
Stock4 800
34992
589824
660
2188742
1.71 V ~ 1.89 V
Surface Mount
0°C ~ 85°C (TJ)
860-BGA
860-FBGA (42.5x42.5)
XCV1600E-6FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 512
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
paquet: 680-LBGA Exposed Pad
Stock2 000
34992
589824
512
2188742
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
680-LBGA Exposed Pad
680-FTEBGA (40x40)