Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC FPGA 160 I/O 208HQFP
|
paquet: 208-BFQFP Exposed Pad |
Stock4 656 |
|
2432 | 32768 | 160 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 208-BFQFP Exposed Pad | 208-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 129 I/O 160HQFP
|
paquet: 160-BQFP Exposed Pad |
Stock5 264 |
|
2432 | 32768 | 129 | 28000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 160-BQFP Exposed Pad | 160-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 129 I/O 160HQFP
|
paquet: 160-BQFP Exposed Pad |
Stock2 560 |
|
2432 | 32768 | 129 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 160-BQFP Exposed Pad | 160-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 256 I/O 352MBGA
|
paquet: 352-LBGA, Metal |
Stock4 896 |
|
2432 | 32768 | 256 | 28000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 352-LBGA, Metal | 352-MBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 256 I/O 352MBGA
|
paquet: 352-LBGA, Metal |
Stock4 416 |
|
2432 | 32768 | 256 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 352-LBGA, Metal | 352-MBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 205 I/O 256BGA
|
paquet: 256-BBGA |
Stock7 488 |
|
2432 | 32768 | 205 | 28000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 256-BBGA | 256-PBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 205 I/O 256BGA
|
paquet: 256-BBGA |
Stock9 684 |
|
2432 | 32768 | 205 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-BBGA | 256-PBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 256 I/O 304HQFP
|
paquet: 304-BFQFP Exposed Pad |
Stock2 928 |
|
2432 | 32768 | 256 | 28000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) |
||
Xilinx Inc. |
IC FPGA 256 I/O 304HQFP
|
paquet: 304-BFQFP Exposed Pad |
Stock5 088 |
|
2432 | 32768 | 256 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) |
||
Xilinx Inc. |
IC FPGA 193 I/O 240HQFP
|
paquet: 240-BFQFP Exposed Pad |
Stock2 736 |
|
2432 | 32768 | 193 | 28000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 193 I/O 240HQFP
|
paquet: 240-BFQFP Exposed Pad |
Stock7 008 |
|
2432 | 32768 | 193 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 160 I/O 208HQFP
|
paquet: 208-BFQFP Exposed Pad |
Stock3 024 |
|
2432 | 32768 | 160 | 28000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 208-BFQFP Exposed Pad | 208-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 160 I/O 208HQFP
|
paquet: 208-BFQFP Exposed Pad |
Stock7 808 |
|
2432 | 32768 | 160 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 208-BFQFP Exposed Pad | 208-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 129 I/O 160HQFP
|
paquet: 160-BQFP Exposed Pad |
Stock7 440 |
|
2432 | 32768 | 129 | 28000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 160-BQFP Exposed Pad | 160-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 129 I/O 160HQFP
|
paquet: 160-BQFP Exposed Pad |
Stock3 840 |
|
2432 | 32768 | 129 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 160-BQFP Exposed Pad | 160-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 256 I/O 352MBGA
|
paquet: 352-LBGA, Metal |
Stock6 832 |
|
2432 | 32768 | 256 | 28000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 352-LBGA, Metal | 352-MBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 256 I/O 352MBGA
|
paquet: 352-LBGA, Metal |
Stock4 480 |
|
2432 | 32768 | 256 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 352-LBGA, Metal | 352-MBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 205 I/O 256BGA
|
paquet: 256-BBGA |
Stock5 808 |
|
2432 | 32768 | 205 | 28000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 256-BBGA | 256-PBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 205 I/O 256BGA
|
paquet: 256-BBGA |
Stock6 512 |
|
2432 | 32768 | 205 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-BBGA | 256-PBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 256 I/O 304HQFP
|
paquet: 304-BFQFP Exposed Pad |
Stock2 224 |
|
2432 | 32768 | 256 | 28000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) |
||
Xilinx Inc. |
IC FPGA 256 I/O 304HQFP
|
paquet: 304-BFQFP Exposed Pad |
Stock4 848 |
|
2432 | 32768 | 256 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) |
||
Xilinx Inc. |
IC FPGA 193 I/O 240HQFP
|
paquet: 240-BFQFP Exposed Pad |
Stock4 832 |
|
2432 | 32768 | 193 | 28000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 193 I/O 240HQFP
|
paquet: 240-BFQFP Exposed Pad |
Stock3 760 |
|
2432 | 32768 | 193 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 160 I/O 208HQFP
|
paquet: 208-BFQFP Exposed Pad |
Stock4 528 |
|
2432 | 32768 | 160 | 28000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 208-BFQFP Exposed Pad | 208-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 160 I/O 208HQFP
|
paquet: 208-BFQFP Exposed Pad |
Stock6 624 |
|
2432 | 32768 | 160 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 208-BFQFP Exposed Pad | 208-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 129 I/O 160HQFP
|
paquet: 160-BQFP Exposed Pad |
Stock5 632 |
|
2432 | 32768 | 129 | 28000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 160-BQFP Exposed Pad | 160-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 129 I/O 160HQFP
|
paquet: 160-BQFP Exposed Pad |
Stock7 152 |
|
2432 | 32768 | 129 | 28000 | 3 V ~ 3.6 V | Surface Mount | 0°C ~ 85°C (TJ) | 160-BQFP Exposed Pad | 160-PQFP (28x28) |
||
Xilinx Inc. |
IC FPGA 256 I/O 352MBGA
|
paquet: 352-LBGA, Metal |
Stock2 352 |
|
2432 | 32768 | 256 | 28000 | 3 V ~ 3.6 V | Surface Mount | -40°C ~ 100°C (TJ) | 352-LBGA, Metal | 352-MBGA (35x35) |