Page 309 - Produits TE Connectivity Passive Product - Pavé résistif - Montage en surface | Heisener Electronics
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Produits TE Connectivity Passive Product - Pavé résistif - Montage en surface

Dossiers 15 287
Page  309/546
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
CRGV2010F115K
TE Connectivity Passive Product

RES SMD 115K OHM 1% 1/2W 2010

  • Resistance: 115 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock5 418
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F113K
TE Connectivity Passive Product

RES SMD 113K OHM 1% 1/2W 2010

  • Resistance: 113 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock8 856
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F110K
TE Connectivity Passive Product

RES SMD 110K OHM 1% 1/2W 2010

  • Resistance: 110 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock3 006
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F107K
TE Connectivity Passive Product

RES SMD 107K OHM 1% 1/2W 2010

  • Resistance: 107 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock8 244
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F105K
TE Connectivity Passive Product

RES SMD 105K OHM 1% 1/2W 2010

  • Resistance: 105 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock6 408
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F102K
TE Connectivity Passive Product

RES SMD 102K OHM 1% 1/2W 2010

  • Resistance: 102 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock2 916
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F100K
TE Connectivity Passive Product

RES SMD 100K OHM 1% 1/2W 2010

  • Resistance: 100 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock4 734
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F97K6
TE Connectivity Passive Product

RES SMD 97.6K OHM 1% 1/2W 2010

  • Resistance: 97.6 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock3 924
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F95K3
TE Connectivity Passive Product

RES SMD 95.3K OHM 1% 1/2W 2010

  • Resistance: 95.3 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock7 398
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F93K1
TE Connectivity Passive Product

RES SMD 93.1K OHM 1% 1/2W 2010

  • Resistance: 93.1 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock4 896
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F90K9
TE Connectivity Passive Product

RES SMD 90.9K OHM 1% 1/2W 2010

  • Resistance: 90.9 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock6 786
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F88K7
TE Connectivity Passive Product

RES SMD 88.7K OHM 1% 1/2W 2010

  • Resistance: 88.7 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock5 238
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F86K6
TE Connectivity Passive Product

RES SMD 86.6K OHM 1% 1/2W 2010

  • Resistance: 86.6 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock3 454
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F84K5
TE Connectivity Passive Product

RES SMD 84.5K OHM 1% 1/2W 2010

  • Resistance: 84.5 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock4 266
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F82K5
TE Connectivity Passive Product

RES SMD 82.5K OHM 1% 1/2W 2010

  • Resistance: 82.5 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock4 374
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F80K6
TE Connectivity Passive Product

RES SMD 80.6K OHM 1% 1/2W 2010

  • Resistance: 80.6 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock3 078
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F78K7
TE Connectivity Passive Product

RES SMD 78.7K OHM 1% 1/2W 2010

  • Resistance: 78.7 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock5 958
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F76K8
TE Connectivity Passive Product

RES SMD 76.8K OHM 1% 1/2W 2010

  • Resistance: 76.8 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock5 436
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F75K
TE Connectivity Passive Product

RES SMD 75K OHM 1% 1/2W 2010

  • Resistance: 75 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock7 758
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F73K2
TE Connectivity Passive Product

RES SMD 73.2K OHM 1% 1/2W 2010

  • Resistance: 73.2 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock8 928
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F71K5
TE Connectivity Passive Product

RES SMD 71.5K OHM 1% 1/2W 2010

  • Resistance: 71.5 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock4 410
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F69K8
TE Connectivity Passive Product

RES SMD 69.8K OHM 1% 1/2W 2010

  • Resistance: 69.8 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock4 068
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F68K1
TE Connectivity Passive Product

RES SMD 68.1K OHM 1% 1/2W 2010

  • Resistance: 68.1 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock6 840
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F66K5
TE Connectivity Passive Product

RES SMD 66.5K OHM 1% 1/2W 2010

  • Resistance: 66.5 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock2 124
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F64K9
TE Connectivity Passive Product

RES SMD 64.9K OHM 1% 1/2W 2010

  • Resistance: 64.9 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock5 022
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F63K4
TE Connectivity Passive Product

RES SMD 63.4K OHM 1% 1/2W 2010

  • Resistance: 63.4 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock4 500
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F61K9
TE Connectivity Passive Product

RES SMD 61.9K OHM 1% 1/2W 2010

  • Resistance: 61.9 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock8 010
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGV2010F60K4
TE Connectivity Passive Product

RES SMD 60.4K OHM 1% 1/2W 2010

  • Resistance: 60.4 kOhms
  • Tolerance: ±1%
  • Power (Watts): 0.5W, 1/2W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±200ppm/°C
  • Operating Temperature: -55°C ~ 125°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock5 832
±1%
0.5W, 1/2W
Thick Film
-
±200ppm/°C
-55°C ~ 125°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-