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Produits TE Connectivity Passive Product - Pavé résistif - Montage en surface

Dossiers 15 287
Page  299/546
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
CRGH2010F5K23
TE Connectivity Passive Product

RES SMD 5.23K OHM 1% 1W 2010

  • Resistance: 5.23 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock8 334
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F5K11
TE Connectivity Passive Product

RES SMD 5.11K OHM 1% 1W 2010

  • Resistance: 5.11 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock7 866
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F4K99
TE Connectivity Passive Product

RES SMD 4.99K OHM 1% 1W 2010

  • Resistance: 4.99 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock3 544
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F4K87
TE Connectivity Passive Product

RES SMD 4.87K OHM 1% 1W 2010

  • Resistance: 4.87 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock6 480
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F4K75
TE Connectivity Passive Product

RES SMD 4.75K OHM 1% 1W 2010

  • Resistance: 4.75 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock2 340
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F4K64
TE Connectivity Passive Product

RES SMD 4.64K OHM 1% 1W 2010

  • Resistance: 4.64 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock6 966
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F4K53
TE Connectivity Passive Product

RES SMD 4.53K OHM 1% 1W 2010

  • Resistance: 4.53 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock6 894
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F4K42
TE Connectivity Passive Product

RES SMD 4.42K OHM 1% 1W 2010

  • Resistance: 4.42 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock5 670
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F4K32
TE Connectivity Passive Product

RES SMD 4.32K OHM 1% 1W 2010

  • Resistance: 4.32 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock6 426
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F4K22
TE Connectivity Passive Product

RES SMD 4.22K OHM 1% 1W 2010

  • Resistance: 4.22 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock7 722
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F4K12
TE Connectivity Passive Product

RES SMD 4.12K OHM 1% 1W 2010

  • Resistance: 4.12 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock8 190
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F4K02
TE Connectivity Passive Product

RES SMD 4.02K OHM 1% 1W 2010

  • Resistance: 4.02 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock4 842
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F3K92
TE Connectivity Passive Product

RES SMD 3.92K OHM 1% 1W 2010

  • Resistance: 3.92 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock4 644
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F3K83
TE Connectivity Passive Product

RES SMD 3.83K OHM 1% 1W 2010

  • Resistance: 3.83 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock4 482
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F3K74
TE Connectivity Passive Product

RES SMD 3.74K OHM 1% 1W 2010

  • Resistance: 3.74 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock2 736
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F3K65
TE Connectivity Passive Product

RES SMD 3.65K OHM 1% 1W 2010

  • Resistance: 3.65 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock8 748
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F3K57
TE Connectivity Passive Product

RES SMD 3.57K OHM 1% 1W 2010

  • Resistance: 3.57 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock3 400
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F3K48
TE Connectivity Passive Product

RES SMD 3.48K OHM 1% 1W 2010

  • Resistance: 3.48 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock5 742
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F3K4
TE Connectivity Passive Product

RES SMD 3.4K OHM 1% 1W 2010

  • Resistance: 3.4 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock8 892
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F3K32
TE Connectivity Passive Product

RES SMD 3.32K OHM 1% 1W 2010

  • Resistance: 3.32 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock8 298
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F3K24
TE Connectivity Passive Product

RES SMD 3.24K OHM 1% 1W 2010

  • Resistance: 3.24 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock2 100
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F3K16
TE Connectivity Passive Product

RES SMD 3.16K OHM 1% 1W 2010

  • Resistance: 3.16 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock8 136
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F3K09
TE Connectivity Passive Product

RES SMD 3.09K OHM 1% 1W 2010

  • Resistance: 3.09 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock3 490
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F3K01
TE Connectivity Passive Product

RES SMD 3.01K OHM 1% 1W 2010

  • Resistance: 3.01 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock8 100
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F2K94
TE Connectivity Passive Product

RES SMD 2.94K OHM 1% 1W 2010

  • Resistance: 2.94 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock6 570
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F2K87
TE Connectivity Passive Product

RES SMD 2.87K OHM 1% 1W 2010

  • Resistance: 2.87 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock5 076
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F2K8
TE Connectivity Passive Product

RES SMD 2.8K OHM 1% 1W 2010

  • Resistance: 2.8 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock8 964
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-
CRGH2010F2K74
TE Connectivity Passive Product

RES SMD 2.74K OHM 1% 1W 2010

  • Resistance: 2.74 kOhms
  • Tolerance: ±1%
  • Power (Watts): 1W
  • Composition: Thick Film
  • Features: -
  • Temperature Coefficient: ±100ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 2010 (5025 Metric)
  • Supplier Device Package: 2010
  • Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
  • Height - Seated (Max): -
  • Number of Terminations: 2
  • Failure Rate: -
paquet: 2010 (5025 Metric)
Stock2 340
±1%
1W
Thick Film
-
±100ppm/°C
-55°C ~ 155°C
2010 (5025 Metric)
2010
0.197" L x 0.098" W (5.00mm x 2.50mm)
-
2
-