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Produits TE Connectivity AMP Connectors - Supports pour CI, transistors

Dossiers 941
Page  19/34
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
643657-1
TE Connectivity AMP Connectors

CONN SOCKET SIP 25POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 25 (1 x 25)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock2 412
25 (1 x 25)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
643652-6
TE Connectivity AMP Connectors

CONN SOCKET SIP 20POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 20 (1 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock3 438
20 (1 x 20)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
643652-3
TE Connectivity AMP Connectors

CONN SOCKET SIP 20POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 20 (1 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock6 876
20 (1 x 20)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
643652-1
TE Connectivity AMP Connectors

CONN SOCKET SIP 20POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 20 (1 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock7 974
20 (1 x 20)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
643650-1
TE Connectivity AMP Connectors

CONN SOCKET SIP 18POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 18 (1 x 18)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock4 986
18 (1 x 18)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
643646-3
TE Connectivity AMP Connectors

CONN SOCKET SIP 14POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 14 (1 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock3 312
14 (1 x 14)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
643646-1
TE Connectivity AMP Connectors

CONN SOCKET SIP 14POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 14 (1 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock3 276
14 (1 x 14)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
643644-3
TE Connectivity AMP Connectors

CONN SOCKET SIP 12POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 12 (1 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock4 320
12 (1 x 12)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
643641-6
TE Connectivity AMP Connectors

CONN SOCKET SIP 9POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 9 (1 x 9)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock7 272
9 (1 x 9)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
641856-1
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock6 768
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
4-382568-8
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 48POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 48 (2 x 24)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock5 508
48 (2 x 24)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
382444-2
TE Connectivity AMP Connectors

CONN SOCKET SIP 8POS TIN-LEAD

  • Type: SIP
  • Number of Positions or Pins (Grid): 8 (1 x 8)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin-Lead
  • Contact Finish Thickness - Mating: 150µin (3.81µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: 150µin (3.81µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Fluoropolymer (FP)
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock2 268
8 (1 x 8)
0.100" (2.54mm)
Tin-Lead
150µin (3.81µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
150µin (3.81µm)
Beryllium Copper
Fluoropolymer (FP)
-55°C ~ 105°C
382441-1
TE Connectivity AMP Connectors

CONN SOCKET SIP 7POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 7 (1 x 7)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock8 658
7 (1 x 7)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
382438-1
TE Connectivity AMP Connectors

CONN SOCKET SIP 4POS TIN

  • Type: SIP
  • Number of Positions or Pins (Grid): 4 (1 x 4)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock6 984
4 (1 x 4)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
3-382568-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 32POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock2 100
32 (2 x 16)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
2-641616-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30µin (0.76µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic
  • Operating Temperature: -55°C ~ 125°C
paquet: -
Stock4 896
40 (2 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic
-55°C ~ 125°C
2-641615-4
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 15µin (0.38µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
paquet: -
Stock7 110
28 (2 x 14)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
2-641606-4
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 15µin (0.38µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
paquet: -
Stock5 850
40 (2 x 20)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
2-641604-2
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 24 (2 x 12)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30µin (0.76µm)
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
paquet: -
Stock7 326
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
2-641602-4
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS GOLD

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 15µin (0.38µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic
  • Operating Temperature: -55°C ~ 125°C
paquet: -
Stock6 210
20 (2 x 10)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic
-55°C ~ 125°C
2-641268-4
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 40 (2 x 20)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 15µin (0.38µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 125°C
paquet: -
Stock5 148
40 (2 x 20)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
2-382568-8
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock5 274
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
2-382568-0
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS TIN

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic, Glass Filled
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock8 352
20 (2 x 10)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 105°C
2-382470-3
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 32POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 32 (2 x 16)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock5 652
32 (2 x 16)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
-
Phosphor Bronze
Thermoplastic
-55°C ~ 105°C
2-382467-3
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS TIN

  • Type: DIP, 0.6" (15.24mm) Row Spacing
  • Number of Positions or Pins (Grid): 28 (2 x 14)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock8 136
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic
-55°C ~ 105°C
2-382465-3
TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS TIN

  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 20 (2 x 10)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Tin
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Thermoplastic
  • Operating Temperature: -55°C ~ 105°C
paquet: -
Stock5 724
20 (2 x 10)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Thermoplastic
-55°C ~ 105°C
916715-1
TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 321POS GOLD

  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): 321 (19 x 19)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 15µin (0.38µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
paquet: -
Stock4 320
321 (19 x 19)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Liquid Crystal Polymer (LCP)
-
916657-1
TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 321POS GOLD

  • Type: PGA, ZIF (ZIP)
  • Number of Positions or Pins (Grid): 321 (19 x 19)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Phosphor Bronze
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30µin (0.76µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature: -
paquet: -
Stock7 920
321 (19 x 19)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Phosphor Bronze
Liquid Crystal Polymer (LCP)
-