Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
For Use With/Related Products |
---|---|---|---|---|---|---|---|
TDK-Lambda Americas Inc. |
OUTPUT CHOKE
|
paquet: - |
Stock4 320 |
|
- |
||
CUI Inc. |
KIT CONVERTER DC-DC 75V SGL OUT
|
paquet: - |
Stock6 822 |
|
2" x 2" Single Output DC-DC Converters |
||
Artesyn Embedded Technologies |
HEATSINK AAXXC 75X75X20MM 3.5C/W
|
paquet: - |
Stock7 470 |
|
AMPSS? |
||
TDK-Lambda Americas Inc. |
HEAT SINK FOR PH50 SERIES DC-DC
|
paquet: - |
Stock4 464 |
|
PH50 Series |
||
Vicor Corporation |
AC HARMONIC ATTENUATOR MODULE (P
|
paquet: - |
Stock2 376 |
|
VICOR VE-J00, VI-J00 Modules |
||
TDK-Lambda Americas Inc. |
HEATSINK THERMAL PAD KIT FOR DC/
|
paquet: - |
Stock7 560 |
|
- |
||
TDK-Lambda Americas Inc. |
COMMON MODE CHOKE
|
paquet: - |
Stock7 362 |
|
- |
||
Vicor Corporation |
HEAT SINK FOR DCDC CNVTR/ARRAYS
|
paquet: - |
Stock7 326 |
|
VI Chip? DC DC Converters, VIPAC Arrays |
||
TDK-Lambda Americas Inc. |
HEATSINK
|
paquet: - |
Stock3 562 |
|
PH150S Series Power Supplies |
||
Artesyn Embedded Technologies |
LGA ACC KIT
|
paquet: - |
Stock3 222 |
|
LGA C Series Power Supply |
||
Artesyn Embedded Technologies |
HEATSINK (60) 57.5X59X37MM HORZ
|
paquet: - |
Stock3 366 |
|
AMPSS? |
||
Artesyn Embedded Technologies |
HEATSINK (60)57.5X59X22.5MM HORZ
|
paquet: - |
Stock5 418 |
|
AMPSS? |
||
Vicor Corporation |
MECHNCL SAMPLE PRM FULL CHIP SMD
|
paquet: - |
Stock5 148 |
|
- |
||
TDK-Lambda Americas Inc. |
HEATSINK FOR PXB DC-DC CONVERTER
|
paquet: - |
Stock5 634 |
|
PXB Series DC/DC Converter |
||
Vicor Corporation |
AC FRONT END HEATSINK
|
paquet: - |
Stock8 820 |
|
VICOR VI Brick? |
||
Vicor Corporation |
HALF PUSH-PIN BLU 0.125" 100/BAG
|
paquet: - |
Stock7 992 |
|
VI Chip? Modules |
||
Vicor Corporation |
24V 7A ACTIVE EMI FILTER
|
paquet: - |
Stock6 156 |
|
DC DC Converters |
||
Vicor Corporation |
IC HOT SWAP EMI FILTER 16LGA
|
paquet: - |
Stock6 426 |
|
DC DC Converters |
||
Vicor Corporation |
VI-RAM RIPPLE ATTENUATOR MODULE
|
paquet: - |
Stock8 352 |
|
VICOR VI-200, VI-J00, FlatPACs, ComPACS, MegaMods |
||
TDK-Lambda Americas Inc. |
HEATSINK PFE1000F
|
paquet: - |
Stock6 048 |
|
PFE1000F |
||
Vicor Corporation |
THERMAL PADS VI-200S
|
paquet: - |
Stock5 940 |
|
VICOR VI-200S-Sized Modules |
||
Vicor Corporation |
HEATSINK MINI 0.9" THRD/LONG
|
paquet: - |
Stock6 924 |
|
VICOR VI-J00-Sized Modules |
||
Vicor Corporation |
URAM OUTPUT ATTENUATION MODULE
|
paquet: - |
Stock7 704 |
|
VICOR VI-200, VI-J00, Maxi, Mini, Micro |
||
Vicor Corporation |
FULL 6.3MM TALL CROSS FLOW PINS
|
paquet: - |
Stock6 912 |
|
VI Chip? Modules |
||
Vicor Corporation |
THERMOPAD MINI
|
paquet: - |
Stock6 276 |
|
VICOR Mini-Sized Modules |
||
Vicor Corporation |
SOCKET FOR .040 PIN
|
paquet: - |
Stock14 310 |
|
VICOR Maxi, Mini, Micro, VI-200S, VI-J00 Modules |
||
Vicor Corporation |
THERM PAD FOR MAXI 1=10
|
paquet: - |
Stock4 518 |
|
VICOR Maxi, Mini, Micro-Sized Modules |
||
Vicor Corporation |
HEATSINK MICRO 0.4" THRU/LONG
|
paquet: - |
Stock10 020 |
|
VICOR Micro-Sized Modules |