Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ON Semiconductor |
IC EPROM 16K PARALLEL 24DIP
|
paquet: 24-DIP (0.600", 15.24mm) Window |
Stock5 472 |
|
EPROM | EPROM - UV | 16Kb (2K x 8) | Parallel | - | - | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 24-DIP (0.600", 15.24mm) Window | 24-DIP |
||
ON Semiconductor |
IC EEPROM 1K SPI 1MHZ 8SO
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 336 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 1MHz | 10ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
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ON Semiconductor |
IC EEPROM 1K SPI 1MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock3 712 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 1MHz | 10ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
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ON Semiconductor |
IC EEPROM 256 SPI 1MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock13 116 |
|
EEPROM | EEPROM | 256b (16 x 16) | SPI | 1MHz | 10ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC EEPROM 256 SPI 1MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock2 112 |
|
EEPROM | EEPROM | 256b (16 x 16) | SPI | 1MHz | 10ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
ON Semiconductor |
IC EPROM 512K PARALLEL 28CDIP
|
paquet: 28-CDIP (0.600", 15.24mm) Window |
Stock9 780 |
|
EPROM | EPROM - UV | 512Kb (64K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) Window | 28-CDIP |
||
ON Semiconductor |
IC EPROM 512K PARALLEL 28CDIP
|
paquet: 28-CDIP (0.600", 15.24mm) Window |
Stock6 608 |
|
EPROM | EPROM - UV | 512Kb (64K x 8) | Parallel | - | - | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) Window | 28-CDIP |
||
ON Semiconductor |
IC EPROM 512K PARALLEL 28CDIP
|
paquet: 28-CDIP (0.600", 15.24mm) Window |
Stock3 872 |
|
EPROM | EPROM - UV | 512Kb (64K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) Window | 28-CDIP |
||
ON Semiconductor |
IC EPROM 256K PARALLEL 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock5 952 |
|
EPROM | EPROM - OTP | 256Kb (32K x 8) | Parallel | - | - | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (14x11.46) |
||
ON Semiconductor |
IC EPROM 256K PARALLEL 28CDIP
|
paquet: 28-CDIP (0.600", 15.24mm) Window |
Stock4 800 |
|
EPROM | EPROM - UV | 256Kb (32K x 8) | Parallel | - | - | 200ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) Window | 28-CDIP |
||
ON Semiconductor |
IC EPROM 128K PARALLEL 28CDIP
|
paquet: 28-CDIP (0.600", 15.24mm) Window |
Stock6 128 |
|
EPROM | EPROM - UV | 128Kb (16K x 8) | Parallel | - | - | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) Window | 28-CDIP |
||
ON Semiconductor |
IC EPROM 1M PARALLEL 32CDIP
|
paquet: 32-CDIP (0.685", 17.40mm) Window |
Stock6 416 |
|
EPROM | EPROM - UV | 1Mb (128K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 32-CDIP (0.685", 17.40mm) Window | 32-CDIP |
||
ON Semiconductor |
IC EPROM 256K PARALLEL 28CDIP
|
paquet: 28-CDIP (0.600", 15.24mm) Window |
Stock2 256 |
|
EPROM | EPROM - UV | 256Kb (32K x 8) | Parallel | - | - | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) Window | 28-CDIP |
||
ON Semiconductor |
IC EPROM 256K PARALLEL 28CDIP
|
paquet: 28-CDIP (0.600", 15.24mm) Window |
Stock7 568 |
|
EPROM | EPROM - UV | 256Kb (32K x 8) | Parallel | - | - | 120ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) Window | 28-CDIP |
||
ON Semiconductor |
IC EPROM 512K PARALLEL 28CDIP
|
paquet: 28-CDIP (0.600", 15.24mm) Window |
Stock4 992 |
|
EPROM | EPROM - UV | 512Kb (64K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) Window | 28-CDIP |
||
ON Semiconductor |
IC EPROM 64K PARALLEL 28CDIP
|
paquet: 28-CDIP (0.600", 15.24mm) Window |
Stock5 920 |
|
EPROM | EPROM - UV | 64Kb (8K x 8) | Parallel | - | - | 150ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-CDIP (0.600", 15.24mm) Window | 28-CDIP |
||
ON Semiconductor |
IC RAM 64 PARALLEL 16DIP
|
paquet: 16-DIP (0.300", 7.62mm) |
Stock15 300 |
|
RAM | RAM | 64b (16 x 4) | Parallel | - | 29ns | 27ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
ON Semiconductor |
IC RAM 64 PARALLEL 16DIP
|
paquet: 16-DIP (0.300", 7.62mm) |
Stock4 800 |
|
RAM | RAM | 64b (16 x 4) | Parallel | - | 29ns | 27ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
ON Semiconductor |
IC EPROM 64K PARALLEL 28DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock5 648 |
|
EPROM | EPROM - OTP | 64Kb (8K x 8) | Parallel | - | - | 200ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 28-DIP (0.600", 15.24mm) | 28-DIP |
||
ON Semiconductor |
IC RAM 256 PARALLEL 18DIP
|
paquet: 18-DIP (0.300", 7.62mm) |
Stock3 072 |
|
RAM | RAM | 256b (64 x 4) | Parallel | - | - | 500ns | 4.75 V ~ 5.25 V | -40°C ~ 85°C (TA) | Through Hole | 18-DIP (0.300", 7.62mm) | 18-PDIP |
||
ON Semiconductor |
IC RAM 64 PARALLEL 16DIP
|
paquet: 16-DIP (0.300", 7.62mm) |
Stock6 208 |
|
RAM | RAM | 64b (16 x 4) | Parallel | - | - | 280ns | 3 V ~ 15 V | -55°C ~ 125°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
ON Semiconductor |
IC EEPROM SPI SER CMOS 8TSSOP
|
paquet: - |
Stock5 280 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC MEM EEPROM 128KB I2C
|
paquet: 4-XFBGA, WLCSP |
Stock2 048 |
|
EEPROM | EEPROM | 128K (16K x 8) | I²C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 4-XFBGA, WLCSP | 4-WLCSP (0.84x0.84) |
||
ON Semiconductor |
4KB MICROWIRE SER EEPROM
|
paquet: - |
Stock7 424 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
4KB MICROWIRE SER EEPROM
|
paquet: - |
Stock2 464 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
IC MEM EEPROM 64 KB I2C
|
paquet: - |
Stock4 352 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
INTEGRATED CIRCUIT
|
paquet: - |
Stock3 088 |
|
- | - | - | SPI | - | - | - | - | - | - | - | - |
||
ON Semiconductor |
INTEGRATED CIRCUIT
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock6 816 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I²C | 1MHz | 5ms | 500ns | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |