Produits NXP

BUK9509-75A,127

NXP

MOSFET N-CH 75V 75A TO220AB

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 75V
• Current - Continuous Drain (Id) @ 25°C: 75A (Tj)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: 8840pF @ 25V
• Vgs (Max): ±10V
• FET Feature: -
• Power Dissipation (Max): 230W (Tc)
• Rds On (Max) @ Id, Vgs: 8.5 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-220AB
• Package / Case: TO-220-3

paquet: TO-220-3

BZX84-C4V7/LF1R

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 4.7V
• Tolerance: ±5%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 80 Ohms
• Current - Reverse Leakage @ Vr: 3µA @ 2V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

paquet: TO-236-3, SC-59, SOT-23-3

MC33879APEK

NXP

IC SW SERIAL OCTAL 32SOIC

• Switch Type: General Purpose
• Number of Outputs: 8
• Ratio - Input:Output: 1:4
• Output Configuration: High Side or Low Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 5.5 V ~ 27.5 V
• Voltage - Supply (Vcc/Vdd): 3.1 V ~ 5.5 V
• Current - Output (Max): 600mA
• Rds On (Typ): 750 mOhm
• Input Type: -
• Features: -
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

paquet: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

HEF4047BP,652

NXP

IC MONO/ASTBL MULTVIBRTR 14-DIP

• Logic Type: Astable, Monostable
• Independent Circuits: 1
• Schmitt Trigger Input: No
• Propagation Delay: 50ns
• Current - Output High, Low: -
• Voltage - Supply: 4.5 V ~ 15.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)
• Supplier Device Package: 14-DIP

paquet: 14-DIP (0.300", 7.62mm)

SA5234D,518

NXP

IC OPAMP GP 2.5MHZ RRO 14SO

• Amplifier Type: General Purpose
• Number of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 0.8 V/µs
• Gain Bandwidth Product: -
• -3db Bandwidth: 2.5MHz
• Current - Input Bias: 90nA
• Voltage - Input Offset: 200µV
• Current - Supply: 2.8mA
• Current - Output / Channel: 12mA
• Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

paquet: 14-SOIC (0.154", 3.90mm Width)

TFA9843J/N1,112

NXP

IC AMP AUDIO PWR 29W STER 9SIL

• Type: Class AB
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 29W x 1 @ 8 Ohm; 14W x 2 @ 4 Ohm
• Voltage - Supply: 9 V ~ 26 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 9-PDBS-EP
• Package / Case: 9-SIP Exposed Tab, Formed Leads

paquet: 9-SIP Exposed Tab, Formed Leads

PCA9574HR,115

NXP

IC I/O EXPANDER I2C 8B 16HXQFN

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 1mA, 3mA
• Clock Frequency: 400kHz
• Voltage - Supply: 1.1 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-XFQFN Exposed Pad
• Supplier Device Package: 16-UHXQFN (2x2)

paquet: 16-XFQFN Exposed Pad

P1010PSN5DFA

NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA1

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 425-FBGA
• Supplier Device Package: 425-TEPBGA1

paquet: 425-FBGA

MPC8572ECLPXAULD

NXP

IC MPU MPC85XX 1.333GHZ 1023BGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Signal Processing; SPE, Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 1023-BFBGA, FCBGA
• Supplier Device Package: 1023-FCPBGA (33x33)

paquet: 1023-BFBGA, FCBGA

MPC8378VRANG

NXP

IC MPU MPC83XX 800MHZ 689TEBGA

• Core Processor: PowerPC e300c4s
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

paquet: 689-BBGA Exposed Pad

KMPC8271ZQTMFA

NXP

IC MPU MPC82XX 400MHZ 516BGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

paquet: 516-BBGA

S912ZVMC64F1MKHR

NXP

IC MCU 16BIT 64KB FLASH 64LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 42
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP EP (10x10)

paquet: 64-LQFP Exposed Pad

MC908JK8CDWE

NXP

IC MCU 8BIT 8KB FLASH 20SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 15
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 13x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

paquet: 20-SOIC (0.295", 7.50mm Width)

S912XET256W0MAA

NXP

IC MCU 16BIT 256KB FLASH 80QFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

paquet: 80-QFP

SPC5604BF2CLL6

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 79
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 16
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

PCK2111BD,157

NXP

IC CLK BUFFER 2:10 800MHZ 32LQFP

• Type: Fanout Buffer (Distribution), Multiplexer
• Number of Circuits: 1
• Ratio - Input:Output: 2:10
• Differential - Input:Output: Yes/Yes
• Input: LVDS
• Output: LVDS
• Frequency - Max: 800MHz
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

MMA5212NPKGWR2

NXP

ACCELEROMETER PSI5 16QFN

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

MF1S7001XDUD/V1V

NXP

MIFARE CLASSIC SMART CARD IC

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443
• Interface: UART
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 70°C
• Package / Case: Die
• Supplier Device Package: Die

paquet: Die

MC32PF3000A8EPR2

NXP

POWER MANAGEMENT IC I.MX7 PRE-

• Applications: i.MX Processors
• Current - Supply: -
• Voltage - Supply: 2.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

paquet: 48-VFQFN Exposed Pad

SAF7730HV/N231D,51

NXP

IC HD RADIO PROCESSOR 144HLQFP

• Type: Car Signal Processor
• Interface: -
• Clock Rate: 400MHz
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-HLQFP (20x20)

paquet: 144-LQFP Exposed Pad

MCIMX6Z0DVM09AB

NXP

IC MPU I.MX6ULZ 900MHZ 196MAPBGA

• Core Processor: ARM® Cortex®-A7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 900MHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad
• Ethernet: -
• SATA: -
• USB: USB 2.0 OTG + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-MAPBGA (14x14)

paquet: 289-LFBGA

MKW35A512VFP4

NXP

KINETIS W 32-BIT MCU ARM CORTEX-

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: 40-QFN
• Supplier Device Package: -

paquet: 40-QFN

FS32K144MAT0VLHR

NXP

S32K144 32-BIT MCU ARM

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

SE050B2HQ1/Z01SFZ

NXP

RSA AES DES QFN20

• Type: IoT Secure Element
• Applications: Industry 4.0
• Mounting Type: Surface Mount
• Package / Case: 20-XFQFN Exposed Pad
• Supplier Device Package: 20-HX2QFN (3x3)

paquet: 20-XFQFN Exposed Pad

MC9S08PL16SCTG

NXP

IC MCU 8BIT 16KB FLASH 16TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: LINbus, SCI, UART/USART
• Peripherals: LVD, POR, PWM
• Number of I/O: 14
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

paquet: -

NXH3675UK-A2Z

NXP

IC

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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S32K314EHT1VMMST

NXP

S32K314 ARM CORTEX-M7, 160 MHZ,

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit
• Speed: 160MHz
• Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
• Peripherals: DMA, I2S, Serial Audio, WDT
• Number of I/O: 218
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 24x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 257-LFBGA
• Supplier Device Package: 257-LFBGA (14x14)

paquet: -

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S9S12GN48J0CLF

NXP

S12 CORE,48K FLASH,AU

• Core Processor: S12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: -

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