Page 638 - Produits NXP | Heisener Electronics

Référence	Fabricant	Description	paquet	Stock
ON5402,518	NXP	MOSFET RF 8SOIC Transistor Type: - Frequency: - Gain: - Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: - Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	paquet: 8-SOIC (0.154", 3.90mm Width)	Stock3 584
MRF7S21170HSR5	NXP	FET RF 65V 2.17GHZ NI-880S Transistor Type: LDMOS Frequency: 2.17GHz Gain: 16dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.4A Power - Output: 50W Voltage - Rated: 65V Package / Case: NI-880S Supplier Device Package: NI-880S	paquet: NI-880S	Stock3 232
MC34933EPR2	NXP	IC MOTOR DRIVER PAR 16UQFN Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Function: Driver - Fully Integrated, Control and Power Stage Output Configuration: Half Bridge (4) Interface: Parallel Technology: Power MOSFET Step Resolution: - Applications: General Purpose Current - Output: 1A Voltage - Supply: 2.7 V ~ 5.5 V Voltage - Load: 2 V ~ 7 V Operating Temperature: -20°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 16-UFQFN Exposed Pad Supplier Device Package: 16-UQFN-EP (3x3)	paquet: 16-UFQFN Exposed Pad	Stock23 664
PCA9634PW,112	NXP	IC LED DRVR LIN DIM 25MA 20TSSOP Type: Power Switch Topology: - Internal Switch(s): Yes Number of Outputs: 8 Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V Voltage - Output: 5.5V Current - Output / Channel: 25mA Frequency: 25MHz Dimming: I2C Applications: Backlight Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	paquet: 20-TSSOP (0.173", 4.40mm Width)	Stock4 752
GTL2107PW,112	NXP	IC XLATR 12B GTL/LVTTL 28TSSOP Translator Type: Mixed Signal Channel Type: Unidirectional Number of Circuits: 1 Channels per Circuit: 12 Voltage - VCCA: - Voltage - VCCB: - Input Signal: GTL Output Signal: LVTTL Output Type: Open Drain, Push-Pull Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: - Mounting Type: Surface Mount Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	paquet: 28-TSSOP (0.173", 4.40mm Width)	Stock2 160
74HC563N,652	NXP	IC LATCH OCTAL D 3STATE 20DIP Logic Type: D-Type Transparent Latch Circuit: 8:8 Output Type: Tri-State Voltage - Supply: 2 V ~ 6 V Independent Circuits: 1 Delay Time - Propagation: 14ns Current - Output High, Low: - Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	paquet: 20-DIP (0.300", 7.62mm)	Stock4 096
N74F20D,623	NXP	IC GATE NAND 2CH 4-INP 14-SO Logic Type: NAND Gate Number of Circuits: 2 Number of Inputs: 4 Features: - Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): - Current - Output High, Low: 1mA, 20mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width)	paquet: 14-SOIC (0.154", 3.90mm Width)	Stock7 760
TDF8530TH/N1,512	NXP	IC AUDIO AMP BTL QUAD AB 44HSOP Type: Class D Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 100W x 4 @ 2 Ohm Voltage - Supply: 6 V ~ 24 V Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 44-HSOP Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad	paquet: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad	Stock4 720
M86204G12	NXP	IC C2K 1.2GHZ 8CH VOIP 625BGA Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Stock4 672
MPC8535EBVTAKGA	NXP	IC MPU MPC85XX 600MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (1) USB: USB 2.0 (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	paquet: 783-BBGA, FCBGA	Stock4 640
KMPC8379CVRALG	NXP	IC MPU MPC83XX 667MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (4) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	paquet: 689-BBGA Exposed Pad	Stock3 888
MC68MH360CZQ25L	NXP	IC MPU M683XX 25MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	paquet: 357-BBGA	Stock5 568
MC68EC040FE40A	NXP	IC MPU M680X0 40MHZ 184CQFP Core Processor: 68040 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 40MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 184-BCQFP Supplier Device Package: 184-CQFP (31.3x31.3)	paquet: 184-BCQFP	Stock2 496
MVF51NS152CMK50	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 Core Size: 32-Bit Single-Core Speed: 500MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Number of I/O: - Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D Dual x 12b, D/A Dual x 12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Stock5 632
ASC8850ET,557	NXP	IC IP CAMERA MPU SXGA 484TFBGA Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9? Program Memory Type: - Controller Series: - RAM Size: - Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG Number of I/O: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15)	paquet: 484-TFBGA	Stock4 736
SAA7709H/N104,518	NXP	IC DSP CAR RADIO 80QFP Type: Car Signal Processor Interface: I2C, I2S, LSB, SPDIF Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 80-BQFP Supplier Device Package: 80-PQFP (14x20)	paquet: 80-BQFP	Stock5 440
NT2L1211G0DUFV	NXP	IC SMART TAG NFC TYPE2 UNCASED Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443 Interface: - Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: Die Supplier Device Package: Wafer	paquet: Die	Stock6 732
SA602AD/01,118	NXP	IC MIXER 500MHZ UP CONVRT 8SO RF Type: Cellular, HF, UHF, VHF Frequency: 500MHz Number of Mixers: 1 Gain: 17dB Noise Figure: 5dB Secondary Attributes: Up Converter Current - Supply: 2.4mA Voltage - Supply: 4.5 V ~ 8 V Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	paquet: 8-SOIC (0.154", 3.90mm Width)	Stock16 920
OM7624/BGU7005FE,598	NXP	RF EVAL FOR BGU7005 Type: Amplifier, GPS Frequency: 1575.42MHz For Use With/Related Products: BGU7005 Supplied Contents: Board	paquet: -	Stock5 724
MC35FS6501NAER2	NXP	FS6500 Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	paquet: 48-LQFP Exposed Pad	Stock5 632
LS1023ASN8KNLB	NXP	QORIQ 2XCPU 64-BIT ARM ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	paquet: -	Stock7 200
SP5746CBK1AVKU6R	NXP	DUAL CORE 3M FLASH 384K RAM F Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	paquet: 176-LQFP Exposed Pad	Stock5 952
S912XEG384J3VAA	NXP	16-BIT MCU S12X CORE 384KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	paquet: 80-QFP	Stock2 336
MC9S08SE8MWL	NXP	IC MCU 8BIT 8KB FLASH 28SOIC Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LINbus, SCI Peripherals: LVD, POR, PWM Number of I/O: 24 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	paquet: 28-SOIC (0.295", 7.50mm Width)	Stock6 960
LS1018ASN7NQA	NXP	IC MPU QORIQ 1.3GHZ 448FBGA Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 1 Core, 64-Bit Speed: 1.3GHz Co-Processors/DSP: - RAM Controllers: DDR3L SDRAM, DDR4 SDRAM Graphics Acceleration: - Display & Interface Controllers: - Ethernet: 1Gbps (1), 2.5Gbps (5) SATA: SATA 6Gbps (1) USB: - Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 448-BFBGA Supplier Device Package: 448-FBGA (17x17)	paquet: -	Request a Quote
MCXA144VLL	NXP	IC Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Request a Quote
SAF7753EL-N205ZY	NXP	CAR DSP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Request a Quote
FS32R294JCK0MJDT	NXP	S32R29 MULTICORE POWER ARCHITECT Core Processor: e200z4, e200z7 Core Size: 32-Bit Dual-Core Speed: - Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI Peripherals: Temp Sensor Number of I/O: - Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 5.5M x 8 Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 269-LFBGA Supplier Device Package: 269-LFBGA (14x14)	paquet: -	Request a Quote

ON5402,518

NXP

MOSFET RF 8SOIC

Transistor Type: -
Frequency: -
Gain: -
Voltage - Test: -
Current Rating: -
Noise Figure: -
Current - Test: -
Power - Output: -
Voltage - Rated: -
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

Stock3 584

MRF7S21170HSR5

NXP

FET RF 65V 2.17GHZ NI-880S

Transistor Type: LDMOS
Frequency: 2.17GHz
Gain: 16dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.4A
Power - Output: 50W
Voltage - Rated: 65V
Package / Case: NI-880S
Supplier Device Package: NI-880S

paquet: NI-880S

Stock3 232

MC34933EPR2

NXP

IC MOTOR DRIVER PAR 16UQFN

Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Function: Driver - Fully Integrated, Control and Power Stage
Output Configuration: Half Bridge (4)
Interface: Parallel
Technology: Power MOSFET
Step Resolution: -
Applications: General Purpose
Current - Output: 1A
Voltage - Supply: 2.7 V ~ 5.5 V
Voltage - Load: 2 V ~ 7 V
Operating Temperature: -20°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 16-UFQFN Exposed Pad
Supplier Device Package: 16-UQFN-EP (3x3)

paquet: 16-UFQFN Exposed Pad

Stock23 664

PCA9634PW,112

NXP

IC LED DRVR LIN DIM 25MA 20TSSOP

Type: Power Switch
Topology: -
Internal Switch(s): Yes
Number of Outputs: 8
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Voltage - Output: 5.5V
Current - Output / Channel: 25mA
Frequency: 25MHz
Dimming: I2C
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

paquet: 20-TSSOP (0.173", 4.40mm Width)

Stock4 752

GTL2107PW,112

NXP

IC XLATR 12B GTL/LVTTL 28TSSOP

Translator Type: Mixed Signal
Channel Type: Unidirectional
Number of Circuits: 1
Channels per Circuit: 12
Voltage - VCCA: -
Voltage - VCCB: -
Input Signal: GTL
Output Signal: LVTTL
Output Type: Open Drain, Push-Pull
Data Rate: -
Operating Temperature: -40°C ~ 85°C (TA)
Features: -
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 28-TSSOP

paquet: 28-TSSOP (0.173", 4.40mm Width)

Stock2 160

74HC563N,652

NXP

IC LATCH OCTAL D 3STATE 20DIP

Logic Type: D-Type Transparent Latch
Circuit: 8:8
Output Type: Tri-State
Voltage - Supply: 2 V ~ 6 V
Independent Circuits: 1
Delay Time - Propagation: 14ns
Current - Output High, Low: -
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

paquet: 20-DIP (0.300", 7.62mm)

Stock4 096

N74F20D,623

NXP

IC GATE NAND 2CH 4-INP 14-SO

Logic Type: NAND Gate
Number of Circuits: 2
Number of Inputs: 4
Features: -
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Max): -
Current - Output High, Low: 1mA, 20mA
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Package / Case: 14-SOIC (0.154", 3.90mm Width)

paquet: 14-SOIC (0.154", 3.90mm Width)

Stock7 760

TDF8530TH/N1,512

NXP

IC AUDIO AMP BTL QUAD AB 44HSOP

Type: Class D
Output Type: 4-Channel (Quad)
Max Output Power x Channels @ Load: 100W x 4 @ 2 Ohm
Voltage - Supply: 6 V ~ 24 V
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 44-HSOP
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad

paquet: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad

Stock4 720

M86204G12

NXP

IC C2K 1.2GHZ 8CH VOIP 625BGA

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock4 672

MPC8535EBVTAKGA

NXP

IC MPU MPC85XX 600MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 600MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (1)
USB: USB 2.0 (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

Stock4 640

KMPC8379CVRALG

NXP

IC MPU MPC83XX 667MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (4)
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

paquet: 689-BBGA Exposed Pad

Stock3 888

MC68MH360CZQ25L

NXP

IC MPU M683XX 25MHZ 357BGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

paquet: 357-BBGA

Stock5 568

MC68EC040FE40A

NXP

IC MPU M680X0 40MHZ 184CQFP

Core Processor: 68040
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 40MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 184-BCQFP
Supplier Device Package: 184-CQFP (31.3x31.3)

paquet: 184-BCQFP

Stock2 496

MVF51NS152CMK50

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

Core Processor: ARM? Cortex?-A5
Core Size: 32-Bit Single-Core
Speed: 500MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Number of I/O: -
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D Dual x 12b, D/A Dual x 12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock5 632

ASC8850ET,557

NXP

IC IP CAMERA MPU SXGA 484TFBGA

Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9?
Program Memory Type: -
Controller Series: -
RAM Size: -
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Number of I/O: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 484-TFBGA
Supplier Device Package: 484-TFBGA (15x15)

paquet: 484-TFBGA

Stock4 736

SAA7709H/N104,518

NXP

IC DSP CAR RADIO 80QFP

Type: Car Signal Processor
Interface: I2C, I2S, LSB, SPDIF
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 80-BQFP
Supplier Device Package: 80-PQFP (14x20)

paquet: 80-BQFP

Stock5 440

NT2L1211G0DUFV

NXP

IC SMART TAG NFC TYPE2 UNCASED

Type: RFID Transponder
Frequency: 13.56MHz
Standards: ISO 14443
Interface: -
Voltage - Supply: -
Operating Temperature: -25°C ~ 70°C
Package / Case: Die
Supplier Device Package: Wafer

paquet: Die

Stock6 732

SA602AD/01,118

NXP

IC MIXER 500MHZ UP CONVRT 8SO

RF Type: Cellular, HF, UHF, VHF
Frequency: 500MHz
Number of Mixers: 1
Gain: 17dB
Noise Figure: 5dB
Secondary Attributes: Up Converter
Current - Supply: 2.4mA
Voltage - Supply: 4.5 V ~ 8 V
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

Stock16 920

OM7624/BGU7005FE,598

NXP

RF EVAL FOR BGU7005

Type: Amplifier, GPS
Frequency: 1575.42MHz
For Use With/Related Products: BGU7005
Supplied Contents: Board

paquet: -

Stock5 724

MC35FS6501NAER2

NXP

FS6500

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP Exposed Pad

Stock5 632

LS1023ASN8KNLB

NXP

QORIQ 2XCPU 64-BIT ARM ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock7 200

SP5746CBK1AVKU6R

NXP

DUAL CORE 3M FLASH 384K RAM F

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

paquet: 176-LQFP Exposed Pad

Stock5 952

S912XEG384J3VAA

NXP

16-BIT MCU S12X CORE 384KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 8x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

paquet: 80-QFP

Stock2 336

MC9S08SE8MWL

NXP

IC MCU 8BIT 8KB FLASH 28SOIC

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM
Number of I/O: 24
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

paquet: 28-SOIC (0.295", 7.50mm Width)

Stock6 960

LS1018ASN7NQA

NXP

IC MPU QORIQ 1.3GHZ 448FBGA

Core Processor: ARM® Cortex®-A72
Number of Cores/Bus Width: 1 Core, 64-Bit
Speed: 1.3GHz
Co-Processors/DSP: -
RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: 1Gbps (1), 2.5Gbps (5)
SATA: SATA 6Gbps (1)
USB: -
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 448-BFBGA
Supplier Device Package: 448-FBGA (17x17)

paquet: -

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MCXA144VLL

NXP

IC

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

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SAF7753EL-N205ZY

NXP

CAR DSP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

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FS32R294JCK0MJDT

NXP

S32R29 MULTICORE POWER ARCHITECT

Core Processor: e200z4, e200z7
Core Size: 32-Bit Dual-Core
Speed: -
Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI
Peripherals: Temp Sensor
Number of I/O: -
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 5.5M x 8
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 269-LFBGA
Supplier Device Package: 269-LFBGA (14x14)

paquet: -

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