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Produits NXP

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PDTD123YS,126
NXP

TRANS PREBIAS NPN 500MW TO92-3

  • Transistor Type: NPN - Pre-Biased
  • Current - Collector (Ic) (Max): 500mA
  • Voltage - Collector Emitter Breakdown (Max): 50V
  • Resistor - Base (R1) (Ohms): 2.2k
  • Resistor - Emitter Base (R2) (Ohms): 10k
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 50mA, 5V
  • Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
  • Current - Collector Cutoff (Max): 500nA
  • Frequency - Transition: -
  • Power - Max: 500mW
  • Mounting Type: Through Hole
  • Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
  • Supplier Device Package: TO-92-3
paquet: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Stock7 888
PDTB123TK,115
NXP

TRANS PREBIAS PNP 250MW SMT3

  • Transistor Type: PNP - Pre-Biased
  • Current - Collector (Ic) (Max): 500mA
  • Voltage - Collector Emitter Breakdown (Max): 50V
  • Resistor - Base (R1) (Ohms): 2.2k
  • Resistor - Emitter Base (R2) (Ohms): -
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 5V
  • Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
  • Current - Collector Cutoff (Max): 500nA
  • Frequency - Transition: -
  • Power - Max: 250mW
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SMT3; MPAK
paquet: TO-236-3, SC-59, SOT-23-3
Stock4 816
BZX284-B11,115
NXP

DIODE ZENER 11V 400MW SOD2

  • Voltage - Zener (Nom) (Vz): 11V
  • Tolerance: ±2%
  • Power - Max: 400mW
  • Impedance (Max) (Zzt): 10 Ohms
  • Current - Reverse Leakage @ Vr: 100nA @ 8V
  • Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: SOD-110
  • Supplier Device Package: SOD110
paquet: SOD-110
Stock5 776
N74F158AD,602
NXP

IC DATA SELECTOR/MUX 2IN 16SOIC

  • Type: Multiplexer
  • Circuit: 4 x 2:1
  • Independent Circuits: 1
  • Current - Output High, Low: 1mA, 20mA
  • Voltage Supply Source: Single Supply
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
paquet: 16-SOIC (0.154", 3.90mm Width)
Stock6 112
N74F02N,602
NXP

IC GATE NOR 4CH 2-INP 14-DIP

  • Logic Type: NOR Gate
  • Number of Circuits: 4
  • Number of Inputs: 2
  • Features: -
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Current - Quiescent (Max): -
  • Current - Output High, Low: 1mA, 20mA
  • Logic Level - Low: 0.8V
  • Logic Level - High: 2V
  • Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Through Hole
  • Supplier Device Package: 14-DIP
  • Package / Case: 14-DIP (0.300", 7.62mm)
paquet: 14-DIP (0.300", 7.62mm)
Stock2 016
HEF40374BP,652
NXP

IC D-TYPE POS TRG SNGL 20DIP

  • Function: Standard
  • Type: D-Type
  • Output Type: Tri-State, Non-Inverted
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Clock Frequency: 17MHz
  • Max Propagation Delay @ V, Max CL: 80ns @ 15V, 50pF
  • Trigger Type: Positive Edge
  • Current - Output High, Low: 50mA, 62mA
  • Voltage - Supply: 3 V ~ 15 V
  • Current - Quiescent (Iq): -
  • Input Capacitance: -
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Through Hole
  • Package / Case: 20-DIP (0.300", 7.62mm)
paquet: 20-DIP (0.300", 7.62mm)
Stock3 968
TDA9995HL/C1,518
NXP

HDMI SW 3:1 EQUALIZER 100LQFP

  • Type: HDMI 1.3 Smart Switch
  • Applications: TV
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
paquet: 100-LQFP
Stock4 064
SC16C750BIA44,518
NXP

IC UART SINGLE W/FIFO 44-PLCC

  • Features: -
  • Number of Channels: 1, UART
  • FIFO's: 64 Byte
  • Protocol: -
  • Data Rate (Max): 3Mbps
  • Voltage - Supply: 2.5V, 3.3V, 5V
  • With Auto Flow Control: Yes
  • With IrDA Encoder/Decoder: -
  • With False Start Bit Detection: Yes
  • With Modem Control: Yes
  • Mounting Type: Surface Mount
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
paquet: 44-LCC (J-Lead)
Stock2 512
SC16C654BIBM,128
NXP

IC QUAD UART 64BYTE 64LQFP

  • Features: -
  • Number of Channels: 4, QUART
  • FIFO's: 64 Byte
  • Protocol: -
  • Data Rate (Max): 5Mbps
  • Voltage - Supply: 2.5V, 3.3V, 5V
  • With Auto Flow Control: Yes
  • With IrDA Encoder/Decoder: Yes
  • With False Start Bit Detection: Yes
  • With Modem Control: Yes
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (7x7)
paquet: 64-LQFP
Stock2 832
hot MPC8313VRAFFB
NXP

IC MPU MPC83XX 333MHZ 516BGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 333MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 516-BBGA Exposed Pad
  • Supplier Device Package: 516-TEPBGA (27x27)
paquet: 516-BBGA Exposed Pad
Stock15 168
MC7448HX1000NC
NXP

IC MPU MPC74XX 1.0GHZ 360FCCBGA

  • Core Processor: PowerPC G4
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Multimedia; SIMD
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 360-BCBGA, FCCBGA
  • Supplier Device Package: 360-FCCBGA (25x25)
paquet: 360-BCBGA, FCCBGA
Stock5 952
MPC8323VRADDCA
NXP

IC MPU MPC83XX 266MHZ 516BGA

  • Core Processor: PowerPC e300c2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
paquet: 516-BBGA
Stock2 112
PK60N512VLL100
NXP

IC MCU 32BIT 512KB FLASH 100LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 66
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 19x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
paquet: 100-LQFP
Stock7 936
MCF5282CVM80J
NXP

IC MCU 32BIT 512KB FLASH 256BGA

  • Core Processor: Coldfire V2
  • Core Size: 32-Bit
  • Speed: 80MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 150
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPBGA
paquet: 256-LBGA
Stock4 800
MC56F8247MLH
NXP

IC MCU 16BIT 48KB FLASH 64LQFP

  • Core Processor: 56800E
  • Core Size: 16-Bit
  • Speed: 60MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 48KB (24K x 16)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 16
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 16x12b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock7 824
MC9S08SL8CTL
NXP

IC MCU 8BIT 8KB FLASH 28TSSOP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 22
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 28-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 28-TSSOP
paquet: 28-TSSOP (0.173", 4.40mm Width)
Stock5 616
MKL13Z64VLH4
NXP

IC MCU 32BIT 64KB FLASH 64LQFP

  • Core Processor: ARM? Cortex?-M0+
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 20x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock7 392
hot MC9RS08KA8CPG
NXP

IC MCU 8BIT 8KB FLASH 16DIP

  • Core Processor: RS08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 14
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 254 x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
  • Data Converters: A/D 12x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-DIP (0.300", 7.62mm)
  • Supplier Device Package: 16-DIP
paquet: 16-DIP (0.300", 7.62mm)
Stock4 608
PCT2075TP,147
NXP

SENSOR TEMP I2C/SMBUS 8HWSON

  • Sensor Type: Digital, Local
  • Sensing Temperature - Local: -55°C ~ 125°C
  • Sensing Temperature - Remote: -
  • Output Type: I2C/SMBus
  • Voltage - Supply: 2.7 V ~ 5.5 V
  • Resolution: 10 b
  • Features: Output Switch, Programmable Limit
  • Accuracy - Highest (Lowest): ±1°C (±2°C)
  • Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
  • Operating Temperature: -55°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-WFDFN Exposed Pad
  • Supplier Device Package: 8-HWSON (2x3)
paquet: 8-WFDFN Exposed Pad
Stock91 482
NCF2971ETT/T0E080J
NXP

IC REMOTE KEYLESS ENTRY 38TSSOP

  • Type: -
  • Frequency: -
  • Standards: -
  • Interface: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock4 122
SPC5603BK0CLL4
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 79
  • Program Memory Size: 384KB (384K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 28K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 28x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
paquet: 100-LQFP
Stock7 344
S9S12GA128AMLF
NXP

12-BIT ADC SPE TST SCREE

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CANbus, IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 40
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock5 760
S9S12ZVL8F0CLF
NXP

MAGNIV 16-BIT MCU S12Z CORE 8K

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 34
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 128 x 8
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
  • Data Converters: A/D 10x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock5 040
SAF7755HV/N205K
NXP

DSP AUDIO MULTI-TUNER

  • Type: Audio, Car Signal Processor
  • Interface: -
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: -
  • Voltage - Core: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-HLQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock7 968
TJR1462BTK-0Z
NXP

IC 8HVSON

  • Type: -
  • Protocol: -
  • Number of Drivers/Receivers: -
  • Duplex: -
  • Receiver Hysteresis: -
  • Data Rate: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 8-VDFN Exposed Pad
  • Supplier Device Package: 8-HVSON (3x3)
paquet: -
Request a Quote
SAF4000EL-101Z43AK
NXP

SAF4000EL

  • Type: -
  • Interface: -
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: -
  • Voltage - Core: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
FS32V234CON2VUBR
NXP

IC MPU FS32V23 1GHZ 621FCPBGA

  • Core Processor: ARM® Cortex®-A53
  • Number of Cores/Bus Width: 4 Core, 32/64-Bit
  • Speed: 1GHz
  • Co-Processors/DSP: ARM® Cortex®-M4
  • RAM Controllers: DDR3, DDR3L, LPDDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
  • Ethernet: GbE
  • SATA: -
  • USB: -
  • Voltage - I/O: 1V, 1.8V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
  • Package / Case: 621-FBGA, FCBGA
  • Supplier Device Package: 621-FCPBGA (17x17)
paquet: -
Request a Quote
MC33GD3100B3EK
NXP

GATE DRIVERS HV ISOLATED GATE DR

  • Driven Configuration: Half-Bridge
  • Channel Type: Single
  • Number of Drivers: 1
  • Gate Type: IGBT, N-Channel MOSFET
  • Voltage - Supply: 3.3V
  • Logic Voltage - VIL, VIH: -
  • Current - Peak Output (Source, Sink): 15A, 15A
  • Input Type: -
  • High Side Voltage - Max (Bootstrap): -
  • Rise / Fall Time (Typ): -
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width)
  • Supplier Device Package: 32-SOIC
paquet: -
Stock126