Page 605 - Produits NXP | Heisener Electronics

Référence	Fabricant	Description	paquet	Stock
PHB108NQ03LT,118	NXP	MOSFET N-CH 25V 75A D2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 25V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 16.3nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 1375pF @ 12V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 187W (Tc) Rds On (Max) @ Id, Vgs: 6 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: D2PAK Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	paquet: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	Stock4 512
MRFE6S9160HR5	NXP	FET RF 66V 880MHZ NI-780 Transistor Type: LDMOS Frequency: 880MHz Gain: 21dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.2A Power - Output: 35W Voltage - Rated: 66V Package / Case: NI-780 Supplier Device Package: NI-780	paquet: NI-780	Stock7 568
MRF19030LR5	NXP	FET RF 65V 1.96GHZ NI-400 Transistor Type: LDMOS Frequency: 1.96GHz Gain: 13dB Voltage - Test: 26V Current Rating: - Noise Figure: - Current - Test: 300mA Power - Output: 30W Voltage - Rated: 65V Package / Case: NI-400 Supplier Device Package: NI-400	paquet: NI-400	Stock7 696
MRF9045NR1	NXP	FET RF 65V 945MHZ TO270-2 Transistor Type: LDMOS Frequency: 945MHz Gain: 19dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 350mA Power - Output: 45W Voltage - Rated: 65V Package / Case: TO-270AA Supplier Device Package: TO-270-2	paquet: TO-270AA	Stock6 016
BF1212R,215	NXP	MOSFET N-CH DUAL GATE 6V SOT143R Transistor Type: N-Channel Dual Gate Frequency: 400MHz Gain: 30dB Voltage - Test: 5V Current Rating: 30mA Noise Figure: 0.9dB Current - Test: 12mA Power - Output: - Voltage - Rated: 6V Package / Case: SOT-143R Supplier Device Package: SOT-143R	paquet: SOT-143R	Stock2 304
MRF6V2300NBR5	NXP	FET RF 110V 220MHZ TO-272-4 Transistor Type: LDMOS Frequency: 220MHz Gain: 25.5dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 900mA Power - Output: 300W Voltage - Rated: 110V Package / Case: TO-272BB Supplier Device Package: TO-272 WB-4	paquet: TO-272BB	Stock2 416
LD6938CX6/18125PLJ	NXP	IC REG LINEAR 300MA 6WLCSP Output Configuration: - Output Type: - Number of Regulators: 2 Voltage - Input (Max): - Voltage - Output (Min/Fixed): - Voltage - Output (Max): - Voltage Dropout (Max): - Current - Output: 300mA Current - Quiescent (Iq): - Current - Supply (Max): - PSRR: - Control Features: - Protection Features: - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 6-XFBGA, WLCSP Supplier Device Package: 6-WLCSP (1.2x0.80)	paquet: 6-XFBGA, WLCSP	Stock5 200
MC07XSC200EK	NXP	IC SWITCH DUAL 32SOIC SPDL07 Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 6 V ~ 20 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 26A Rds On (Typ): 7 mOhm (Max) Input Type: - Features: Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	paquet: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock2 688
PCA9306GF,115	NXP	IC LEVEL TRANSLATOR 8XSON Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 2 Voltage - VCCA: 1V ~ 3.6V Voltage - VCCB: 1.8V ~ 5.5V Input Signal: - Output Signal: - Output Type: Open Drain Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 8-XFDFN Supplier Device Package: 8-XSON, SOT1089 (1.35x1)	paquet: 8-XFDFN	Stock1 140 000
BGS67A,112	NXP	IC AMP REVERSE GAIN DMAN8 Applications: CATV Output Type: - Number of Circuits: 1 -3db Bandwidth: - Slew Rate: - Current - Supply: 95mA Current - Output / Channel: - Voltage - Supply, Single/Dual (±): - Mounting Type: Surface Mount Package / Case: SOT-567A Supplier Device Package: DMAN8	paquet: SOT-567A	Stock5 536
MPC8379CVRANGA	NXP	IC MPU MPC83XX 800MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (4) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	paquet: 689-BBGA Exposed Pad	Stock5 328
MCIMX512DJM8CR2	NXP	IC MPU I.MX51 800MHZ 529BGA Core Processor: ARM? Cortex?-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case: 529-LFBGA Supplier Device Package: 529-BGA Case 2017 (19x19)	paquet: 529-LFBGA	Stock5 536
MPC860DTVR80D4	NXP	IC MPU MPC8XX 80MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	paquet: 357-BBGA	Stock6 928
MCIMX6S5DVM10ACR	NXP	IC MPU I.MX6S 1.0GHZ 624MAPBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	paquet: 624-LFBGA	Stock5 024
P1020NSN2HFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	paquet: 689-BBGA Exposed Pad	Stock6 300
S9S12VR64F2CLF	NXP	IC MCU 16BIT 64KB FLASH 48LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	paquet: 48-LQFP	Stock7 632
MCF5474ZP200	NXP	IC MCU 32BIT ROMLESS 388PBGA Core Processor: Coldfire V4E Core Size: 32-Bit Speed: 200MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Number of I/O: 99 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27)	paquet: 388-BBGA	Stock6 640
MC56F8025VLD	NXP	IC MCU 16BIT 32KB FLASH 44LQFP Core Processor: 56800E Core Size: 16-Bit Speed: 32MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 35 Program Memory Size: 32KB (16K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 16 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	paquet: 44-LQFP	Stock128 040
MC9S12E128CPVE	NXP	IC MCU 16BIT 128KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: EBI/EMI, I2C, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 91 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.75 V Data Converters: A/D 16x10b; D/A 2x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	paquet: 112-LQFP	Stock56 232
LS1026ASE8T1A	NXP	QORIQ LAYERSCAPE 2XA72 64BIT ARM Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	paquet: -	Stock2 560
SPC5744PK1MLQ9R	NXP	IC MCU 32BIT 2.5MB FLASH 144LQFP Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: 79 Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	paquet: 144-LQFP	Stock4 208
S9S08RNA16W2VLCR	NXP	8-BIT MCU S08 CORE 16KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	paquet: 32-LQFP	Stock5 024
SP5746BHK1AMKU6R	NXP	SINGLE CORE, 3M FLASH Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Request a Quote
S9S12GN16J0MLF	NXP	IC MCU 16BIT 16KB FLASH 48LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	paquet: -	Request a Quote
MWCT1R24ZVHT	NXP	KW40 512 WCT 48LQFN Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Request a Quote
TJR1441BT-0Z	NXP	IC TRANSCEIVER HALF 1/1 8SO Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 50 mV Data Rate: 5Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 175°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	paquet: -	Request a Quote
LPC5526JBD100K	NXP	IC MCU 32BIT 256KB FLSH 100HLQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 144K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-HLQFP (14x14)	paquet: -	Stock1 344
SAF7751HV-N207W-SK	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Request a Quote

PHB108NQ03LT,118

NXP

MOSFET N-CH 25V 75A D2PAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 25V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs(th) (Max) @ Id: 2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 16.3nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds: 1375pF @ 12V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 187W (Tc)
Rds On (Max) @ Id, Vgs: 6 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

paquet: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

Stock4 512

MRFE6S9160HR5

NXP

FET RF 66V 880MHZ NI-780

Transistor Type: LDMOS
Frequency: 880MHz
Gain: 21dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.2A
Power - Output: 35W
Voltage - Rated: 66V
Package / Case: NI-780
Supplier Device Package: NI-780

paquet: NI-780

Stock7 568

MRF19030LR5

NXP

FET RF 65V 1.96GHZ NI-400

Transistor Type: LDMOS
Frequency: 1.96GHz
Gain: 13dB
Voltage - Test: 26V
Current Rating: -
Noise Figure: -
Current - Test: 300mA
Power - Output: 30W
Voltage - Rated: 65V
Package / Case: NI-400
Supplier Device Package: NI-400

paquet: NI-400

Stock7 696

MRF9045NR1

NXP

FET RF 65V 945MHZ TO270-2

Transistor Type: LDMOS
Frequency: 945MHz
Gain: 19dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 350mA
Power - Output: 45W
Voltage - Rated: 65V
Package / Case: TO-270AA
Supplier Device Package: TO-270-2

paquet: TO-270AA

Stock6 016

BF1212R,215

NXP

MOSFET N-CH DUAL GATE 6V SOT143R

Transistor Type: N-Channel Dual Gate
Frequency: 400MHz
Gain: 30dB
Voltage - Test: 5V
Current Rating: 30mA
Noise Figure: 0.9dB
Current - Test: 12mA
Power - Output: -
Voltage - Rated: 6V
Package / Case: SOT-143R
Supplier Device Package: SOT-143R

paquet: SOT-143R

Stock2 304

MRF6V2300NBR5

NXP

FET RF 110V 220MHZ TO-272-4

Transistor Type: LDMOS
Frequency: 220MHz
Gain: 25.5dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 900mA
Power - Output: 300W
Voltage - Rated: 110V
Package / Case: TO-272BB
Supplier Device Package: TO-272 WB-4

paquet: TO-272BB

Stock2 416

LD6938CX6/18125PLJ

NXP

IC REG LINEAR 300MA 6WLCSP

Output Configuration: -
Output Type: -
Number of Regulators: 2
Voltage - Input (Max): -
Voltage - Output (Min/Fixed): -
Voltage - Output (Max): -
Voltage Dropout (Max): -
Current - Output: 300mA
Current - Quiescent (Iq): -
Current - Supply (Max): -
PSRR: -
Control Features: -
Protection Features: -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 6-XFBGA, WLCSP
Supplier Device Package: 6-WLCSP (1.2x0.80)

paquet: 6-XFBGA, WLCSP

Stock5 200

MC07XSC200EK

NXP

IC SWITCH DUAL 32SOIC SPDL07

Switch Type: General Purpose
Number of Outputs: 2
Ratio - Input:Output: 1:1
Output Configuration: High Side
Output Type: N-Channel
Interface: SPI
Voltage - Load: 6 V ~ 20 V
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Current - Output (Max): 26A
Rds On (Typ): 7 mOhm (Max)
Input Type: -
Features: Slew Rate Controlled, Watchdog Timer
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP

paquet: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

Stock2 688

PCA9306GF,115

NXP

IC LEVEL TRANSLATOR 8XSON

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 2
Voltage - VCCA: 1V ~ 3.6V
Voltage - VCCB: 1.8V ~ 5.5V
Input Signal: -
Output Signal: -
Output Type: Open Drain
Data Rate: -
Operating Temperature: -40°C ~ 85°C (TA)
Features: Auto-Direction Sensing
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)

paquet: 8-XFDFN

Stock1 140 000

BGS67A,112

NXP

IC AMP REVERSE GAIN DMAN8

Applications: CATV
Output Type: -
Number of Circuits: 1
-3db Bandwidth: -
Slew Rate: -
Current - Supply: 95mA
Current - Output / Channel: -
Voltage - Supply, Single/Dual (±): -
Mounting Type: Surface Mount
Package / Case: SOT-567A
Supplier Device Package: DMAN8

paquet: SOT-567A

Stock5 536

MPC8379CVRANGA

NXP

IC MPU MPC83XX 800MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (4)
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

paquet: 689-BBGA Exposed Pad

Stock5 328

MCIMX512DJM8CR2

NXP

IC MPU I.MX51 800MHZ 529BGA

Core Processor: ARM? Cortex?-A8
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature: -20°C ~ 85°C (TC)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Package / Case: 529-LFBGA
Supplier Device Package: 529-BGA Case 2017 (19x19)

paquet: 529-LFBGA

Stock5 536

MPC860DTVR80D4

NXP

IC MPU MPC8XX 80MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 80MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (2), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

paquet: 357-BBGA

Stock6 928

MCIMX6S5DVM10ACR

NXP

IC MPU I.MX6S 1.0GHZ 624MAPBGA

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-LFBGA
Supplier Device Package: 624-MAPBGA (21x21)

paquet: 624-LFBGA

Stock5 024

P1020NSN2HFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

paquet: 689-BBGA Exposed Pad

Stock6 300

S9S12VR64F2CLF

NXP

IC MCU 16BIT 64KB FLASH 48LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 28
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

Stock7 632

MCF5474ZP200

NXP

IC MCU 32BIT ROMLESS 388PBGA

Core Processor: Coldfire V4E
Core Size: 32-Bit
Speed: 200MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Number of I/O: 99
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 388-BBGA
Supplier Device Package: 388-PBGA (27x27)

paquet: 388-BBGA

Stock6 640

MC56F8025VLD

NXP

IC MCU 16BIT 32KB FLASH 44LQFP

Core Processor: 56800E
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 35
Program Memory Size: 32KB (16K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 16
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

paquet: 44-LQFP

Stock128 040

MC9S12E128CPVE

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.75 V
Data Converters: A/D 16x10b; D/A 2x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

paquet: 112-LQFP

Stock56 232

LS1026ASE8T1A

NXP

QORIQ LAYERSCAPE 2XA72 64BIT ARM

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock2 560

SPC5744PK1MLQ9R

NXP

IC MCU 32BIT 2.5MB FLASH 144LQFP

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 200MHz
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 79
Program Memory Size: 2.5MB (2.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

Stock4 208

S9S08RNA16W2VLCR

NXP

8-BIT MCU S08 CORE 16KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

Stock5 024

SP5746BHK1AMKU6R

NXP

SINGLE CORE, 3M FLASH

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

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S9S12GN16J0MLF

NXP

IC MCU 16BIT 16KB FLASH 48LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

paquet: -

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MWCT1R24ZVHT

NXP

KW40 512 WCT 48LQFN

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

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TJR1441BT-0Z

NXP

IC TRANSCEIVER HALF 1/1 8SO

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 50 mV
Data Rate: 5Mbps
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

paquet: -

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LPC5526JBD100K

NXP

IC MCU 32BIT 256KB FLSH 100HLQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 144K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-HLQFP (14x14)

paquet: -

Stock1 344

SAF7751HV-N207W-SK

NXP

CAR DISP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

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