Produits NXP

PHD108NQ03LT,118

NXP

MOSFET N-CH 25V 75A DPAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 25V
• Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 16.3nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 1375pF @ 12V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 187W (Tc)
• Rds On (Max) @ Id, Vgs: 6 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: DPAK
• Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63

paquet: TO-252-3, DPak (2 Leads + Tab), SC-63

BLC8G24LS-240AVJ

NXP

TRANS RF 240W 65V LDMOS SOT1252

• Transistor Type: LDMOS (Dual)
• Frequency: 2.3GHz ~ 2.4GHz
• Gain: 15dB
• Voltage - Test: 30V
• Current Rating: -
• Noise Figure: -
• Current - Test: 800mA
• Power - Output: 63W
• Voltage - Rated: 65V
• Package / Case: SOT-1252-1
• Supplier Device Package: SOT1252-1

paquet: SOT-1252-1

MRF8P8300HSR5

NXP

FET RF 2CH 70V 820MHZ NI1230S

• Transistor Type: LDMOS (Dual)
• Frequency: 820MHz
• Gain: 20.9dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 2A
• Power - Output: 96W
• Voltage - Rated: 70V
• Package / Case: NI-1230S
• Supplier Device Package: NI-1230S

paquet: NI-1230S

AFT23S160W02SR3

NXP

FET RF 65V 2.4GHZ NI780S-2

• Transistor Type: LDMOS
• Frequency: 2.4GHz
• Gain: 17.9dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.1A
• Power - Output: 45W
• Voltage - Rated: 65V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

paquet: NI-780S

BZX284-C3V0,115

NXP

DIODE ZENER 3V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 3V
• Tolerance: ±5%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 95 Ohms
• Current - Reverse Leakage @ Vr: 10µA @ 1V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

paquet: SOD-110

BB145,115

NXP

DIODE VAR CAP 6V SOD-523

• Capacitance @ Vr, F: 3.25pF @ 4V, 1MHz
• Capacitance Ratio: 2
• Capacitance Ratio Condition: C1/C4
• Voltage - Peak Reverse (Max): 6V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-79, SOD-523
• Supplier Device Package: SOD-523

paquet: SC-79, SOD-523

MC33887PNBR2

NXP

IC MOTOR DRIVER PAR 36PQFN

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushed DC
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (2)
• Interface: Parallel
• Technology: Power MOSFET
• Step Resolution: -
• Applications: General Purpose
• Current - Output: 5A
• Voltage - Supply: 5 V ~ 28 V
• Voltage - Load: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 36-PowerQFN
• Supplier Device Package: 36-PWR QFN (9x9)

paquet: 36-PowerQFN

SL2S2001AC3,118

NXP

IC I-CODE SLI FCS2

• Applications: -
• Interface: -
• Voltage - Supply: -
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

paquet: -

MPC8544VTAQGA

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

KMPC8272CVRTIEA

NXP

IC MPU MPC82XX 400MHZ 516BGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; RISC CPM, Security; SEC
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

paquet: 516-BBGA

MPC862TVR66B

NXP

IC MPU MPC8XX 66MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

paquet: 357-BBGA

MPC855TZQ66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

paquet: 357-BBGA

LPC2292FBD144,551

NXP

IC MCU 32BIT 256KB FLASH 144LQFP

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: CAN, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 112
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

MCF5235CVM150

NXP

IC MCU 32BIT ROMLESS 256MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number of I/O: 97
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-MAPBGA

paquet: 256-LBGA

XC56309VF100A

NXP

IC DSP 24BIT FIXED-POINT 196-BGA

• Type: Fixed Point
• Interface: Host Interface, SSI, SCI
• Clock Rate: 100MHz
• Non-Volatile Memory: ROM (576 B)
• On-Chip RAM: 24kB
• Voltage - I/O: 3.30V
• Voltage - Core: 3.30V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

paquet: 196-LBGA

OM5591/MF0U10,699

NXP

MIFARE ULTRALIGHT 5 TAGS MF1S50

• Type: NFC Type 2
• Frequency: -
• For Use With/Related Products: -
• Supplied Contents: 5 Tags

paquet: -

MPXY8510DK016T1

NXP

IC PRESSURE SENSOR 32QFN

• Frequency: 315MHz, 434MHz
• Applications: TPM (Tire Pressure Monitor)
• Modulation or Protocol: FSK, OOK
• Data Rate (Max): -
• Power - Output: -
• Current - Transmitting: -
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Memory Size: 8kB Flash, 512B SRAM
• Features: -
• Voltage - Supply: 2.3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 32-QFN Exposed Pad

paquet: 32-QFN Exposed Pad

MW4IC2020NBR1

NXP

IC PWR AMP RF 26V 20W TO-272-16

• Frequency: 1.6GHz ~ 2.4GHz
• P1dB: -
• Gain: 29dB
• Noise Figure: -
• RF Type: Cellular, GSM, EDGE, CDMA
• Voltage - Supply: 26V
• Current - Supply: 80mA
• Test Frequency: -
• Package / Case: TO-272-16 Variant, Flat Leads
• Supplier Device Package: TO-272 WB-16

paquet: TO-272-16 Variant, Flat Leads

MML09212HT1

NXP

IC LNA AMP E-PHEMT 12QFN

• Frequency: 400MHz ~ 1.4GHz
• P1dB: 22.8dBm
• Gain: 37.5dB
• Noise Figure: 0.52dB
• RF Type: GSM, LTE, W-CDMA
• Voltage - Supply: 5V
• Current - Supply: 150mA
• Test Frequency: 900MHz
• Package / Case: 12-VFQFN Exposed Pad
• Supplier Device Package: 12-QFN (3x3)

paquet: 12-VFQFN Exposed Pad

MC33FS6500LAE

NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP Exposed Pad

MC33MR2001TVKR2

NXP

IC TX 77GHZ RADAR AUTO 89VFBGA

• Type: -
• Protocol: -
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

SPC5633MF2MLQ80

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z3
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 80
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
• Data Converters: A/D 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

S912XEG128BVAAR

NXP

16-BIT MCU S12X CORE 128KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

paquet: 80-QFP

TJA1051T-3-2Z

NXP

IC TRANSCEIVER 1/1 8SO

• Type: Transceiver
• Protocol: CANbus
• Number of Drivers/Receivers: 1/1
• Duplex: -
• Receiver Hysteresis: 120 mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

paquet: -

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FS32K144UAT0VMHR

NXP

IC MCU 32B 512KB FLASH 100MAPBGA

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit Single-Core
• Speed: 112MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 89
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 16x12b SAR; D/A1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LFBGA
• Supplier Device Package: 100-MAPBGA (11x11)

paquet: -

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SPC5775KK2MMY3AR

NXP

IC MCU 4MB FLASH 356MAPBGA

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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SAF4000EL-103Q234Y

NXP

IC

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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FS32K118LFT0VLFR

NXP

IC MCU 32BIT 256KB FLASH 48LQFP

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 48MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: DMA, PWM, WDT
• Number of I/O: 43
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 25K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 16x12b SAR; D/A1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: -

Request a Quote