Page 568 - Produits NXP | Heisener Electronics

Référence	Fabricant	Description	paquet	Stock
MRF6VP41KHR5	NXP	FET RF 2CH 110V 450MHZ NI1230 Transistor Type: LDMOS (Dual) Frequency: 450MHz Gain: 20dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 150mA Power - Output: 1000W Voltage - Rated: 110V Package / Case: NI-1230 Supplier Device Package: NI-1230	paquet: NI-1230	Stock3 680
LD6935L/2828HX	NXP	IC REG LIN 2.8/2.8V 8DFN Output Configuration: Positive Output Type: Fixed Number of Regulators: 2 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.8V, 2.8V Voltage - Output (Max): - Voltage Dropout (Max): 0.24V @ 300mA (Typ), 0.24V @ 300mA (Typ) Current - Output: 300mA, 300mA Current - Quiescent (Iq): - Current - Supply (Max): 50µA PSRR: 80dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature, Soft Start Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 8-XFDFN Exposed Pad Supplier Device Package: 8-DFN (1.6x1.2)	paquet: 8-XFDFN Exposed Pad	Stock5 760
LD6806F/30P,115	NXP	IC REG LINEAR 3V 200MA 6-XSON Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 3V Voltage - Output (Max): - Voltage Dropout (Max): 0.13V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT886 (1.45x1)	paquet: 6-XFDFN	Stock5 136
NTS0101GS,132	NXP	TXRX TRANSLATING DUAL X2SON6 Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 1 Voltage - VCCA: 1.65V ~ 3.6V Voltage - VCCB: 2.3V ~ 5.5V Input Signal: - Output Signal: - Output Type: Open Drain, Tri-State Data Rate: 50Mbps Operating Temperature: -40°C ~ 125°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT1202 (1x1)	paquet: 6-XFDFN	Stock52 674
74HC595N,112	NXP	IC SHIFT REGISTER 8BIT 16DIP Logic Type: Shift Register Output Type: Tri-State Number of Elements: 1 Number of Bits per Element: 8 Function: Serial to Parallel, Serial Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	paquet: 16-DIP (0.300", 7.62mm)	Stock6 896
HEC4093BT,118	NXP	IC GATE NAND 4CH 2-INP 14-SO Logic Type: NAND Gate Number of Circuits: 4 Number of Inputs: 2 Features: Schmitt Trigger Voltage - Supply: 3 V ~ 15 V Current - Quiescent (Max): 1µA Current - Output High, Low: 3.4mA, 3.4mA Logic Level - Low: 1.5 V ~ 4 V Logic Level - High: 3.5 V ~ 11 V Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width)	paquet: 14-SOIC (0.154", 3.90mm Width)	Stock5 088
74LVT10D,112	NXP	IC GATE NAND 3CH 3-INP 14-SO Logic Type: NAND Gate Number of Circuits: 3 Number of Inputs: 3 Features: - Voltage - Supply: 2.7 V ~ 3.6 V Current - Quiescent (Max): - Current - Output High, Low: 20mA, 32mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 3.8ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width)	paquet: 14-SOIC (0.154", 3.90mm Width)	Stock4 960
TDA8954J/N1,112	NXP	IC AMP AUD CLASS D 2X210W DBS23 Type: Class D Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 420W x 1 @ 8 Ohm; 210W x 2 @ 4 Ohm Voltage - Supply: ±12.5 V ~ 42.5 V Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: DBS23P Package / Case: 23-SIP Formed Leads	paquet: 23-SIP Formed Leads	Stock7 696
PTN3355BS/F3MP	NXP	IC DISPLAYPORT TO VGA 40HVQFN Applications: DisplayPort Interface: - Voltage - Supply: 3.3V Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6) Mounting Type: Surface Mount	paquet: 40-VFQFN Exposed Pad	Stock2 928
TJA1028T/3V3/20:11	NXP	IC LIN TRANSCEIVER 8-SO Type: Transceiver Protocol: LIN Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: 200mV Data Rate: - Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	paquet: 8-SOIC (0.154", 3.90mm Width)	Stock3 904
MPC8349EVVAGD	NXP	IC MPU MPC83XX 400MHZ 672TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 672-LBGA Supplier Device Package: 672-TBGA (35x35)	paquet: 672-LBGA	Stock7 936
KMPC8540PX667LB	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 784-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	paquet: 784-BBGA, FCBGA	Stock3 776
MCF5282CVM66J	NXP	IC MCU 32BIT 512KB FLASH 256BGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 150 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	paquet: 256-LBGA	Stock7 488
MC908GR48ACFJE	NXP	IC MCU 8BIT 48KB FLASH 32LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 21 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1.5K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 24x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	paquet: 32-LQFP	Stock3 248
SPC561MVR56D	NXP	IC MCU 32BIT ROMLESS 388PBGA Core Processor: PowerPC Core Size: 32-Bit Speed: 56MHz Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 64 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V Data Converters: A/D 32x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27)	paquet: 388-BBGA	Stock8 376
MKE02Z64VLD4	NXP	IC MCU 32BIT 64KB FLASH 44LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 40MHz Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 37 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	paquet: 44-LQFP	Stock23 424
MSC8156SVT1000B	NXP	IC PROCESSOR QUAD DGTL 783FCBGA Type: SC3850 Six Core Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Operating Temperature: 0°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	paquet: 783-BBGA, FCBGA	Stock19 500
PESD5V0U1UCL,315	NXP	TVS DIODE SOD882 Type: - Unidirectional Channels: - Bidirectional Channels: - Voltage - Reverse Standoff (Typ): - Voltage - Breakdown (Min): - Voltage - Clamping (Max) @ Ipp: - Current - Peak Pulse (10/1000µs): - Power - Peak Pulse: - Power Line Protection: - Applications: - Capacitance @ Frequency: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Stock8 982
SX8452QR1	NXP	ACCELEROMETER 3AXIS 12BIT 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Stock6 534
HT2MOA4S20/E/3/RJ	NXP	IC HITAG2 MOD MOA2 PLLMC Type: RFID Transponder Frequency: 125kHz Standards: ISO 11784, ISO 11785 Interface: - Voltage - Supply: 6.5V Operating Temperature: - Package / Case: MOA4, Smart Card Module Supplier Device Package: PLLMC	paquet: MOA4, Smart Card Module	Stock3 582
OM7697/BGU7007,598	NXP	RF EVAL FOR BGU7007 Type: Amplifier, GPS Frequency: 1575.42MHz For Use With/Related Products: BGU7007 Supplied Contents: Board	paquet: -	Stock6 732
BGA3131J	NXP	IC MMIC AMP 20HVQFN Frequency: - P1dB: - Gain: - Noise Figure: - RF Type: - Voltage - Supply: - Current - Supply: - Test Frequency: - Package / Case: - Supplier Device Package: -	paquet: -	Stock2 106
MKV10Z32VFM7R	NXP	KINETIS KV10: 75MHZ CORTEX-M0+ R Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 75MHz Connectivity: I²C, SPI, UART/USART Peripherals: DMA, WDT Number of I/O: 28 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 16x12b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN	paquet: 32-VFQFN Exposed Pad	Stock3 872
PNX9530E/V120,518	NXP	IC MEDIA PROCESSOR Applications: Multimedia Core Processor: TriMedia™ Program Memory Type: - Controller Series: Nexperia RAM Size: - Interface: GPIO, Host Interface, I²C, PCI, USB, XIO Number of I/O: 8 Voltage - Supply: 1.16V ~ 1.24V, 3.15V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-BGA Supplier Device Package: 456-PBGA (27x27)	paquet: 456-BGA	Stock5 056
MC33FS6527NAER2	NXP	SYSTEM BASIS CHIP, DCDC 2.2A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	paquet: -	Request a Quote
LPC55S26JBD100K	NXP	IC MCU 32BIT 256KB FLSH 100HLQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 144K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-HLQFP (14x14)	paquet: -	Stock1 980
MHTG1200HSR3	NXP	RF MOSFET GAN NI780 Transistor Type: GaN Frequency: 2.4GHz ~ 2.5GHz Gain: - Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: 300W Voltage - Rated: 50 V Package / Case: NI-780S-4L Supplier Device Package: NI-780S-4L	paquet: -	Request a Quote
S9S12GN16J0MLFR	NXP	IC MCU 16BIT 16KB FLASH 48LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	paquet: -	Request a Quote

MRF6VP41KHR5

NXP

FET RF 2CH 110V 450MHZ NI1230

Transistor Type: LDMOS (Dual)
Frequency: 450MHz
Gain: 20dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 150mA
Power - Output: 1000W
Voltage - Rated: 110V
Package / Case: NI-1230
Supplier Device Package: NI-1230

paquet: NI-1230

Stock3 680

LD6935L/2828HX

NXP

IC REG LIN 2.8/2.8V 8DFN

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 2
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2.8V, 2.8V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.24V @ 300mA (Typ), 0.24V @ 300mA (Typ)
Current - Output: 300mA, 300mA
Current - Quiescent (Iq): -
Current - Supply (Max): 50µA
PSRR: 80dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature, Soft Start
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 8-XFDFN Exposed Pad
Supplier Device Package: 8-DFN (1.6x1.2)

paquet: 8-XFDFN Exposed Pad

Stock5 760

LD6806F/30P,115

NXP

IC REG LINEAR 3V 200MA 6-XSON

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 3V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.13V @ 200mA
Current - Output: 200mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Supplier Device Package: 6-XSON, SOT886 (1.45x1)

paquet: 6-XFDFN

Stock5 136

NTS0101GS,132

NXP

TXRX TRANSLATING DUAL X2SON6

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 1
Voltage - VCCA: 1.65V ~ 3.6V
Voltage - VCCB: 2.3V ~ 5.5V
Input Signal: -
Output Signal: -
Output Type: Open Drain, Tri-State
Data Rate: 50Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Features: Auto-Direction Sensing
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Supplier Device Package: 6-XSON, SOT1202 (1x1)

paquet: 6-XFDFN

Stock52 674

74HC595N,112

NXP

IC SHIFT REGISTER 8BIT 16DIP

Logic Type: Shift Register
Output Type: Tri-State
Number of Elements: 1
Number of Bits per Element: 8
Function: Serial to Parallel, Serial
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

paquet: 16-DIP (0.300", 7.62mm)

Stock6 896

HEC4093BT,118

NXP

IC GATE NAND 4CH 2-INP 14-SO

Logic Type: NAND Gate
Number of Circuits: 4
Number of Inputs: 2
Features: Schmitt Trigger
Voltage - Supply: 3 V ~ 15 V
Current - Quiescent (Max): 1µA
Current - Output High, Low: 3.4mA, 3.4mA
Logic Level - Low: 1.5 V ~ 4 V
Logic Level - High: 3.5 V ~ 11 V
Max Propagation Delay @ V, Max CL: 60ns @ 15V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Package / Case: 14-SOIC (0.154", 3.90mm Width)

paquet: 14-SOIC (0.154", 3.90mm Width)

Stock5 088

74LVT10D,112

NXP

IC GATE NAND 3CH 3-INP 14-SO

Logic Type: NAND Gate
Number of Circuits: 3
Number of Inputs: 3
Features: -
Voltage - Supply: 2.7 V ~ 3.6 V
Current - Quiescent (Max): -
Current - Output High, Low: 20mA, 32mA
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 3.8ns @ 3.3V, 50pF
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Package / Case: 14-SOIC (0.154", 3.90mm Width)

paquet: 14-SOIC (0.154", 3.90mm Width)

Stock4 960

TDA8954J/N1,112

NXP

IC AMP AUD CLASS D 2X210W DBS23

Type: Class D
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Max Output Power x Channels @ Load: 420W x 1 @ 8 Ohm; 210W x 2 @ 4 Ohm
Voltage - Supply: ±12.5 V ~ 42.5 V
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: DBS23P
Package / Case: 23-SIP Formed Leads

paquet: 23-SIP Formed Leads

Stock7 696

PTN3355BS/F3MP

NXP

IC DISPLAYPORT TO VGA 40HVQFN

Applications: DisplayPort
Interface: -
Voltage - Supply: 3.3V
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)
Mounting Type: Surface Mount

paquet: 40-VFQFN Exposed Pad

Stock2 928

TJA1028T/3V3/20:11

NXP

IC LIN TRANSCEIVER 8-SO

Type: Transceiver
Protocol: LIN
Number of Drivers/Receivers: 1/1
Duplex: Full
Receiver Hysteresis: 200mV
Data Rate: -
Voltage - Supply: 5.5 V ~ 28 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

Stock3 904

MPC8349EVVAGD

NXP

IC MPU MPC83XX 400MHZ 672TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 672-LBGA
Supplier Device Package: 672-TBGA (35x35)

paquet: 672-LBGA

Stock7 936

KMPC8540PX667LB

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: -
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

paquet: 784-BBGA, FCBGA

Stock3 776

MCF5282CVM66J

NXP

IC MCU 32BIT 512KB FLASH 256BGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 150
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

paquet: 256-LBGA

Stock7 488

MC908GR48ACFJE

NXP

IC MCU 8BIT 48KB FLASH 32LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 21
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1.5K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 24x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

Stock3 248

SPC561MVR56D

NXP

IC MCU 32BIT ROMLESS 388PBGA

Core Processor: PowerPC
Core Size: 32-Bit
Speed: 56MHz
Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 64
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
Data Converters: A/D 32x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 388-BBGA
Supplier Device Package: 388-PBGA (27x27)

paquet: 388-BBGA

Stock8 376

MKE02Z64VLD4

NXP

IC MCU 32BIT 64KB FLASH 44LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 40MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Number of I/O: 37
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 2x6b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

paquet: 44-LQFP

Stock23 424

MSC8156SVT1000B

NXP

IC PROCESSOR QUAD DGTL 783FCBGA

Type: SC3850 Six Core
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Clock Rate: 1GHz
Non-Volatile Memory: ROM (96 kB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Operating Temperature: 0°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

Stock19 500

PESD5V0U1UCL,315

NXP

TVS DIODE SOD882

Type: -
Unidirectional Channels: -
Bidirectional Channels: -
Voltage - Reverse Standoff (Typ): -
Voltage - Breakdown (Min): -
Voltage - Clamping (Max) @ Ipp: -
Current - Peak Pulse (10/1000µs): -
Power - Peak Pulse: -
Power Line Protection: -
Applications: -
Capacitance @ Frequency: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock8 982

SX8452QR1

NXP

ACCELEROMETER 3AXIS 12BIT 16QFN

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock6 534

HT2MOA4S20/E/3/RJ

NXP

IC HITAG2 MOD MOA2 PLLMC

Type: RFID Transponder
Frequency: 125kHz
Standards: ISO 11784, ISO 11785
Interface: -
Voltage - Supply: 6.5V
Operating Temperature: -
Package / Case: MOA4, Smart Card Module
Supplier Device Package: PLLMC

paquet: MOA4, Smart Card Module

Stock3 582

OM7697/BGU7007,598

NXP

RF EVAL FOR BGU7007

Type: Amplifier, GPS
Frequency: 1575.42MHz
For Use With/Related Products: BGU7007
Supplied Contents: Board

paquet: -

Stock6 732

BGA3131J

NXP

IC MMIC AMP 20HVQFN

Frequency: -
P1dB: -
Gain: -
Noise Figure: -
RF Type: -
Voltage - Supply: -
Current - Supply: -
Test Frequency: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock2 106

MKV10Z32VFM7R

NXP

KINETIS KV10: 75MHZ CORTEX-M0+ R

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 75MHz
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, WDT
Number of I/O: 28
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 16x12b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN

paquet: 32-VFQFN Exposed Pad

Stock3 872

PNX9530E/V120,518

NXP

IC MEDIA PROCESSOR

Applications: Multimedia
Core Processor: TriMedia™
Program Memory Type: -
Controller Series: Nexperia
RAM Size: -
Interface: GPIO, Host Interface, I²C, PCI, USB, XIO
Number of I/O: 8
Voltage - Supply: 1.16V ~ 1.24V, 3.15V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 456-BGA
Supplier Device Package: 456-PBGA (27x27)

paquet: 456-BGA

Stock5 056

MC33FS6527NAER2

NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

paquet: -

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LPC55S26JBD100K

NXP

IC MCU 32BIT 256KB FLSH 100HLQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 144K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-HLQFP (14x14)

paquet: -

Stock1 980

MHTG1200HSR3

NXP

RF MOSFET GAN NI780

Transistor Type: GaN
Frequency: 2.4GHz ~ 2.5GHz
Gain: -
Voltage - Test: -
Current Rating: -
Noise Figure: -
Current - Test: -
Power - Output: 300W
Voltage - Rated: 50 V
Package / Case: NI-780S-4L
Supplier Device Package: NI-780S-4L

paquet: -

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S9S12GN16J0MLFR

NXP

IC MCU 16BIT 16KB FLASH 48LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

paquet: -

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