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Produits NXP

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BAP142LX,315
NXP

DIODE SILICON PIN SOD-882T

  • Diode Type: PIN - Single
  • Voltage - Peak Reverse (Max): 50V
  • Current - Max: 100mA
  • Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz
  • Resistance @ If, F: 1.3 Ohm @ 100mA, 100MHz
  • Power Dissipation (Max): 130mW
  • Operating Temperature: -65°C ~ 150°C (TJ)
  • Package / Case: SOD-882
  • Supplier Device Package: SOD2
paquet: SOD-882
Stock3 936
PIP3201-A,127
NXP

TOPFET LOGIC LVL 50V TO220-5

  • Switch Type: General Purpose
  • Number of Outputs: 1
  • Ratio - Input:Output: 1:1
  • Output Configuration: High Side
  • Output Type: N-Channel
  • Interface: On/Off
  • Voltage - Load: 5.5 V ~ 35 V
  • Voltage - Supply (Vcc/Vdd): Not Required
  • Current - Output (Max): 20A
  • Rds On (Typ): 28 mOhm
  • Input Type: Non-Inverting
  • Features: -
  • Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
  • Operating Temperature: -
  • Package / Case: TO-220-5 Formed Leads
  • Supplier Device Package: SOT263-01
paquet: TO-220-5 Formed Leads
Stock2 720
MC33GD3000EPR2
NXP

TRANSISTOR PRE-DRIVER 3-PHASE

  • Motor Type - Stepper: -
  • Motor Type - AC, DC: -
  • Function: Controller - Commutation, Direction Management
  • Output Configuration: Half Bridge (3)
  • Interface: SPI
  • Technology: Power MOSFET
  • Step Resolution: -
  • Applications: Automotive
  • Current - Output: -
  • Voltage - Supply: 6 V ~ 58 V
  • Voltage - Load: 6 V ~ 58 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN (8x8)
paquet: 56-VFQFN Exposed Pad
Stock3 424
PCA9550DP,118
NXP

IC LED DRVR LIN DIM 25MA 8TSSOP

  • Type: Linear
  • Topology: -
  • Internal Switch(s): Yes
  • Number of Outputs: 2
  • Voltage - Supply (Min): 2.3V
  • Voltage - Supply (Max): 5.5V
  • Voltage - Output: -
  • Current - Output / Channel: 25mA
  • Frequency: 400kHz
  • Dimming: I2C
  • Applications: -
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Supplier Device Package: 8-TSSOP
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Stock3 504
74LVC241ADB,118
NXP

IC BUFF/DVR TRI-ST DUAL 20SSOP

  • Logic Type: Buffer, Non-Inverting
  • Number of Elements: 2
  • Number of Bits per Element: 4
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 24mA, 24mA
  • Voltage - Supply: 1.2 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 20-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 20-SSOP
paquet: 20-SSOP (0.209", 5.30mm Width)
Stock4 192
74LV125DB,112
NXP

IC BUFF DVR TRI-ST QUAD 14SSOP

  • Logic Type: Buffer, Non-Inverting
  • Number of Elements: 4
  • Number of Bits per Element: 1
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 16mA, 16mA
  • Voltage - Supply: 1 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 14-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 14-SSOP
paquet: 14-SSOP (0.209", 5.30mm Width)
Stock3 840
PC34CM0902WEF
NXP

DUAL CAN HS 14SOIC

  • Applications: -
  • Interface: -
  • Voltage - Supply: -
  • Package / Case: -
  • Supplier Device Package: -
  • Mounting Type: -
paquet: -
Stock3 952
UJA1069TW24/3V3,51
NXP

IC LIN FAIL-SAFE 24-HTSSOP

  • Applications: Automotive
  • Interface: LIN (Local Interconnect Network)
  • Voltage - Supply: 3.3V
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad
  • Supplier Device Package: 24-HTSSOP
  • Mounting Type: Surface Mount
paquet: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad
Stock4 864
UJA1061TW/5V0/C/T/
NXP

IC CAN/LIN FAIL-SAFE HS 32HTSSOP

  • Applications: Automotive Networking
  • Interface: CAN, LIN
  • Voltage - Supply: 5.5 V ~ 27 V
  • Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
  • Supplier Device Package: 32-HTSSOP
  • Mounting Type: Surface Mount
paquet: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Stock5 360
SJA1000T/N1,112
NXP

IC STAND-ALONE CAN CTRLR 28-SOIC

  • Protocol: CAN
  • Function: Controller
  • Interface: Parallel
  • Standards: CAN 2.0
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Current - Supply: 15mA
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 28-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 28-SO
paquet: 28-SOIC (0.295", 7.50mm Width)
Stock13 308
MPC8308VMAFF
NXP

IC MPU MPC83XX 333MHZ 473MAPBGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 333MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 473-LFBGA
  • Supplier Device Package: 473-MAPBGA (19x19)
paquet: 473-LFBGA
Stock5 536
PPC8306SVMABDCA
NXP

IC MPU MPC83XX 133MHZ 369BGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 133MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 369-LFBGA
  • Supplier Device Package: 369-PBGA (19x19)
paquet: 369-LFBGA
Stock6 192
KMPC8360ZUAHFH
NXP

IC MPU MPC83XX 500MHZ 740TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 500MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 740-LBGA
  • Supplier Device Package: 740-TBGA (37.5x37.5)
paquet: 740-LBGA
Stock7 056
MPC8572ECVJARLE
NXP

IC MPU MPC85XX 1.067GHZ 1023BGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.067GHz
  • Co-Processors/DSP: Signal Processing; SPE, Security; SEC
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 1023-BBGA, FCBGA
  • Supplier Device Package: 1023-FCPBGA (33x33)
paquet: 1023-BBGA, FCBGA
Stock3 936
P1010NSE5FFB
NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Security; SEC 4.4
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
  • Package / Case: 425-FBGA
  • Supplier Device Package: 425-TEPBGA I (19x19)
paquet: 425-FBGA
Stock6 448
PK40N512VLQ100
NXP

IC MCU 32BIT 512KB FLASH 144LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
  • Number of I/O: 98
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 27x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
paquet: 144-LQFP
Stock2 320
LPC4353JET256,551
NXP

IC MCU 32BIT 512KB FLASH 256LBGA

  • Core Processor: ARM? Cortex?-M4/M0
  • Core Size: 32-Bit Dual-Core
  • Speed: 204MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
  • Number of I/O: 164
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 16K x 8
  • RAM Size: 136K x 8
  • Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
  • Data Converters: A/D 8x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-LBGA (17x17)
paquet: 256-LBGA
Stock2 912
hot MK40DX256VLK7
NXP

IC MCU 32BIT 256KB FLASH 80LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 72MHz
  • Connectivity: CAN, I2C, IrDA, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
  • Number of I/O: 52
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 27x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 80-LQFP
  • Supplier Device Package: 80-LQFP (12x12)
paquet: 80-LQFP
Stock11 532
MKL25Z128VFT4
NXP

IC MCU 32BIT 128KB FLASH 48QFN

  • Core Processor: ARM? Cortex?-M0+
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
  • Number of I/O: 36
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 13x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
paquet: 48-VFQFN Exposed Pad
Stock7 716
hot MSC8101M1250F
NXP

DSP 16BIT 250MHZ CPM 332FCBGA

  • Type: SC140 Core
  • Interface: Communications Processor Module (CPM)
  • Clock Rate: 250MHz
  • Non-Volatile Memory: External
  • On-Chip RAM: 512kB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 1.60V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 332-BFBGA, FCPBGA
  • Supplier Device Package: 332-FCBGA (17x17)
paquet: 332-BFBGA, FCPBGA
Stock3 680
MMA2241KEGR2
NXP

ACCELEROMETER 10G ANALOG 16SOIC

  • Type: Analog
  • Axis: X
  • Acceleration Range: ±10g
  • Sensitivity (LSB/g): -
  • Sensitivity (mV/g): 200
  • Bandwidth: 400Hz
  • Output Type: Analog Voltage
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Features: -
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 16-SOIC
paquet: 16-SOIC (0.295", 7.50mm Width)
Stock6 678
PN5120A0ET/C2QL
NXP

IC TRANSMISSION MOD 64TFBGA

  • Type: RFID Reader/Transponder
  • Frequency: 13.56MHz
  • Standards: FeliCa, ISO 14443, MIFARE, NFC
  • Interface: I2C, SPI, UART
  • Voltage - Supply: 2.5 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 90°C
  • Package / Case: 64-TFBGA
  • Supplier Device Package: 64-TFBGA (5x5)
paquet: 64-TFBGA
Stock5 400
TFF1044HN/N1Y
NXP

IC MIXER OSC PLL LNB 36HVLGA

  • RF Type: -
  • Frequency: -
  • Number of Mixers: -
  • Gain: -
  • Noise Figure: -
  • Secondary Attributes: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock4 860
MC33772BSA2AE
NXP

BCC6

  • Function: Battery Cell Controller
  • Battery Chemistry: Lithium-Ion
  • Number of Cells: 3 ~ 6
  • Fault Protection: Over/Under Voltage
  • Interface: SPI
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 440
FS32R274KSK2MMM
NXP

IC SRAM 2M FLASH 257MAPBGA

  • Core Processor: e200z4, e200z7 (2)
  • Core Size: 32-Bit Tri-Core
  • Speed: 180MHz, 240MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
  • Peripherals: POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 1.5M x 8
  • Voltage - Supply (Vcc/Vdd): 1.19 V ~ 5.5 V
  • Data Converters: A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-MAPBGA (14x14)
paquet: 257-LFBGA
Stock4 112
SAF7754HV/N205K
NXP

DSP AUDIO MULTI-TUNER

  • Type: -
  • Interface: -
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: -
  • Voltage - Core: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 120
MCIMX6G1AVM05ABR
NXP

IC MPU I.MX6G 528MHZ 289MAPBGA

  • Core Processor: ARM® Cortex®-A7
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 528MHz
  • Co-Processors/DSP: Multimedia; NEON™ SIMD
  • RAM Controllers: DDR3, DDR3L, LPDDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: LVDS
  • Ethernet: 10/100Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
  • Package / Case: 289-LFBGA
  • Supplier Device Package: 289-MAPBGA (14x14)
paquet: -
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SAF775CHN-N208WBMP
NXP

CAR DISP

  • Type: -
  • Interface: -
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: -
  • Voltage - Core: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote