Produits NXP

ON5213,118

NXP

MOSFET RF SOT426 D2PAK

• Transistor Type: -
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: -
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: -
• Package / Case: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB
• Supplier Device Package: SOT-426

paquet: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB

BC847BT,115

NXP

TRANS NPN 45V 0.1A SOT416

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 45V
• Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
• Current - Collector Cutoff (Max): 15nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
• Power - Max: 150mW
• Frequency - Transition: 100MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-75, SOT-416
• Supplier Device Package: SC-75

paquet: SC-75, SOT-416

PBSS8110S,126

NXP

TRANS NPN 100V 1A TO92

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 1A
• Voltage - Collector Emitter Breakdown (Max): 100V
• Vce Saturation (Max) @ Ib, Ic: 200mV @ 100mA, 1A
• Current - Collector Cutoff (Max): 100nA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 250mA, 10V
• Power - Max: 830mW
• Frequency - Transition: 100MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

paquet: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

PZM3.9NB,115

NXP

DIODE ZENER 3.9V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 3.9V
• Tolerance: ±5%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 90 Ohms
• Current - Reverse Leakage @ Vr: 3µA @ 1V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

paquet: TO-236-3, SC-59, SOT-23-3

BB181LX,315

NXP

DIODE VHF VAR CAP 32V SOD882

• Capacitance @ Vr, F: 1.055pF @ 28V, 1MHz
• Capacitance Ratio: 16
• Capacitance Ratio Condition: C0.5/C28
• Voltage - Peak Reverse (Max): 32V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SOD-882
• Supplier Device Package: SOD-882T

paquet: SOD-882

SSTUH32864EC,518

NXP

IC BUFFER 1.8V 1/14BIT SOT536-1

• Logic Type: 1:2 Configurable Registered Buffer
• Supply Voltage: 1.7 V ~ 1.9 V
• Number of Bits: 25, 14
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Supplier Device Package: 96-LFBGA (13.5x5.5)

paquet: 96-LFBGA

74HC4094N,652

NXP

IC REGISTER BUS 8STAGE 16DIP

• Logic Type: Shift Register
• Output Type: Tri-State
• Number of Elements: 1
• Number of Bits per Element: 8
• Function: Serial to Parallel, Serial
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

paquet: 16-DIP (0.300", 7.62mm)

74HC9114N,112

NXP

IC NINE-WIDE SCHMITT TRIG 20-DIP

• Logic Type: Inverter
• Number of Circuits: 9
• Number of Inputs: 9
• Features: Schmitt Trigger, Open Drain
• Voltage - Supply: 2 V ~ 6 V
• Current - Quiescent (Max): 8µA
• Current - Output High, Low: -, 5.2mA
• Logic Level - Low: -
• Logic Level - High: 1.5 V ~ 4.2 V
• Max Propagation Delay @ V, Max CL: 19ns @ 6V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Supplier Device Package: 20-DIP
• Package / Case: 20-DIP (0.300", 7.62mm)

paquet: 20-DIP (0.300", 7.62mm)

I74F657N,112

NXP

IC TRANSCVR 8BIT N-INV 24DIP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 3mA, 24mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Through Hole
• Package / Case: 24-DIP (0.300", 7.62mm)
• Supplier Device Package: 24-DIP

paquet: 24-DIP (0.300", 7.62mm)

NVT4556AUKZ

NXP

IC LEVEL TRANSLATOR SIM 12WLCSP

• Applications: SIM Card
• Interface: I2C
• Voltage - Supply: 1.55 V ~ 3.6 V
• Package / Case: 12-XFBGA
• Supplier Device Package: 12-WLCSP (1.20x1.60)
• Mounting Type: Surface Mount

paquet: 12-XFBGA

PCA9674AD,518

NXP

IC I/O EXPANDER I2C 8B 16SOIC

• Number of I/O: 8
• Interface: I2C
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 1MHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SO

paquet: 16-SOIC (0.295", 7.50mm Width)

MC145484ENR2

NXP

IC CODEC-FILTER PCM 5V 20-SSOP

• Type: PCM, Filter
• Data Interface: PCM Audio Interface
• Resolution (Bits): 13 b
• Number of ADCs / DACs: 1 / 1
• Sigma Delta: No
• S/N Ratio, ADCs / DACs (db) Typ: -
• Dynamic Range, ADCs / DACs (db) Typ: -
• Voltage - Supply, Analog: -
• Voltage - Supply, Digital: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

paquet: 20-SSOP (0.209", 5.30mm Width)

MPC8377CVRANGA

NXP

IC MPU MPC83XX 800MHZ 689TEBGA

• Core Processor: PowerPC e300c4s
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TA)
• Security Features: -
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

paquet: 689-BBGA Exposed Pad

MPC8313ECZQAGDC

NXP

IC MPU MPC83XX 400MHZ 516BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Security; SEC 2.2
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 516-BBGA Exposed Pad
• Supplier Device Package: 516-TEPBGA (27x27)

paquet: 516-BBGA Exposed Pad

MKL36Z256VLL4

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 84
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D - 16bit, D/A - 12bit
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

MCF51JM32VLH

NXP

IC MCU 32BIT 32KB FLASH 64LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, I2C, SCI, SPI, USB OTG
• Peripherals: LVD, PWM, WDT
• Number of I/O: 51
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

MPXV2202GC6U

NXP

PRESSURE SENSOR AXIAL 8-SOP

• Pressure Type: Vented Gauge
• Operating Pressure: 29.01 PSI (200 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 40 mV (10V)
• Accuracy: -
• Voltage - Supply: 10 V ~ 16 V
• Port Size: Male - 0.13" (3.17mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD, Gull Wing, Top Port
• Supplier Device Package: -

paquet: 8-SMD, Gull Wing, Top Port

MC33596FJER2

NXP

IC RX UHF PLL TUNED 32-LQFP

• Frequency: 304, 315, 426, 434, 868, 915MHz
• Sensitivity: -104dBm
• Data Rate (Max): 22.4 kBaud
• Modulation or Protocol: FSK, OOK
• Applications: General Data Transfer
• Current - Receiving: 10.3mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 2.7 V ~ 3.6 V, 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (5x5)

paquet: 32-LQFP

ON5089,115

NXP

RF IC TRANSPONDER

• Function: -
• Frequency: -
• RF Type: -
• Secondary Attributes: -
• Package / Case: SOT-343F
• Supplier Device Package: SOT-343F

paquet: SOT-343F

MC32PF1550A0EPR2

NXP

POWER MANAGEMENT IC: 3 BUCK REGS

• Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
• Current - Supply: -
• Voltage - Supply: 3.8 V ~ 7 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-QFN (5x5)

paquet: 40-VFQFN Exposed Pad

LS1020ASE7HNB

NXP

LS1 32BIT ARM SOC 800MHZ DDR3/

• Core Processor: ARM® Cortex®-A7
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: DDR3L, DDR4
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: GbE (3)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 (1), USB 3.0 + PHY
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C
• Security Features: -
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

paquet: 525-FBGA, FCBGA

MKL36Z256VMP4

NXP

KINETIS KL36: 48MHZ CORTEX-M0+ U

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 50
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D - 16bit, D/A - 12bit
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-LFBGA
• Supplier Device Package: 121-MAPBGA (8x8)

paquet: 121-LFBGA

FS32K148UAT0VMHT

NXP

S32K148 100 MAPBGA

• Core Processor: ARM® Cortex®-M4F
• Core Size: 32-Bit
• Speed: 112MHz
• Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
• Peripherals: I²S, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 32x12b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LBGA
• Supplier Device Package: 100-MAPBGA (11x11)

paquet: 100-LBGA

FX32K144HAT0MLLT

NXP

S32K144 ARM CORTEX-M4F, 80 MHZ,

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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SAF4000EL-101S235Y

NXP

SOFTWARE DEFINED RADIO

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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MIMX8QM6AVUFFAB

NXP

IC MPU 266MHZ/1.2/1.6GHZ 1313BGA

• Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
• Number of Cores/Bus Width: 2, 2, 4
• Speed: 266MHz, 1.2GHz, 1.6GHz
• Co-Processors/DSP: ARM® Cortex®-M4F
• RAM Controllers: LPDDR4, DRAM
• Graphics Acceleration: Yes
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: USB (3)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: -
• Package / Case: 1313-BFBGA
• Supplier Device Package: 1313-BGA (29x29)

paquet: -

MC33FS8420G0ES

NXP

SAFETY POWER MANAGEMENT IC, QFN5

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

paquet: -

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SAF7751HV-N205WY

NXP

DSP AUDIO MULTI-TUNER

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

Request a Quote