Produits NXP

MRFE6S9160HR3

NXP

FET RF 66V 880MHZ NI-780

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 21dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.2A
• Power - Output: 35W
• Voltage - Rated: 66V
• Package / Case: NI-780
• Supplier Device Package: NI-780

paquet: NI-780

MRF6S9160HSR3

NXP

FET RF 68V 880MHZ NI-780S

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 20.9dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.2A
• Power - Output: 35W
• Voltage - Rated: 68V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

paquet: NI-780S

MRFE6VP100HR5

NXP

FET RF 2CH 133V 512MHZ NI780

• Transistor Type: LDMOS
• Frequency: 512MHz
• Gain: 26dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 100mA
• Power - Output: 100W
• Voltage - Rated: 133V
• Package / Case: NI-780-4
• Supplier Device Package: NI-780-4

paquet: NI-780-4

MC10XS3535JHFK

NXP

IC SWITCH HIGH SIDE 24PQFN

• Switch Type: General Purpose
• Number of Outputs: 6
• Ratio - Input:Output: 1:6
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 7 V ~ 20 V
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Current - Output (Max): -
• Rds On (Typ): 10 mOhm (Max), 35 mOhm (Max)
• Input Type: -
• Features: Watchdog Timer
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 24-PowerQFN
• Supplier Device Package: 24-PQFN (12x12)

paquet: 24-PowerQFN

74ABT823PW,118

NXP

IC D-TYPE POS TRG SNGL 24TSSOP

• Function: Master Reset
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 9
• Clock Frequency: 200MHz
• Max Propagation Delay @ V, Max CL: 6.1ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 250µA
• Input Capacitance: 4pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)

paquet: 24-TSSOP (0.173", 4.40mm Width)

MC34018DWR2

NXP

IC SPEAKERPHONE VOICE SW 28-SOIC

• Function: Voice-Switched Speakerphone
• Interface: -
• Number of Circuits: 1
• Voltage - Supply: 5.4V
• Current - Supply: 9mA
• Power (Watts): 100mW
• Operating Temperature: -20°C ~ 60°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

paquet: 28-SOIC (0.295", 7.50mm Width)

NX3L1G53GM,125

NXP

IC SWITCH SPDT 8XQFN

• Switch Circuit: SPDT
• Multiplexer/Demultiplexer Circuit: 2:1
• Number of Circuits: 1
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): 20 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 24ns, 8ns
• -3db Bandwidth: 60MHz
• Charge Injection: 15pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -90dB @ 100kHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 8-XFQFN Exposed Pad
• Supplier Device Package: 8-XQFN (1.6x1.6)

paquet: 8-XFQFN Exposed Pad

NX3L2G384GM,125

NXP

IC ANALOG SWITCH SPST 8XQFN

• Switch Circuit: SPST - NC
• Multiplexer/Demultiplexer Circuit: 1:1
• Number of Circuits: 2
• On-State Resistance (Max): 750 mOhm
• Channel-to-Channel Matching (ΔRon): 20 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): 24ns, 7ns
• -3db Bandwidth: 60MHz
• Charge Injection: 6pC
• Channel Capacitance (CS(off), CD(off)): 35pF
• Current - Leakage (IS(off)) (Max): 10nA
• Crosstalk: -90dB @ 100kHz
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 8-XFQFN Exposed Pad
• Supplier Device Package: 8-XQFN (1.6x1.6)

paquet: 8-XFQFN Exposed Pad

MPC8548CVTAQGD

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

KMPC8347VVAJFB

NXP

IC MPU MPC83XX 533MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

paquet: 672-LBGA

MPC8535ECVJAKGA

NXP

IC MPU MPC85XX 600MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 600MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

MPC8250ACZQIHBC

NXP

IC MPU MPC82XX 200MHZ 516BGA

• Core Processor: PowerPC G2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 200MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

paquet: 516-BBGA

P87C58X2BBD,157

NXP

IC MCU 8BIT 32KB OTP 44LQFP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, UART/USART
• Peripherals: POR
• Number of I/O: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

paquet: 44-LQFP

MCF5253CVM140

NXP

IC MCU 32BIT ROMLESS 225MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 140MHz
• Connectivity: CAN, EBI/EMI, I2C, QSPI, UART/USART, USB OTG
• Peripherals: DMA, WDT
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.08 V ~ 1.32 V
• Data Converters: A/D 6x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 225-LFBGA
• Supplier Device Package: 225-MAPBGA (13x13)

paquet: 225-LFBGA

MCF5270CVM150

NXP

IC MCU 32BIT ROMLESS 196MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number of I/O: 97
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

paquet: 196-LBGA

S912XEG128J2MAL

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

paquet: 112-LQFP

S9S12G128F0CLH

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

MPX10DP

NXP

SENSOR DIFF PRESS 1.45 PSI MAX

• Pressure Type: Differential
• Operating Pressure: 1.45 PSI (10 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 35 mV (3V)
• Accuracy: ±1%
• Voltage - Supply: 3 V ~ 6 V
• Port Size: Male - 0.19" (4.93mm) Tube, Dual
• Port Style: Barbed
• Features: -
• Termination Style: PCB
• Maximum Pressure: 10.88 PSI (75 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 4-SIP Module
• Supplier Device Package: -

paquet: 4-SIP Module

SL2MOS2001DV,118

NXP

RFID I.CODE MOD MOA2 PLLMC

• Type: -
• Frequency: -
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

NT3H2211W0FT1X

NXP

IC RFID NFC 13.56MHZ 8SO

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443
• Interface: I2C
• Voltage - Supply: 3.3V
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

TEF6862HL/V1,518

NXP

IC RADIO SELECT TUNER 64LQFP

• Frequency: -
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM, FM, WB
• Applications: AM/FM Radio Receiver
• Current - Receiving: 101.9mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 8 V ~ 9 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

MC33FS6502LAE

NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP Exposed Pad

TJA1101AHN/0Z

NXP

PHY ETHERNET

• Type: -
• Protocol: -
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

SAF7751EL-N208ZY

NXP

CAR DSP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

Request a Quote

S32K341NHT0MPASR

NXP

S32K341, 1MB FLASH, 256KB RAM, A

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit
• Speed: 160MHz
• Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
• Peripherals: DMA, I2S, WDT
• Number of I/O: -
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128K x 8
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
• Data Converters: A/D 24x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-QFP
• Supplier Device Package: 100-MaxQFP (10x10)

paquet: -

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PCA9958HN-Q900Y

NXP

IC

• Translator Type: -
• Channel Type: -
• Number of Circuits: -
• Channels per Circuit: -
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: -
• Output Signal: -
• Output Type: -
• Data Rate: -
• Operating Temperature: -
• Features: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

Request a Quote

MGD3160AM315EKT

NXP

GATE DRIVERS GD3160

• Driven Configuration: High-Side
• Channel Type: Single
• Number of Drivers: 1
• Gate Type: IGBT, SiC MOSFET
• Voltage - Supply: 4.5V ~ 40V
• Logic Voltage - VIL, VIH: -
• Current - Peak Output (Source, Sink): 15A, 15A
• Input Type: Non-Inverting
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC

paquet: -

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MFS2630AMDA0ADR2

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

Request a Quote