Page 442 - Produits NXP | Heisener Electronics

Référence	Fabricant	Description	paquet	Stock
BLF6G27LS-100,118	NXP	TRANS PWR LDMOS SOT502 Transistor Type: LDMOS Frequency: 2.5GHz ~ 2.7GHz Gain: 17dB Voltage - Test: 28V Current Rating: 29A Noise Figure: - Current - Test: 900mA Power - Output: 14W Voltage - Rated: 65V Package / Case: SOT-502A Supplier Device Package: LDMOST	paquet: SOT-502A	Stock4 128
BF1212,215	NXP	MOSFET N-CH DUAL GATE 6V SOT143B Transistor Type: N-Channel Dual Gate Frequency: 400MHz Gain: 30dB Voltage - Test: 5V Current Rating: 30mA Noise Figure: 0.9dB Current - Test: 12mA Power - Output: - Voltage - Rated: 6V Package / Case: TO-253-4, TO-253AA Supplier Device Package: SOT-143B	paquet: TO-253-4, TO-253AA	Stock3 456
PBR941,215	NXP	TRANSISTOR NPN UHF 50MA SOT23 Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 10V Frequency - Transition: 8GHz Noise Figure (dB Typ @ f): 1.4dB ~ 2dB @ 1GHz ~ 2GHz Gain: - Power - Max: 360mW DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 5mA, 6V Current - Collector (Ic) (Max): 50mA Operating Temperature: 175°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	paquet: TO-236-3, SC-59, SOT-23-3	Stock3 520
TDA9886T/V5,112	NXP	IC IF-PLL DEMOD I2C-BUS 24-SOIC Type: Demodulator Applications: TV Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	paquet: 24-SOIC (0.295", 7.50mm Width)	Stock5 248
MPC8377CVRALG	NXP	IC MPU MPC83XX 667MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	paquet: 689-BBGA Exposed Pad	Stock6 208
MPC8358CVVADDE	NXP	IC MPU MPC83XX 266MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	paquet: 740-LBGA	Stock4 688
MPC8540CPX667JB	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 784-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	paquet: 784-BBGA, FCBGA	Stock5 904
KMPC8241LZQ200D	NXP	IC MPU MPC82XX 200MHZ 357BGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	paquet: 357-BBGA	Stock7 296
B4860NXE7QUMD	NXP	BASEBAND PROC PILOT REV 1.0 Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1/2.5 Gbps (4), 1/2.5/10 Gbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33x33)	paquet: 1020-BBGA, FCBGA	Stock4 848
MPC8308CZQADDA	NXP	IC MPU MPC83XX 266MHZ 473MAPBGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: - RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	paquet: 473-LFBGA	Stock5 104
MCF53012CQT240	NXP	IC MCU 32BIT ROMLESS 208LQFP Core Processor: Coldfire V3 Core Size: 32-Bit Speed: 240MHz Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB OTG Peripherals: DMA, PWM, WDT Number of I/O: 61 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 208-LQFP Supplier Device Package: 208-LQFP (28x28)	paquet: 208-LQFP	Stock5 904
LPC2134FBD64,151	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: ARM7? Core Size: 16/32-Bit Speed: 60MHz Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Number of I/O: 47 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 16x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	paquet: 64-LQFP	Stock2 192
MC68332GMEH20	NXP	IC MCU 32BIT ROMLESS 132QFP Core Processor: CPU32 Core Size: 32-Bit Speed: 20MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 15 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (24.13x24.13)	paquet: 132-BQFP Bumpered	Stock5 184
S9S08SG8E2MTGR	NXP	IC MCU 8BIT 8KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 12 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	paquet: 16-TSSOP (0.173", 4.40mm Width)	Stock6 672
TEF6607T/V5,518	NXP	IC TUNER CAR RADIO AM/FM 32SO Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM Applications: AM/FM Radio Receiver Current - Receiving: - Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 8.5V Operating Temperature: - Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SO	paquet: 32-SOIC (0.295", 7.50mm Width)	Stock4 302
UJA1079ATW/5V0/1J	NXP	IC SBC LIN Applications: Automotive Interface: SPI Serial Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	paquet: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	Stock3 392
LS2048ASE7V1B	NXP	LS2048A - STD TEMP, W/ENCRYPT, 2 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	paquet: -	Stock6 800
MCIMX6DP4AVT8AB	NXP	IC MPU I.MX6DP ENHAN 624FCBGA Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 852MHZ Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3L, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	paquet: 624-FBGA, FCBGA	Stock6 080
S9S12VRP64F0VLF	NXP	64K FLASH, 6K RAM Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	paquet: 48-LQFP	Stock21 180
SP5744BBK1AMMH2R	NXP	SINGLE CORE 1.5M FLASH 192K RA Core Processor: e200z4 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, I²S, POR, WDT Number of I/O: - Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LBGA Supplier Device Package: 100-MAPBGA (11x11)	paquet: 100-LBGA	Stock2 544
MCIMX7U5CVP06SC	NXP	IC I.MX 7ULP MAPBGA 393 Core Processor: ARM® Cortex®-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 650MHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Ethernet: - SATA: - USB: USB 2.0 (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot Package / Case: - Supplier Device Package: -	paquet: -	Stock5 552
MM912I637AV1EP-NXP	NXP	BATTERY SENSOR, LIN, 96KB FLASH, Applications: - Core Processor: HCS12 Program Memory Type: FLASH (48kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, PWM, SCI, SPI Number of I/O: 14 Voltage - Supply: 2.25V ~ 5.25V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	paquet: -	Request a Quote
MVR5510AMDA0ESR2	NXP	IC PMIC VR5510 ASIL-D Applications: - Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	paquet: -	Request a Quote
SAF4000EL-101Z231K	NXP	SAF4000EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	paquet: -	Request a Quote
MC9S08RX32AFE	NXP	IC MCU 8BIT 32KB FLASH 64QFN Core Processor: S08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LVD, POR, PWM, WDT Number of I/O: - Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 64-VFQFN Exposed Pad Supplier Device Package: 64-QFN-EP (9x9)	paquet: -	Request a Quote
K32L2B21VFT0AR	NXP	K32 L2B, 48QFN Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 14x16b SAR; D/A 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-UFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	paquet: -	Request a Quote
MWCT1016SFVMH	NXP	WCT1016 100MAPBGA Applications: Wireless Power Transmitter Current - Supply: - Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LFBGA Supplier Device Package: 100-MAPBGA (11x11)	paquet: -	Request a Quote
MPF5032BMBA0ESR2	NXP	PMIC 2 BUCKS 2 LDO A1 DIE Applications: System Basis Chip Current - Supply: - Voltage - Supply: 3.3V ~ 5.25V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-PowerVFQFN Supplier Device Package: 40-HVQFN (6x6)	paquet: -	Request a Quote

BLF6G27LS-100,118

NXP

TRANS PWR LDMOS SOT502

Transistor Type: LDMOS
Frequency: 2.5GHz ~ 2.7GHz
Gain: 17dB
Voltage - Test: 28V
Current Rating: 29A
Noise Figure: -
Current - Test: 900mA
Power - Output: 14W
Voltage - Rated: 65V
Package / Case: SOT-502A
Supplier Device Package: LDMOST

paquet: SOT-502A

Stock4 128

BF1212,215

NXP

MOSFET N-CH DUAL GATE 6V SOT143B

Transistor Type: N-Channel Dual Gate
Frequency: 400MHz
Gain: 30dB
Voltage - Test: 5V
Current Rating: 30mA
Noise Figure: 0.9dB
Current - Test: 12mA
Power - Output: -
Voltage - Rated: 6V
Package / Case: TO-253-4, TO-253AA
Supplier Device Package: SOT-143B

paquet: TO-253-4, TO-253AA

Stock3 456

PBR941,215

NXP

TRANSISTOR NPN UHF 50MA SOT23

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 10V
Frequency - Transition: 8GHz
Noise Figure (dB Typ @ f): 1.4dB ~ 2dB @ 1GHz ~ 2GHz
Gain: -
Power - Max: 360mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 5mA, 6V
Current - Collector (Ic) (Max): 50mA
Operating Temperature: 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

paquet: TO-236-3, SC-59, SOT-23-3

Stock3 520

TDA9886T/V5,112

NXP

IC IF-PLL DEMOD I2C-BUS 24-SOIC

Type: Demodulator
Applications: TV
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

paquet: 24-SOIC (0.295", 7.50mm Width)

Stock5 248

MPC8377CVRALG

NXP

IC MPU MPC83XX 667MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

paquet: 689-BBGA Exposed Pad

Stock6 208

MPC8358CVVADDE

NXP

IC MPU MPC83XX 266MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

paquet: 740-LBGA

Stock4 688

MPC8540CPX667JB

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: -
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

paquet: 784-BBGA, FCBGA

Stock5 904

KMPC8241LZQ200D

NXP

IC MPU MPC82XX 200MHZ 357BGA

Core Processor: PowerPC 603e
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 200MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

paquet: 357-BBGA

Stock7 296

B4860NXE7QUMD

NXP

BASEBAND PROC PILOT REV 1.0

Core Processor: PowerPC e6500
Number of Cores/Bus Width: 4 Core, 64-Bit
Speed: 1.8GHz
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1/2.5 Gbps (4), 1/2.5/10 Gbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Package / Case: 1020-BBGA, FCBGA
Supplier Device Package: 1020-FCPBGA (33x33)

paquet: 1020-BBGA, FCBGA

Stock4 848

MPC8308CZQADDA

NXP

IC MPU MPC83XX 266MHZ 473MAPBGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: -
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 473-LFBGA
Supplier Device Package: 473-MAPBGA (19x19)

paquet: 473-LFBGA

Stock5 104

MCF53012CQT240

NXP

IC MCU 32BIT ROMLESS 208LQFP

Core Processor: Coldfire V3
Core Size: 32-Bit
Speed: 240MHz
Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB OTG
Peripherals: DMA, PWM, WDT
Number of I/O: 61
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-LQFP (28x28)

paquet: 208-LQFP

Stock5 904

LPC2134FBD64,151

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Core Processor: ARM7?
Core Size: 16/32-Bit
Speed: 60MHz
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 47
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 16x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

Stock2 192

MC68332GMEH20

NXP

IC MCU 32BIT ROMLESS 132QFP

Core Processor: CPU32
Core Size: 32-Bit
Speed: 20MHz
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 15
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 132-BQFP Bumpered
Supplier Device Package: 132-PQFP (24.13x24.13)

paquet: 132-BQFP Bumpered

Stock5 184

S9S08SG8E2MTGR

NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 12
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

paquet: 16-TSSOP (0.173", 4.40mm Width)

Stock6 672

TEF6607T/V5,518

NXP

IC TUNER CAR RADIO AM/FM 32SO

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: AM, FM
Applications: AM/FM Radio Receiver
Current - Receiving: -
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 8.5V
Operating Temperature: -
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 32-SO

paquet: 32-SOIC (0.295", 7.50mm Width)

Stock4 302

UJA1079ATW/5V0/1J

NXP

IC SBC LIN

Applications: Automotive
Interface: SPI Serial
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

paquet: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

Stock3 392

LS2048ASE7V1B

NXP

LS2048A - STD TEMP, W/ENCRYPT, 2

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock6 800

MCIMX6DP4AVT8AB

NXP

IC MPU I.MX6DP ENHAN 624FCBGA

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 852MHZ
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3L, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

paquet: 624-FBGA, FCBGA

Stock6 080

S9S12VRP64F0VLF

NXP

64K FLASH, 6K RAM

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 28
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

Stock21 180

SP5744BBK1AMMH2R

NXP

SINGLE CORE 1.5M FLASH 192K RA

Core Processor: e200z4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Number of I/O: -
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LBGA
Supplier Device Package: 100-MAPBGA (11x11)

paquet: 100-LBGA

Stock2 544

MCIMX7U5CVP06SC

NXP

IC I.MX 7ULP MAPBGA 393

Core Processor: ARM® Cortex®-A7
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 650MHz
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Ethernet: -
SATA: -
USB: USB 2.0 (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C
Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Package / Case: -
Supplier Device Package: -

paquet: -

Stock5 552

MM912I637AV1EP-NXP

NXP

BATTERY SENSOR, LIN, 96KB FLASH,

Applications: -
Core Processor: HCS12
Program Memory Type: FLASH (48kB)
Controller Series: HCS12
RAM Size: 6K x 8
Interface: LIN, PWM, SCI, SPI
Number of I/O: 14
Voltage - Supply: 2.25V ~ 5.25V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

paquet: -

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MVR5510AMDA0ESR2

NXP

IC PMIC VR5510 ASIL-D

Applications: -
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

paquet: -

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SAF4000EL-101Z231K

NXP

SAF4000EL

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

paquet: -

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MC9S08RX32AFE

NXP

IC MCU 8BIT 32KB FLASH 64QFN

Core Processor: S08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Supplier Device Package: 64-QFN-EP (9x9)

paquet: -

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K32L2B21VFT0AR

NXP

K32 L2B, 48QFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 36
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 14x16b SAR; D/A 1x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

paquet: -

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MWCT1016SFVMH

NXP

WCT1016 100MAPBGA

Applications: Wireless Power Transmitter
Current - Supply: -
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

paquet: -

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MPF5032BMBA0ESR2

NXP

PMIC 2 BUCKS 2 LDO A1 DIE

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 3.3V ~ 5.25V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-PowerVFQFN
Supplier Device Package: 40-HVQFN (6x6)

paquet: -

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