Produits NXP

PZM2.4NB,115

NXP

DIODE ZENER 2.4V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 2.4V
• Tolerance: ±5%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 100 Ohms
• Current - Reverse Leakage @ Vr: 50µA @ 1V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

paquet: TO-236-3, SC-59, SOT-23-3

74HCT123N,652

NXP

IC MULTIVIBRATOR DUAL MONO 16DIP

• Logic Type: Monostable
• Independent Circuits: 2
• Schmitt Trigger Input: No
• Propagation Delay: 77ns
• Current - Output High, Low: 4mA, 4mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

paquet: 16-DIP (0.300", 7.62mm)

74ABT16373BDGG,118

NXP

IC 16BIT D TYPE LATCH 48TSSOP

• Logic Type: D-Type Transparent Latch
• Circuit: 8:8
• Output Type: Tri-State
• Voltage - Supply: 4.5 V ~ 5.5 V
• Independent Circuits: 2
• Delay Time - Propagation: 2ns
• Current - Output High, Low: 32mA, 64mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 48-TSSOP

paquet: 48-TFSOP (0.240", 6.10mm Width)

TDA18211HD/C2,557

NXP

IC TV SILICON TUNER 64-HLQFN

• Type: Silicon Tuner
• Applications: Set-Top Boxes
• Mounting Type: Surface Mount
• Package / Case: 64-LFQFN Exposed Pad
• Supplier Device Package: 64-HLFQFN (9x9)

paquet: 64-LFQFN Exposed Pad

TFA9882UK/N1,023

NXP

IC AMP AUDIO CLASSD 3.4W 9WLCSP

• Type: Class D
• Output Type: 1-Channel (Mono)
• Max Output Power x Channels @ Load: 3.4W x 1 @ 4 Ohm
• Voltage - Supply: 2.5 V ~ 5.5 V
• Features: Depop, I2S, Mute, Overvoltage, Short-Circuit, Thermal Protection, Undervoltage
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 9-WLCSP (1.49x1.27)
• Package / Case: 9-UFBGA, WLCSP

paquet: 9-UFBGA, WLCSP

MCZ33903B5EK

NXP

IC SBC CAN HS 5.0V 32SOIC

• Applications: System Basis Chip
• Interface: CAN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

paquet: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

P82B96TD,112

NXP

IC REDRIVER I2C 2CH 400KHZ 8SO

• Type: Buffer, ReDriver
• Applications: I2C
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 400kHz
• Number of Channels: 2
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: 7pF
• Voltage - Supply: 2 V ~ 15 V
• Current - Supply: 900µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

KMPC8543HXANG

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

MC7457VG1000NC

NXP

IC MPU MPC74XX 1.0GHZ 483FCCBGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 483-BCBGA, FCCBGA
• Supplier Device Package: 483-FCCBGA (29x29)

paquet: 483-BCBGA, FCCBGA

P2041NSE7NNC

NXP

IC MPU Q OR IQ 1.3GHZ 780FCBGA

• Core Processor: PowerPC e500mc
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.3GHz
• Co-Processors/DSP: Security; SEC 4.2
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FCPBGA (23x23)

paquet: 780-BBGA, FCBGA

MPC8536CVJANGA

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

MPC8535BVJANGA

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 (2)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

MC908GR8CPE

NXP

IC MCU 8BIT 7.5KB FLASH 28DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 17
• Program Memory Size: 7.5KB (7.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.600", 15.24mm)
• Supplier Device Package: 28-PDIP

paquet: 28-DIP (0.600", 15.24mm)

MCF52258VN80

NXP

IC MCU 32BIT 512KB FLASH 144BGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 96
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 144-LBGA
• Supplier Device Package: 144-MAPBGA (13x13)

paquet: 144-LBGA

MC9S08DV16ACLF

NXP

IC MCU 8BIT 16KB FLASH 48LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

MC9S08QD4VPC

NXP

IC MCU 8BIT 4KB FLASH 8DIP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 4
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

paquet: 8-DIP (0.300", 7.62mm)

MC9S08LC60LK

NXP

IC MCU 8BIT 60KB FLASH 80LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LCD, LVD, POR, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

paquet: 80-LQFP

MPXH6300AC6T1

NXP

SENSOR PRESSURE 20-304KPA 1317A

• Pressure Type: Absolute
• Operating Pressure: 2.9 PSI ~ 44.09 PSI (20 kPa ~ 304 kPa)
• Output Type: Analog Voltage
• Output: 0.3 V ~ 4.9 V
• Accuracy: ±1.5%
• Voltage - Supply: 4.74 V ~ 5.46 V
• Port Size: Male - 0.13" (3.3mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 174.05 PSI (1200 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SSOP (0.335", 8.50mm Width), Top Port
• Supplier Device Package: 8-SSOP

paquet: 8-SSOP (0.335", 8.50mm Width), Top Port

MMA7331LR2

NXP

ACCELEROMETER 4-9G ANALOG 14LGA

• Type: Analog
• Axis: X, Y, Z
• Acceleration Range: ±4g, 9g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
• Bandwidth: 400Hz (X,Y), 300Hz (Z)
• Output Type: Analog Voltage
• Voltage - Supply: 2.2 V ~ 3.6 V
• Features: Selectable Scale
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-VFLGA
• Supplier Device Package: 14-LGA (3x5)

paquet: 14-VFLGA

MIMX8MM4DVTLZAA

NXP

IC MPU I.MX 8M MINI DUAL BGA

• Core Processor: ARM® Cortex®-A53
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.8GHz
• Co-Processors/DSP: ARM® Cortex®-M4
• RAM Controllers: DDR3L, DDR4, LPDDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: MIPI-DSI
• Ethernet: GbE
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
• Package / Case: 486-LFBGA, FCBGA
• Supplier Device Package: 486-FCBGA (14x14)

paquet: 486-LFBGA, FCBGA

SAF775DEL-N208Z-KK

NXP

CAR RADIO TUNER & AUDIO DSP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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ACTT6-800E-127

NXP

TRIAC SENS GATE 800V 6A TO220AB

• Triac Type: Logic - Sensitive Gate
• Voltage - Off State: 800 V
• Current - On State (It (RMS)) (Max): 6 A
• Voltage - Gate Trigger (Vgt) (Max): -
• Current - Non Rep. Surge 50, 60Hz (Itsm): 51A, 56A
• Current - Gate Trigger (Igt) (Max): 10 mA
• Current - Hold (Ih) (Max): 25 mA
• Configuration: Single
• Operating Temperature: 125°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-220-3
• Supplier Device Package: TO-220AB

paquet: -

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S9S12G48J1MLC

NXP

IC MCU 16BIT 48KB FLASH 32LQFP

• Core Processor: S12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: -

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SAF4000EL-103Q53AK

NXP

IC

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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MFS2613AMDA2AD

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

• Applications: -
• Current - Supply: -
• Voltage - Supply: 3.2V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

paquet: -

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TJA1448BTK-0Z

NXP

IC TRANSCEIVER HALF 2/2 14HVSON

• Type: Transceiver
• Protocol: CANbus
• Number of Drivers/Receivers: 2/2
• Duplex: Half
• Receiver Hysteresis: 50 mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 14-VDFN Exposed Pad
• Supplier Device Package: 14-HVSON (3x4.5)

paquet: -

LPC1820FBD144K

NXP

IC MCU 32BIT ROMLESS 144LQFP

• Core Processor: ARM® Cortex®-M3
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 83
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 168K x 8
• Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
• Data Converters: A/D 8x10b SAR; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: -

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MIMX8QM5CVUFFAB

NXP

MPU I.MX8 QUAD MAX

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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