Produits NXP

MRF7S18125AHR3

NXP

FET RF 65V 1.88GHZ NI780

• Transistor Type: LDMOS
• Frequency: 1.88GHz
• Gain: 17dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.1A
• Power - Output: 125W
• Voltage - Rated: 65V
• Package / Case: NI-780
• Supplier Device Package: NI-780

paquet: NI-780

BFG10/X,215

NXP

TRANS RF NPN 2GHZ 8V SOT143

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 8V
• Frequency - Transition: 1.9GHz
• Noise Figure (dB Typ @ f): -
• Gain: 7dB
• Power - Max: 400mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 50mA, 5V
• Current - Collector (Ic) (Max): 250mA
• Operating Temperature: 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-253-4, TO-253AA
• Supplier Device Package: SOT-143B

paquet: TO-253-4, TO-253AA

LD6938CX6/285285PJ

NXP

IC REG LIN 2.85V/2.85V 6WLCSP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 2
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.85V, 2.85V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.4V @ 300mA, 0.4V @ 300mA
• Current - Output: 300mA, 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 75µA
• PSRR: 80dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Soft Start
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 6-XFBGA, WLCSP
• Supplier Device Package: 6-WLCSP (1.2x0.80)

paquet: 6-XFBGA, WLCSP

MC10XS3412DPNA

NXP

IC SWITCH HIGH SIDE QUAD 24QFN

• Switch Type: General Purpose
• Number of Outputs: 4
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 6 V ~ 20 V
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Current - Output (Max): -
• Rds On (Typ): 10 mOhm, 12 mOhm
• Input Type: -
• Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 24-PowerQFN
• Supplier Device Package: 24-PQFN (12x12)

paquet: 24-PowerQFN

TEA1721BT/N1,118

NXP

IC SMPS CTLR W/PWR SWITCH 7-SOIC

• Output Isolation: -
• Internal Switch(s): Yes
• Voltage - Breakdown: 700V
• Topology: Flyback
• Voltage - Start Up: 17V
• Voltage - Supply (Vcc/Vdd): 8.5 V ~ 35 V
• Duty Cycle: 75%
• Frequency - Switching: 22.5kHz ~ 50.5kHz
• Power (Watts): 5W
• Fault Protection: Over Temperature, Over Voltage, Short Circuit
• Control Features: -
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 8-SOIC (0.154", 3.90mm Width) 7 leads
• Supplier Device Package: 7-SO
• Mounting Type: Surface Mount

paquet: 8-SOIC (0.154", 3.90mm Width) 7 leads

74ABT16823ADL,518

NXP

IC D-TYPE POS TRG DUAL 56SSOP

• Function: Master Reset
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 2
• Number of Bits per Element: 9
• Clock Frequency: 190MHz
• Max Propagation Delay @ V, Max CL: 3.2ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 1mA
• Input Capacitance: 4pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-BSSOP (0.295", 7.50mm Width)

paquet: 56-BSSOP (0.295", 7.50mm Width)

PCAL6416AERJ

NXP

IC I/O EXPANDER 16BIT 24UFBGA

• Number of I/O: 16
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Open Drain, Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-UFBGA
• Supplier Device Package: 24-UFBGA (2x2)

paquet: 24-UFBGA

PCA82C251T/N3,112

NXP

IC CAN TRANSCEIVER 5V HS 8-SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 150mV
• Data Rate: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

NX5L2750CGUX

NXP

IC ANALOG SWITCH SPDT 10XQFN

• Applications: Audio
• Multiplexer/Demultiplexer Circuit: 2:1
• Switch Circuit: SPDT
• Number of Channels: 2
• On-State Resistance (Max): 1.3 Ohm
• Voltage - Supply, Single (V+): 1.8 V ~ 5 V
• Voltage - Supply, Dual (V±): -
• -3db Bandwidth: 100MHz
• Features: Break-Before-Make
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 10-XFQFN
• Supplier Device Package: 10-XQFN (1.4x1.8)

paquet: 10-XFQFN

P1014NXE5HFA

NXP

IC MPU Q OR IQ 800MHZ 425TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Security; SEC 4.4
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
• Package / Case: 425-FBGA
• Supplier Device Package: 425-TEPBGA I (19x19)

paquet: 425-FBGA

MPC8536EAVTAKGA

NXP

IC MPU MPC85XX 600MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 600MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 90°C (TA)
• Security Features: Cryptography
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

KMPC8347CVRAGDB

NXP

IC MPU MPC83XX 266MHZ 620BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

paquet: 620-BBGA Exposed Pad

MPC8379EVRAGDA

NXP

IC MPU MPC83XX 400MHZ 689TEBGA

• Core Processor: PowerPC e300c4s
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Security; SEC 3.0
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (4)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

paquet: 689-BBGA Exposed Pad

MPC8358EVRAGDGA

NXP

IC MPU MPC83XX 400MHZ 668BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 668-BBGA Exposed Pad
• Supplier Device Package: 668-PBGA-PGE (29x29)

paquet: 668-BBGA Exposed Pad

MC908AP32ACBE

NXP

IC MCU 8BIT 32KB FLASH 42PSDIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I2C, IRSCI, SCI, SPI
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 30
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 42-SDIP (0.600", 15.24mm)
• Supplier Device Package: 42-PSDIP

paquet: 42-SDIP (0.600", 15.24mm)

S912XEP100W1MAG

NXP

IC MCU 16BIT 1MB FLASH 144LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

S9S12HY32J0MLL

NXP

IC MCU 16BIT 32KB FLASH 100LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number of I/O: 80
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

S9S12P128J0MFT

NXP

IC MCU 16BIT 128KB FLASH 48QFN

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 6K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

paquet: 48-VFQFN Exposed Pad

MC9S08PA8AVLD

NXP

IC MCU 8BIT 8KB FLASH 44LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 37
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

paquet: 44-LQFP

MC9S08AC48CFGE

NXP

IC MCU 8BIT 48KB FLASH 44LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

paquet: 44-LQFP

TDA8777HL/24/C1,15

NXP

IC VIDEO DAC 10BIT TRIPLE 48LQFP

• Number of Bits: 10
• Number of D/A Converters: 3
• Settling Time: -
• Output Type: Current - Unbuffered
• Differential Output: Yes
• Data Interface: Parallel
• Reference Type: Internal
• Voltage - Supply, Analog: 3 V ~ 3.6 V
• Voltage - Supply, Digital: 3 V ~ 3.6 V
• INL/DNL (LSB): ±1.8 (Max), ±0.9 (Max)
• Architecture: String DAC
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)
• Mounting Type: -

paquet: 48-LQFP

LM75ADP/DG,118

NXP

SENSOR TEMPERATURE I2C 8TSSOP

• Sensor Type: Digital, Local
• Sensing Temperature - Local: -55°C ~ 125°C
• Sensing Temperature - Remote: -
• Output Type: I2C
• Voltage - Supply: 2.8 V ~ 5.5 V
• Resolution: 10 b
• Features: Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
• Accuracy - Highest (Lowest): ±2°C (±3°C)
• Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

MPXM2202AS

NXP

SENS PRESSURE 29 PSI MAX MPAK

• Pressure Type: Absolute
• Operating Pressure: 29.01 PSI (200 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 40 mV (10V)
• Accuracy: -
• Voltage - Supply: 10 V ~ 16 V
• Port Size: Male - 0.12" (2.97mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 5-SMD Module
• Supplier Device Package: 5-MPAK

paquet: 5-SMD Module

P5DF081HNT1AD2060,

NXP

IC MIFARE SAM AV2 32HVQFN

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: UART
• Voltage - Supply: 2.7 V ~ 3.3 V
• Operating Temperature: -25°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

paquet: 32-VFQFN Exposed Pad

MF1S7030XDA8/V1J

NXP

MIFARE CLASSIC SMART CARD IC

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE
• Interface: UART
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 70°C
• Package / Case: MOA8, Smart Card Module
• Supplier Device Package: PLLMC

paquet: MOA8, Smart Card Module

S912ZVML12AWKHR

NXP

S12Z CORE, 128K FLASH, LIN, 64LQ

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
• Data Converters: A/D 9x12b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-HLQFP (10x10)

paquet: -

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MC33PF8100F3ESR2

NXP

POWER MANAGEMENT IC, I.MX8, PRE-

• Applications: Processor
• Current - Supply: 10µA
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

paquet: -

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SAF7751HV-N207WK

NXP

CAR DISP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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