Produits NXP

ON5238,118

NXP

MOSFET RF SOT426 D2PAK

• Transistor Type: -
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: -
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: -
• Package / Case: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB
• Supplier Device Package: SOT-426

paquet: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB

LD6805K/31H,115

NXP

IC REG LINEAR 3.1V 150MA 4UDFN

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 3.1V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.25V @ 150mA
• Current - Output: 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 35µA ~ 150µA
• PSRR: 75dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Transient Voltage
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 4-UDFN Exposed Pad
• Supplier Device Package: 4-UDFN (1.0x1.0)

paquet: 4-UDFN Exposed Pad

PCF8811MU/2DA/1,02

NXP

IC LCD CTLR/DVR CMOS LP UNCASED

• Display Type: LCD
• Configuration: Display Matrix
• Interface: I2C, Parallel, Serial
• Digits or Characters: -
• Current - Supply: 25µA
• Voltage - Supply: 1.7 V ~ 3.3 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

paquet: Die

MC34674CEPR2

NXP

IC BATT CHARGER SGL 650MA 8-UDFN

• Battery Chemistry: Lithium-Ion/Polymer
• Number of Cells: 1
• Current - Charging: Constant - Programmable
• Programmable Features: Timer
• Fault Protection: Over Voltage
• Charge Current - Max: 650mA
• Battery Pack Voltage: 4.2V
• Voltage - Supply (Max): 10V
• Interface: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-UFDFN Exposed Pad
• Supplier Device Package: 8-UDFN-EP (2x3)

paquet: 8-UFDFN Exposed Pad

74LVCH32373AEC,557

NXP

IC 32BIT TRANSP D LATCH 96LFBGA

• Logic Type: D-Type Transparent Latch
• Circuit: 8:8
• Output Type: Tri-State
• Voltage - Supply: 2.7 V ~ 3.6 V
• Independent Circuits: 4
• Delay Time - Propagation: 3ns
• Current - Output High, Low: 24mA, 24mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Supplier Device Package: 96-LFBGA (13.5x5.5)

paquet: 96-LFBGA

74LVCH32244AEC/G,5

NXP

IC BUFF DVR TRI-ST 32BIT 96LFBGA

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 8
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Supplier Device Package: 96-LFBGA (13.5x5.5)

paquet: 96-LFBGA

UJA1079ATW/3V3WD,1

NXP

IC SBC LIN 3.3V 32HTSSOP

• Applications: Automotive
• Interface: SPI Serial
• Voltage - Supply: 4.5 V ~ 28 V
• Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
• Supplier Device Package: 32-HTSSOP
• Mounting Type: Surface Mount

paquet: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

MPC8308ZQAFD

NXP

IC MPU MPC83XX 333MHZ 473MAPBGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 333MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 473-LFBGA
• Supplier Device Package: 473-MAPBGA (19x19)

paquet: 473-LFBGA

MPC8313ECZQADDB

NXP

IC MPU MPC83XX 267MHZ 516BGA

• Core Processor: PowerPC e300c3
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 267MHz
• Co-Processors/DSP: Security; SEC 2.2
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 516-BBGA Exposed Pad
• Supplier Device Package: 516-TEPBGA (27x27)

paquet: 516-BBGA Exposed Pad

KMPC8347ZUAJDB

NXP

IC MPU MPC83XX 533MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

paquet: 672-LBGA

MPC823ZQ66B2T

NXP

IC MPU MPC8XX 66MHZ 256BGA

• Core Processor: PowerPC
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: LCD, Video
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

paquet: 256-BBGA

XPC8260VVHFBC

NXP

IC MPU MPC82XX 166MHZ 408TBGA

• Core Processor: PowerPC G2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 166MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 480-LBGA
• Supplier Device Package: 408-TBGA (37.5x37.5)

paquet: 480-LBGA

MPC8245TVV266D

NXP

IC MPU MPC82XX 266MHZ 352TBGA

• Core Processor: PowerPC 603e
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 352-LBGA
• Supplier Device Package: 352-TBGA (35x35)

paquet: 352-LBGA

MC908AP16CFBE

NXP

IC MCU 8BIT 16KB FLASH 44QFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I2C, IRSCI, SCI, SPI
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 32
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-QFP
• Supplier Device Package: 44-QFP (10x10)

paquet: 44-QFP

MM912F634CV2AP

NXP

IC MCU 16BIT 32KB FLASH 48LQFP

• Applications: Automotive
• Core Processor: S12
• Program Memory Type: FLASH (32 KB)
• Controller Series: HCS12
• RAM Size: 2K x 8
• Interface: LIN, SCI
• Number of I/O: 9
• Voltage - Supply: 2.25 V ~ 5.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP-EP (7x7)

paquet: 48-LQFP

MPXV5010GC6U

NXP

SENSOR INTEG SILICON PRESSURE

• Pressure Type: Vented Gauge
• Operating Pressure: 1.45 PSI (10 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.7 V
• Accuracy: ±5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: Male - 0.13" (3.17mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 5.8 PSI (40 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD, Gull Wing, Top Port
• Supplier Device Package: -

paquet: 8-SMD, Gull Wing, Top Port

MMA5212NDIKGCWR2

NXP

ACCELEROMETER PSI5 16QFN

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

MMA7330L

NXP

ACCELEROMETER 4-12G ANALOG 14LGA

• Type: Analog
• Axis: X, Y, Z
• Acceleration Range: ±4g, 12g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
• Bandwidth: 400Hz (X,Y), 300Hz (Z)
• Output Type: Analog Voltage
• Voltage - Supply: 2.2 V ~ 3.6 V
• Features: Selectable Scale, Sleep Mode
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-VFLGA
• Supplier Device Package: 14-LGA (3x5)

paquet: 14-VFLGA

MMA2204KEG

NXP

ACCELEROMETER 112.5G ANAL 16SOIC

• Type: Analog
• Axis: X
• Acceleration Range: ±112.5g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 20
• Bandwidth: 400Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

paquet: 16-SOIC (0.295", 7.50mm Width)

JN517X-XK040UL

NXP

ZIGBEE LIGHTING/SENSOR NODE EXPA

• Type: TxRx + MCU
• RF Family/Standard: 802.15.4
• Protocol: Zigbee?
• Modulation: -
• Frequency: 2.4GHz
• Data Rate (Max): -
• Power - Output: 10dBm
• Sensitivity: -96dBm
• Memory Size: -
• Serial Interfaces: I2C, SPI, UART
• GPIO: -
• Voltage - Supply: 3.6V
• Current - Receiving: 14mA
• Current - Transmitting: 22.5mA
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 40-VFQFN Exposed Pad

paquet: 40-VFQFN Exposed Pad

PCA9468UKZ

NXP

2:1 SWITCHED CAPACITOR CHARGER

• Battery Chemistry: -
• Number of Cells: -
• Current - Charging: -
• Programmable Features: -
• Fault Protection: -
• Charge Current - Max: -
• Battery Pack Voltage: -
• Voltage - Supply (Max): -
• Interface: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

TDF8599ATH/N2/S481

NXP

IC AMP I2C DIAGNOSTICS 36HSOP

• Type: Class D
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 250W x 1 @ 2 Ohm; 135W x 2 @ 4 Ohm
• Voltage - Supply: 8 V ~ 35 V
• Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection
• Mounting Type: -
• Operating Temperature: -
• Supplier Device Package: -
• Package / Case: -

paquet: -

T2081NSN8MQLB

NXP

QORIQ64B POWER ARCH8X 1.2GHZ T

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

S912ZVMC64F2MKH

NXP

IC MCU 16BIT FLASH

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP-EP (10x10)

paquet: 64-LQFP Exposed Pad

S9S12GN32AVLF

NXP

16-BIT32K FLASH2K RAM

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

S9S08EL32F1CTJR

NXP

8-BIT MCU S08 CORE 32KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

paquet: 20-TSSOP (0.173", 4.40mm Width)

S9S12G48J0CLF

NXP

S12 CORE,64K FLASH,AU

• Core Processor: S12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: -

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A3T21H360W23SR6

NXP

RF MOSFET LDMOS 28V ACP1230S-4

• Transistor Type: LDMOS
• Frequency: 2.11GHz ~ 2.2GHz
• Gain: 16.4dB
• Voltage - Test: 28 V
• Current Rating: 10µA
• Noise Figure: -
• Current - Test: 600 mA
• Power - Output: 328W
• Voltage - Rated: 65 V
• Package / Case: ACP-1230S-4L2S
• Supplier Device Package: ACP-1230S-4L2S

paquet: -

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