Produits NXP

BF904WR,135

NXP

MOSFET N-CH 7V 30MA SOT343

• Transistor Type: N-Channel Dual Gate
• Frequency: 200MHz
• Gain: -
• Voltage - Test: 5V
• Current Rating: 30mA
• Noise Figure: 1dB
• Current - Test: 10mA
• Power - Output: -
• Voltage - Rated: 7V
• Package / Case: SC-82A, SOT-343
• Supplier Device Package: CMPAK-4

paquet: SC-82A, SOT-343

2N4401,116

NXP

TRANS NPN 40V 0.6A TO92

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 600mA
• Voltage - Collector Emitter Breakdown (Max): 40V
• Vce Saturation (Max) @ Ib, Ic: 750mV @ 50mA, 500mA
• Current - Collector Cutoff (Max): 50nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 1V
• Power - Max: 630mW
• Frequency - Transition: 250MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

paquet: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

MC50XS4200BEK

NXP

IC SWITCH HISD 24V DUAL 32SOIC

• Switch Type: General Purpose
• Number of Outputs: 2
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 8 V ~ 36 V
• Voltage - Supply (Vcc/Vdd): 3.3 V ~ 5 V
• Current - Output (Max): 1.2A
• Rds On (Typ): 50 mOhm
• Input Type: -
• Features: Slew Rate Controlled
• Fault Protection: Open Load Detect, Over Temperature
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

paquet: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

SSL5101T/1J

NXP

IC LED DRIVER OFFL SWITCHER 8SO

• Type: AC DC Offline Switcher
• Topology: Flyback, Step-Down (Buck), Step-Up (Boost)
• Internal Switch(s): No
• Number of Outputs: 1
• Voltage - Supply (Min): 8.8V
• Voltage - Supply (Max): 32V
• Voltage - Output: -
• Current - Output / Channel: -
• Frequency: -
• Dimming: -
• Applications: Lighting
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

74HCT273N,652

NXP

IC D-TYPE POS TRG SNGL 20DIP

• Function: Master Reset
• Type: D-Type
• Output Type: Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 36MHz
• Max Propagation Delay @ V, Max CL: 30ns @ 4.5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 4mA, 5.2mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Iq): 8µA
• Input Capacitance: 3.5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)

paquet: 20-DIP (0.300", 7.62mm)

SCC2692AC1N28,602

NXP

IC DUART 28-DIP

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 2, DUART
• FIFO's: -
• Protocol: -
• Data Rate (Max): 1Mbps
• Voltage - Supply: 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: -
• Mounting Type: Through Hole
• Package / Case: 28-DIP (0.600", 15.24mm)
• Supplier Device Package: 28-DIP

paquet: 28-DIP (0.600", 15.24mm)

SC68C752BIB48,128

NXP

IC UART DUAL 48LQFP

• Features: -
• Number of Channels: 2, DUART
• FIFO's: 64 Byte
• Protocol: -
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

PCA9554CBSHP

NXP

IC I/O EXPANDER I2C 16HVQFN

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 10mA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-VFQFN Exposed Pad
• Supplier Device Package: 16-HVQFN (3x3)

paquet: 16-VFQFN Exposed Pad

KMPC8541EPXAPF

NXP

IC MPU MPC85XX 833MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 833MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

XPC823VR81B2T

NXP

IC MPU MPC8XX 81MHZ 256BGA

• Core Processor: PowerPC
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 81MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: LCD, Video
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

paquet: 256-BBGA

MC68EN360EM25L

NXP

IC MPU M683XX 25MHZ 240FQFP

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 240-BFQFP
• Supplier Device Package: 240-FQFP (32x32)

paquet: 240-BFQFP

P1025NSE5DFB

NXP

IC MPU Q OR IQ 667MHZ 561TEBGA1

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 561-FBGA
• Supplier Device Package: 561-TEPBGA1 (23x23)

paquet: 561-FBGA

MCF52100CVM66J

NXP

IC MCU 32BIT 64KB FLASH 81MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 81-LBGA
• Supplier Device Package: 81-MAPBGA (10x10)

paquet: 81-LBGA

MC9S12XD256MAG

NXP

IC MCU 16BIT 256KB FLASH 144LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 14K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

SPC5668GK0MMGR

NXP

IC MCU 32BIT 2MB FLASH 208MAPBGA

• Core Processor: e200z650
• Core Size: 32-Bit
• Speed: 116MHz
• Connectivity: CAN, Ethernet, I2C, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 155
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 592K x 8
• Voltage - Supply (Vcc/Vdd): 3.3 V ~ 5 V
• Data Converters: A/D 36x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 208-BGA
• Supplier Device Package: 208-MAPBGA (17x17)

paquet: 208-BGA

TDA8783HL/C4,151

NXP

IC ADC 10BIT 40MSPS 48-LQFP

• Type: ADC, Video
• Number of Channels: -
• Resolution (Bits): 10 b
• Sampling Rate (Per Second): 40M
• Data Interface: Serial
• Voltage Supply Source: Analog and Digital
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -20°C ~ 75°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

PCF85063ATL/1,118

NXP

IC RTC CLK/CALENDAR I2C 10-SON

• Type: Clock/Calendar
• Features: Alarm, Leap Year, Square Wave Output
• Memory Size: -
• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I2C, 2-Wire Serial
• Voltage - Supply: 0.9 V ~ 5.5 V
• Voltage - Supply, Battery: -
• Current - Timekeeping (Max): 0.6µA @ 3.3V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-XFDFN Exposed Pad
• Supplier Device Package: 10-DFN (2.6x2.6)

paquet: 10-XFDFN Exposed Pad

KTY82/220,215

NXP

IC TEMP SENSOR SOT23

• Resistance in Ohms @ 25°C: 2k
• Resistance Tolerance: -
• Operating Temperature: -55°C ~ 150°C
• Power - Max: -
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

paquet: TO-236-3, SC-59, SOT-23-3

MC32PF4210A0ESR2

NXP

PF4210

• Applications: Audio, Video
• Current - Supply: -
• Voltage - Supply: 2.8 V ~ 4.5 V
• Operating Temperature: 0°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN-EP (8x8)

paquet: 56-VFQFN Exposed Pad

MCZ33904D5EK

NXP

SYSTEM BASIS CHIP 2X 5.0 V/400M

• Applications: System Basis Chip
• Interface: CAN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

paquet: -

MCZ33904D3EKR2

NXP

SYSTEM BASIS CHIP 2X 3.3 V/400M

• Applications: System Basis Chip
• Interface: CAN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

paquet: -

MVF50NS152CMK50R

NXP

MVF50NS152CMK50R

• Core Processor: ARM® Cortex®-A5
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 500MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, DDR3, DRAM
• Graphics Acceleration: Yes
• Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 OTG + PHY (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
• Package / Case: 364-LFBGA
• Supplier Device Package: 364-LFBGA (17x17)

paquet: 364-LFBGA

SPC5123YVY400B

NXP

TELEMATICS PROCESSOR W/O MBX GRA

• Core Processor: e300
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, USB OTG
• Peripherals: DMA, WDT
• Number of I/O: 147
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 516-BBGA Exposed Pad
• Supplier Device Package: 516-FPBGA (27x27)

paquet: 516-BBGA Exposed Pad

SAF775DHN-N208Z-KK

NXP

CAR RADIO TUNER & AUDIO DSP

• Type: Audio, Car Signal Processor
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 184-VQFN Multi Row, Exposed Pad
• Supplier Device Package: 184-HVQFN (12x12)

paquet: -

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LPC804UK

NXP

RISC MICROCONTROLLER

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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SPC5602BF2CLL4

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: e200z0h
• Core Size: 32-Bit Single-Core
• Speed: 48MHz
• Connectivity: CANbus, I2C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: -

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MC20XS4200DFK

NXP

HIGH-SIDE SWITCH, 24V, DUAL 20MO

• Switch Type: General Purpose
• Number of Outputs: 2
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 8V ~ 36V
• Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
• Current - Output (Max): 4.4A
• Rds On (Typ): 20mOhm (Max)
• Input Type: Non-Inverting
• Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
• Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 23-PowerQFN
• Supplier Device Package: 23-PQFN (12x12)

paquet: -

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MPF5200AMMG0ES

NXP

POWER MANAGEMENT IC, PRE-PROG, 3

• Applications: -
• Current - Supply: 40µA
• Voltage - Supply: 2.7V ~ 5.5V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 32-PowerWFQFN
• Supplier Device Package: 32-HWQFN (5x5)

paquet: -

Request a Quote