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Produits NXP

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PMBFJ176,215
NXP

JFET P-CH 30V 0.3W SOT23

  • FET Type: P-Channel
  • Voltage - Breakdown (V(BR)GSS): 30V
  • Drain to Source Voltage (Vdss): 30V
  • Current - Drain (Idss) @ Vds (Vgs=0): 2mA @ 15V
  • Current Drain (Id) - Max: -
  • Voltage - Cutoff (VGS off) @ Id: 1V @ 10nA
  • Input Capacitance (Ciss) (Max) @ Vds: 8pF @ 10V (VGS)
  • Resistance - RDS(On): 250 Ohm
  • Power - Max: 300mW
  • Operating Temperature: 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SOT-23 (TO-236AB)
paquet: TO-236-3, SC-59, SOT-23-3
Stock7 648
BUK9Y7R6-40E/GFX
NXP

MOSFET N-CH LFPAK

  • Transistor Type: -
  • Current - Collector (Ic) (Max): -
  • Voltage - Collector Emitter Breakdown (Max): -
  • Vce Saturation (Max) @ Ib, Ic: -
  • Current - Collector Cutoff (Max): -
  • DC Current Gain (hFE) (Min) @ Ic, Vce: -
  • Power - Max: -
  • Frequency - Transition: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 344
TEA1520T/N2,118
NXP

IC CTLR SMPS PS SW MODE 14SOIC

  • Output Isolation: Isolated
  • Internal Switch(s): Yes
  • Voltage - Breakdown: 650V
  • Topology: Flyback
  • Voltage - Start Up: 9.5V
  • Voltage - Supply (Vcc/Vdd): 7.5 V ~ 40 V
  • Duty Cycle: 75%
  • Frequency - Switching: 10kHz ~ 200kHz
  • Power (Watts): 30W
  • Fault Protection: Current Limiting, Over Temperature, Short Circuit
  • Control Features: Frequency Control
  • Operating Temperature: -40°C ~ 145°C (TJ)
  • Package / Case: 14-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 14-SO
  • Mounting Type: Surface Mount
paquet: 14-SOIC (0.154", 3.90mm Width)
Stock2 992
PCA9501BS,118
NXP

IC I/O EXPANDER I2C 8B 20HVQFN

  • Number of I/O: 8
  • Interface: I2C, SMBus
  • Interrupt Output: Yes
  • Features: EEPROM, POR
  • Output Type: Push-Pull
  • Current - Output Source/Sink: 100µA, 25mA
  • Clock Frequency: 400kHz
  • Voltage - Supply: 2.5 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 20-VQFN Exposed Pad
  • Supplier Device Package: 20-HVQFN (5x5)
paquet: 20-VQFN Exposed Pad
Stock6 784
MCIMX6G3DVM05AA
NXP

IC MPU I.MC6UL 528MHZ 289BGA

  • Core Processor: ARM? Cortex?-A7
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 528MHz
  • Co-Processors/DSP: Multimedia; NEON? SIMD
  • RAM Controllers: LPDDR2, DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: LCD, LVDS
  • Ethernet: 10/100 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: 0°C ~ 95°C (TJ)
  • Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
  • Package / Case: 289-LFBGA
  • Supplier Device Package: 289-MAPBGA (14x14)
paquet: 289-LFBGA
Stock3 520
T2080NXE7PTB
NXP

IC SOC 64BIT 8X1.5GHZ 896FCBGA

  • Core Processor: PowerPC e6500
  • Number of Cores/Bus Width: 4 Core, 64-Bit
  • Speed: 1.5GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
  • Package / Case: 896-FBGA, FCBGA
  • Supplier Device Package: 896-FCPBGA (25x25)
paquet: 896-FBGA, FCBGA
Stock6 256
MPC8572LVTARLE
NXP

IC MPU MPC85XX 1.067GHZ 1023BGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.067GHz
  • Co-Processors/DSP: Signal Processing; SPE
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 1023-BFBGA, FCBGA
  • Supplier Device Package: 1023-FCPBGA (33x33)
paquet: 1023-BFBGA, FCBGA
Stock5 664
MPC8541ECPXAJD
NXP

IC MPU MPC85XX 533MHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 533MHz
  • Co-Processors/DSP: Security; SEC
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
paquet: 783-BBGA, FCBGA
Stock4 672
MC68306AG16B
NXP

IC MPU M683XX 16MHZ 144LQFP

  • Core Processor: EC000
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 16MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
paquet: 144-LQFP
Stock2 100
P2010NSN2HFC
NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 125°C (TA)
  • Security Features: -
  • Package / Case: 689-BBGA Exposed Pad
  • Supplier Device Package: 689-TEPBGA II (31x31)
paquet: 689-BBGA Exposed Pad
Stock4 032
MC908GR32ACFAER
NXP

IC MCU 8BIT 32KB FLASH 48LQFP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: SCI, SPI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 37
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1.5K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 24x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock4 480
P87LPC762BD,512
NXP

IC MCU 8BIT 2KB OTP 20SO

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C, UART/USART
  • Peripherals: Brown-out Detect/Reset, LED, POR, WDT
  • Number of I/O: 18
  • Program Memory Size: 2KB (2K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SO
paquet: 20-SOIC (0.295", 7.50mm Width)
Stock2 400
hot MCF5206FT25A
NXP

IC MCU 32BIT ROMLESS 160QFP

  • Core Processor: Coldfire V2
  • Core Size: 32-Bit
  • Speed: 25MHz
  • Connectivity: I2C, UART/USART
  • Peripherals: POR, WDT
  • Number of I/O: 8
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-QFP (28x28)
paquet: 160-BQFP
Stock23 424
MCF5373LCVM240
NXP

IC MCU 32BIT ROMLESS 196MAPBGA

  • Core Processor: Coldfire V3
  • Core Size: 32-Bit
  • Speed: 240MHz
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 62
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 196-LBGA
  • Supplier Device Package: 196-MAPBGA (15x15)
paquet: 196-LBGA
Stock5 328
S912XDG128F2MAA
NXP

IC MCU 16BIT 128KB FLASH 80QFP

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 80MHz
  • Connectivity: CAN, I2C, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 59
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 12K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 8x10b, 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 80-QFP
  • Supplier Device Package: 80-QFP (14x14)
paquet: 80-QFP
Stock3 040
MC9S08SH32MTL
NXP

IC MCU 8BIT 32KB FLASH 28TSSOP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 23
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 28-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 28-TSSOP
paquet: 28-TSSOP (0.173", 4.40mm Width)
Stock7 648
S9S12G48F0CLH
NXP

IC MCU 16BIT 48KB FLASH 64LQFP

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CAN, IrDA, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 40
  • Program Memory Size: 48KB (48K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1.5K x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 12x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock5 136
LPC1114LVFHN24/303
NXP

IC MCU 32BIT 32KB FLASH 24HVQFN

  • Core Processor: ARM? Cortex?-M0
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, WDT
  • Number of I/O: 20
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 1.65 V ~ 1.95 V
  • Data Converters: A/D 8x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 24-VFQFN Exposed Pad
  • Supplier Device Package: 24-HVQFN (4x4)
paquet: 24-VFQFN Exposed Pad
Stock4 240
hot MC9S08FL16CLC
NXP

IC MCU 8BIT 16KB FLASH 32LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: SCI
  • Peripherals: LVD, PWM, WDT
  • Number of I/O: 30
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 12x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
paquet: 32-LQFP
Stock42 396
HTSMOH4802EVJ
NXP

IC HITAG-S 2048BIT MOA2 PLLMC

  • Type: RFID Transponder
  • Frequency: 100kHz ~ 150kHz
  • Standards: ISO 14223, ISO 11784, ISO 11785, ISO 18000-2
  • Interface: -
  • Voltage - Supply: -
  • Operating Temperature: -25°C ~ 85°C
  • Package / Case: MOA4, Smart Card Module
  • Supplier Device Package: PLLMC
paquet: MOA4, Smart Card Module
Stock8 766
CX24132-12Z,557
NXP

IC SATELLITE TUNER DGTL 48HVQFN

  • Frequency: -
  • Sensitivity: -
  • Data Rate (Max): -
  • Modulation or Protocol: -
  • Applications: Satellite Receiver
  • Current - Receiving: -
  • Data Interface: PCB, Surface Mount
  • Memory Size: -
  • Antenna Connector: PCB, Surface Mount
  • Features: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
paquet: 48-VFQFN Exposed Pad
Stock8 046
OM7690/BFU730F,598
NXP

EVAL BOARD FOR BFU730F

  • Type: Amplifier
  • Frequency: 2.3GHz ~ 2.7GHz
  • For Use With/Related Products: BFU730F
  • Supplied Contents: Board
paquet: -
Stock5 076
TDF8599ATH/N2/S24Y
NXP

IC AMP I2C DIAGNOSTICS 36HSOP

  • Type: Class D
  • Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
  • Max Output Power x Channels @ Load: 250W x 1 @ 2 Ohm; 135W x 2 @ 4 Ohm
  • Voltage - Supply: 8 V ~ 35 V
  • Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection
  • Mounting Type: -
  • Operating Temperature: -
  • Supplier Device Package: -
  • Package / Case: -
paquet: -
Stock5 728
TDA18285HN/C1E
NXP

CABLE FST DEMOD

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock2 368
MWCT22C3AVLH
NXP

NEVIS3A_WCT,64LQFP

  • Applications: Wireless Power Transmitter
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: -
Request a Quote
SGTL5000XNBA3
NXP

IC AUDIO CODEC STEREO 32HVQFN

  • Type: Stereo Audio
  • Data Interface: I2C, I2S, PCM, SPI
  • Resolution (Bits): -
  • Number of ADCs / DACs: 1 / 1
  • Sigma Delta: No
  • S/N Ratio, ADCs / DACs (db) Typ: 90 / 100
  • Dynamic Range, ADCs / DACs (db) Typ: 87 / 100
  • Voltage - Supply, Analog: 1.62V ~ 3.6V
  • Voltage - Supply, Digital: 1.1V ~ 2V, 1.62V ~ 3.6V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
SAF775CHN-N208WCMP
NXP

CAR DISP

  • Type: -
  • Interface: -
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: -
  • Voltage - Core: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
MFS2613AMDA0AD
NXP

SAFETY SYSTEM BASIS CHIP WITH LO

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
paquet: -
Request a Quote