Produits NXP

MRF19030LSR5

NXP

FET RF 65V 1.96GHZ NI-400S

• Transistor Type: LDMOS
• Frequency: 1.96GHz
• Gain: 13dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 300mA
• Power - Output: 30W
• Voltage - Rated: 65V
• Package / Case: NI-400S
• Supplier Device Package: NI-400S

paquet: NI-400S

BF1216,115

NXP

FET RF 6V 400MHZ 6TSSOP

• Transistor Type: N-Channel Dual Gate
• Frequency: 400MHz
• Gain: 30dB
• Voltage - Test: 5V
• Current Rating: 30mA
• Noise Figure: 1dB
• Current - Test: 19mA
• Power - Output: -
• Voltage - Rated: 6V
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

paquet: 6-TSSOP, SC-88, SOT-363

BZX284-C27,115

NXP

DIODE ZENER 27V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 27V
• Tolerance: ±5%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 40 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 18.9V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

paquet: SOD-110

MMPF0100NPAEP

NXP

IC PWR MGMT I.MX6 56QFN

• Applications: Converter, i.MX6
• Voltage - Input: 2.8 V ~ 4.5 V
• Number of Outputs: 12
• Voltage - Output: Multiple
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-QFN (8x8)

paquet: 56-VFQFN Exposed Pad

LD6806TD/36H,125

NXP

IC REG LINEAR 3.6V 200MA 5TSOP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 3.6V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.13V @ 200mA
• Current - Output: 200mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SC-74A, SOT-753
• Supplier Device Package: 5-TSOP

paquet: SC-74A, SOT-753

MC33899VWR2

NXP

IC MOTOR DRIVER SPI 30HSOP

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushed DC
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (2)
• Interface: SPI
• Technology: Power MOSFET
• Step Resolution: -
• Applications: General Purpose
• Current - Output: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Voltage - Load: 6 V ~ 26.5 V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 30-BSOP (0.433", 11.00mm Width) Exposed Pad
• Supplier Device Package: 30-HSOP

paquet: 30-BSOP (0.433", 11.00mm Width) Exposed Pad

74AHC259D,118

NXP

IC 8BIT ADDRESSABLE LATCH 16SOIC

• Logic Type: D-Type, Addressable
• Circuit: 1:8
• Output Type: Standard
• Voltage - Supply: 2 V ~ 5.5 V
• Independent Circuits: 1
• Delay Time - Propagation: 4.1ns
• Current - Output High, Low: 8mA, 8mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

paquet: 16-SOIC (0.154", 3.90mm Width)

74LVC241ADB,112

NXP

IC BUFF/DVR TRI-ST DUAL 20SSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

paquet: 20-SSOP (0.209", 5.30mm Width)

TDA19977AHV/15,551

NXP

IC HDMI INTERFACE 144HLQFP

• Applications: HDTV
• Interface: HDMI
• Voltage - Supply: 1.8V, 3.3V
• Package / Case: 144-LQFP Exposed Pad
• Supplier Device Package: 144-HLQFP (20x20)
• Mounting Type: Surface Mount

paquet: 144-LQFP Exposed Pad

MCZ33290EFR2

NXP

IC SER LNK INTER ISO KLINE 8SOIC

• Applications: Automotive
• Interface: Serial
• Voltage - Supply: 8 V ~ 18 V
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC
• Mounting Type: Surface Mount

paquet: 8-SOIC (0.154", 3.90mm Width)

PCA9513ADP,118

NXP

IC ACCELERATR I2C HOTSWAP 8TSSOP

• Type: Buffer, Accelerator
• Applications: I2C - Hotswap
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 400kHz
• Number of Channels: 1
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: 1.9pF
• Voltage - Supply: 2.7 V ~ 5.5 V
• Current - Supply: 3.5mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

MC68302FC25C

NXP

IC MPU M683XX 25MHZ 132QFP

• Core Processor: M68000
• Number of Cores/Bus Width: 1 Core, 8/16-Bit
• Speed: 25MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 132-BQFP Bumpered
• Supplier Device Package: 132-PQFP (24.13x24.13)

paquet: 132-BQFP Bumpered

MPC8541EPXAPF

NXP

IC MPU MPC85XX 833MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 833MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

MC908EY8AVFJE

NXP

IC MCU 8BIT 8KB FLASH 32LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: LIN, SCI, SPI
• Peripherals: POR, PWM
• Number of I/O: 24
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

S912XET256J2MALR

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

paquet: 112-LQFP

S9S08DV60F2MLC

NXP

IC MCU 8BIT 60KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

MC9S12XEP100CAG

NXP

IC MCU 16BIT 1MB FLASH 144LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

LM75BD,112

NXP

SENSOR TEMPERATURE I2C 8SO

• Sensor Type: Digital, Local
• Sensing Temperature - Local: -55°C ~ 125°C
• Sensing Temperature - Remote: -
• Output Type: I2C
• Voltage - Supply: 2.8 V ~ 5.5 V
• Resolution: 11 b
• Features: Output Switch, Programmable Limit
• Accuracy - Highest (Lowest): ±2°C (±3°C)
• Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

SL3S1204FTB0X

NXP

IC UCODE G2XL XSON6

• Type: RFID Transponder
• Frequency: 840MHz ~ 960MHz
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON (1.45x1.00)

paquet: 6-XFDFN

NHS3100/A1Z

NXP

TEMP SENSOR - HVQFN24 PACKAGE

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443
• Interface: I2C, SPI
• Voltage - Supply: 1.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

paquet: 24-VFQFN Exposed Pad

HTRC11001T/02EE,11

NXP

IC RFID HITAG READER 14-SOIC

• Type: RFID Reader
• Frequency: 125kHz
• Standards: -
• Interface: -
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

paquet: 14-SOIC (0.154", 3.90mm Width)

F104X8A

NXP

QSGMII QUAD GBE PHY EXT TMP

• Type: Transceiver
• Protocol: Gigabit Ethernet
• Number of Drivers/Receivers: 2/2
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 138-VQFN Exposed Pad
• Supplier Device Package: 138-QFN (12x12)

paquet: 138-VQFN Exposed Pad

SPC5634MF2MLQ80R

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z3
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 80
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 94K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
• Data Converters: A/D 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

paquet: 144-LQFP

S9S12G48F1CLCR

NXP

16-BIT MCU S12 CORE 48KB FLASH

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

FD32K146HAT0VLHT

NXP

S32K146 32-BIT MCU, ARM CORTEX-M

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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LS1018AXE7HNA

NXP

IC MPU QORIQ 800MHZ 448FBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 1 Core, 64-Bit
• Speed: 800MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: 1Gbps (1), 2.5Gbps (5)
• SATA: SATA 6Gbps (1)
• USB: -
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 448-BFBGA
• Supplier Device Package: 448-FBGA (17x17)

paquet: -

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LPC865M201JHI48-0E

NXP

IC MCU CORTEX M0+ HVQFN48

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 60MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 42
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 12x12b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)

paquet: -

SAF4000EL-103Q203Y

NXP

IC

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

Request a Quote