Produits NXP

MRF19030LSR3

NXP

FET RF 65V 1.96GHZ NI-400S

• Transistor Type: LDMOS
• Frequency: 1.96GHz
• Gain: 13dB
• Voltage - Test: 26V
• Current Rating: -
• Noise Figure: -
• Current - Test: 300mA
• Power - Output: 30W
• Voltage - Rated: 65V
• Package / Case: NI-400S
• Supplier Device Package: NI-400S

paquet: NI-400S

MMRF1304GNR1

NXP

FET RF 133V 512MHZ TO270-2

• Transistor Type: LDMOS
• Frequency: 512MHz
• Gain: 25.4dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 10mA
• Power - Output: 25W
• Voltage - Rated: 133V
• Package / Case: TO-270BA
• Supplier Device Package: TO-270G-2

paquet: TO-270BA

BZX84-C3V0/LF1VL

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 3V
• Tolerance: ±5%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 95 Ohms
• Current - Reverse Leakage @ Vr: 10µA @ 1V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

paquet: TO-236-3, SC-59, SOT-23-3

BZX284-C43,115

NXP

DIODE ZENER 43V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 43V
• Tolerance: ±5%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 80 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 30.1V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

paquet: SOD-110

TDA3681ATH/N1C,518

NXP

IC VOLT REG W/SW & IGNIT 20-HSOP

• Applications: Ignition Buffer, Regulator
• Current - Supply: 110µA
• Voltage - Supply: 9.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
• Supplier Device Package: 20-HSOP

paquet: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

PCF8562TT/S400/2,1

NXP

IC LCD DRIVER 48-TSSOP

• Display Type: LCD
• Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
• Interface: I2C, 2-Wire Serial
• Digits or Characters: 8 Characters, 16 Characters
• Current - Supply: 8µA
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 48-TSSOP

paquet: 48-TFSOP (0.240", 6.10mm Width)

74HCT40105D,112

NXP

IC 4X16 FIFO REGISTER 16-SOIC

• Memory Size: 64 (16 x 4)
• Function: Asynchronous
• Data Rate: 28MHz
• Access Time: 40ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Supply (Max): -
• Bus Directional: Uni-Directional
• Expansion Type: Depth, Width
• Programmable Flags Support: No
• Retransmit Capability: No
• FWFT Support: No
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

paquet: 16-SOIC (0.154", 3.90mm Width)

74LV367DB,118

NXP

IC BUFF DVR TRI-ST HEX 16SSOP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 2, 4 (Hex)
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 1 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 16-SSOP

paquet: 16-SSOP (0.209", 5.30mm Width)

TJA1042T/1J

NXP

IC TRANSCEIVER CAN HS 8SOIC

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 120mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

paquet: 8-SOIC (0.154", 3.90mm Width)

NX3DV2567HR-Q100X

NXP

IC ANLG SWITCH 4PDT 16HXQFN

• Applications: Networking
• Multiplexer/Demultiplexer Circuit: -
• Switch Circuit: 4PDT
• Number of Channels: 1
• On-State Resistance (Max): 700 mOhm
• Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
• Voltage - Supply, Dual (V±): -
• -3db Bandwidth: 160MHz
• Features: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 16-XFQFN Exposed Pad
• Supplier Device Package: 16-HXQFN (3x3)

paquet: 16-XFQFN Exposed Pad

MC68HC000IEI16R

NXP

IC MPU M680X0 16MHZ 68PLCC

• Core Processor: EC000
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 16MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 68-LCC (J-Lead)
• Supplier Device Package: 68-PLCC (25x25)

paquet: 68-LCC (J-Lead)

MC68EN360RC33L

NXP

IC MPU M683XX 33MHZ 241PGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 33MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 241-BEPGA
• Supplier Device Package: 241-PGA (47.24x47.24)

paquet: 241-BEPGA

MC68360CVR25L

NXP

IC MPU M683XX 25MHZ 357BGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

paquet: 357-BBGA

MC9328MXLVM15R2

NXP

IC MPU I.MXL 150MHZ 256MAPBGA

• Core Processor: ARM920T
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 150MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: LCD
• Ethernet: -
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 3.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 256-LFBGA
• Supplier Device Package: -

paquet: 256-LFBGA

MC68711E20MFNE3

NXP

IC MCU 8BIT 20KB OTP 52PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 38
• Program Memory Size: 20KB (20K x 8)
• Program Memory Type: OTP
• EEPROM Size: 512 x 8
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 52-LCC (J-Lead)
• Supplier Device Package: 52-PLCC (19.1x19.1)

paquet: 52-LCC (J-Lead)

MC9S12GC96MFUE

NXP

IC MCU 16BIT 96KB FLASH 80QFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 60
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

paquet: 80-QFP

MC100ES6226AC

NXP

IC CLK BUFFER 1:9 3GHZ 32LQFP

• Type: Fanout Buffer (Distribution), Divider
• Number of Circuits: 1
• Ratio - Input:Output: 1:9
• Differential - Input:Output: Yes/Yes
• Input: LVPECL
• Output: LVCMOS, LVPECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: 0°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

MPXV2053DP

NXP

SENSOR PRESSURE DIFF DUAL 8-SOP

• Pressure Type: Differential
• Operating Pressure: 7.25 PSI (50 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 40 mV (10V)
• Accuracy: -0.6% ~ 0.4%
• Voltage - Supply: 10 V ~ 16 V
• Port Size: Male - 0.13" (3.3mm) Tube, Dual
• Port Style: Barbed
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 29.01 PSI (200 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD Module
• Supplier Device Package: -

paquet: 8-SMD Module

MC33493DTBE

NXP

IC RF TRANSMITTER UHF 14-TSSOP

• Frequency: 315 ~ 434MHz, 868 ~ 928MHz
• Applications: General Data Transfer
• Modulation or Protocol: FSK, OOK
• Data Rate (Max): 10 kbps
• Power - Output: -3dBm
• Current - Transmitting: 11.6mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Memory Size: -
• Features: -
• Voltage - Supply: 1.9 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)

paquet: 14-TSSOP (0.173", 4.40mm Width)

JN516X-EK001Z

NXP

EVAL KIT JN516X

• Type: -
• Frequency: -
• For Use With/Related Products: -
• Supplied Contents: -

paquet: -

MC33FS6512CAER2

NXP

SYSTEM BASIS CHIP DCDC 1.5A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP Exposed Pad

S912XDP512J1MALR

NXP

16-BIT MCU S12X CORE 512KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CANbus, I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b, 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

paquet: 112-LQFP

SPC5603BK0VLL4

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 79
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 28K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

S9S12XS256J0VAAR

NXP

16-BIT MCU S12X CORE 256KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CANbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

paquet: 80-QFP

MK02FN64VFM10R

NXP

KINETIS K 32-BIT MCU ARM CORTEX

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM
• Number of I/O: 26
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 12x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

paquet: 32-VFQFN Exposed Pad

MC33PF8100EQESR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

• Applications: High Performance i.MX 8, S32x Processor Based
• Current - Supply: -
• Voltage - Supply: 2.5V ~ 5.5V
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

paquet: -

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SPC5606BAMLQ6R

NXP

NXP 32-BIT MCU, POWER ARCH CORE

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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S32G274AABK0VUCR

NXP

S32G274A ARM CORTEX-M7 AND -A53,

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
• Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
• Speed: 400MHz, 1GHz
• Co-Processors/DSP: Multimedia; NEON
• RAM Controllers: DDR3L, LPDDR4
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: GbE (4)
• SATA: -
• USB: USB 2.0 OTG (1)
• Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

paquet: -

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