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Produits NXP

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hot MCZ33880EW
NXP

IC SWITCH OCTAL SER I/O 32-SOIC

  • Switch Type: General Purpose
  • Number of Outputs: 8
  • Ratio - Input:Output: 1:8
  • Output Configuration: High Side or Low Side
  • Output Type: N-Channel
  • Interface: SPI
  • Voltage - Load: 5.5 V ~ 24.5 V
  • Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
  • Current - Output (Max): 800mA
  • Rds On (Typ): 550 mOhm
  • Input Type: -
  • Features: -
  • Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Package / Case: 32-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 32-SOIC
paquet: 32-SOIC (0.295", 7.50mm Width)
Stock8 976
hot MC33186VW2R2
NXP

IC MOTOR DRIVER PAR 20HSOP

  • Output Configuration: Half Bridge (2)
  • Applications: DC Motors, General Purpose, Solenoids
  • Interface: Logic
  • Load Type: Inductive
  • Technology: Bi-CMOS
  • Rds On (Typ): 150 mOhm
  • Current - Output / Channel: 5A
  • Current - Peak Output: -
  • Voltage - Supply: 5 V ~ 28 V
  • Voltage - Load: 5 V ~ 28 V
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Features: Status Flag
  • Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
  • Mounting Type: Surface Mount
  • Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
  • Supplier Device Package: 20-HSOP
paquet: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Stock200 376
PCA9306D,118
NXP

IC LEVEL TRANSLATOR 8-SOIC

  • Translator Type: Voltage Level
  • Channel Type: Bidirectional
  • Number of Circuits: 1
  • Channels per Circuit: 2
  • Voltage - VCCA: 1V ~ 3.6V
  • Voltage - VCCB: 1.8V ~ 5.5V
  • Input Signal: -
  • Output Signal: -
  • Output Type: Open Drain
  • Data Rate: -
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Features: Auto-Direction Sensing
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock248 262
TDA8563Q/N2,112
NXP

IC AMP AUDIO PWR 55W STER 13SIL

  • Type: Class B
  • Output Type: 2-Channel (Stereo)
  • Max Output Power x Channels @ Load: 55W x 2 @ 2 Ohm
  • Voltage - Supply: 6 V ~ 18 V
  • Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
  • Mounting Type: Through Hole
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Supplier Device Package: 13-PDBS
  • Package / Case: 13-SIP Formed Leads
paquet: 13-SIP Formed Leads
Stock3 312
hot MC34018DW
NXP

IC SPEAKERPHONE VOICE SW 28-SOIC

  • Function: Voice-Switched Speakerphone
  • Interface: -
  • Number of Circuits: 1
  • Voltage - Supply: 5.4V
  • Current - Supply: 9mA
  • Power (Watts): 100mW
  • Operating Temperature: -20°C ~ 60°C
  • Mounting Type: Surface Mount
  • Package / Case: 28-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 28-SOIC
paquet: 28-SOIC (0.295", 7.50mm Width)
Stock146 292
PCA9535CPW,112
NXP

IC I/O EXPANDER I2C 16B 24TSSOP

  • Number of I/O: 16
  • Interface: I2C, SMBus
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Open Drain
  • Current - Output Source/Sink: 10mA, 25mA
  • Clock Frequency: 400kHz
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 24-TSSOP
paquet: 24-TSSOP (0.173", 4.40mm Width)
Stock7 616
PCA9539PW,112
NXP

IC I/O EXPANDER I2C 16B 24TSSOP

  • Number of I/O: 16
  • Interface: I2C, SMBus
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Push-Pull
  • Current - Output Source/Sink: 10mA, 25mA
  • Clock Frequency: 400kHz
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 24-TSSOP
paquet: 24-TSSOP (0.173", 4.40mm Width)
Stock16 500
LS101MASE7EHA
NXP

IC PROCESSOR DUAL CORE

  • Core Processor: ARM1136JF-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 650MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: GbE (2)
  • SATA: -
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 448-FBGA Exposed Pad
  • Supplier Device Package: 448-PBGA w/Heat Spreader (23x23)
paquet: 448-FBGA Exposed Pad
Stock2 384
hot P5010NXE1QMB
NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

  • Core Processor: PowerPC e5500
  • Number of Cores/Bus Width: 1 Core, 64-Bit
  • Speed: 2.0GHz
  • Co-Processors/DSP: Security; SEC 4.2
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 1 Gbps (5), 10 Gbps (1)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
  • Package / Case: 1295-BBGA, FCBGA
  • Supplier Device Package: 1295-FCPBGA (37.5x37.5)
paquet: 1295-BBGA, FCBGA
Stock10 248
hot MPC8533EVTANG
NXP

IC MPU MPC85XX 800MHZ 783FCBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Security; SEC
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 90°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
paquet: 783-BBGA, FCBGA
Stock4 288
MPC8358ZQAGDDA
NXP

IC MPU MPC83XX 400MHZ 668BGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: Communications; QUICC Engine
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 668-BBGA Exposed Pad
  • Supplier Device Package: 668-PBGA-PGE (29x29)
paquet: 668-BBGA Exposed Pad
Stock7 664
MC68EC000CAA10
NXP

IC MPU M680X0 10MHZ 64QFP

  • Core Processor: EC000
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 10MHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: -
  • Package / Case: 64-QFP
  • Supplier Device Package: 64-QFP (14x14)
paquet: 64-QFP
Stock3 664
MC8641DTVJ1333JE
NXP

IC MPU E600 DUAL CORE 1023FCCBGA

  • Core Processor: PowerPC e600
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 1.333GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 1023-BCBGA, FCCBGA
  • Supplier Device Package: 1023-FCCBGA (33x33)
paquet: 1023-BCBGA, FCCBGA
Stock2 336
P1010NSE5DFB
NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Security; SEC 4.4
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
  • Package / Case: 425-FBGA
  • Supplier Device Package: 425-TEPBGA I (19x19)
paquet: 425-FBGA
Stock6 080
hot MC9S08JR12FAE
NXP

IC MCU 8BIT 12KB FLASH 48LQFP

  • Core Processor: -
  • Core Size: 8-Bit
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: 12KB (12K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock886 212
MC9S12GC128MPBE
NXP

IC MCU 16BIT 128KB FLASH 52LQFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 35
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 52-LQFP
  • Supplier Device Package: 52-LQFP (10x10)
paquet: 52-LQFP
Stock5 408
hot MMC2107CFCAF33
NXP

IC MCU 32BIT 128KB FLASH 100LQFP

  • Core Processor: M210
  • Core Size: 32-Bit
  • Speed: 33MHz
  • Connectivity: EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 72
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
paquet: 100-LQFP
Stock11 112
P87C660X2BBD,157
NXP

IC MCU 8BIT 16KB OTP 44LQFP

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 33MHz
  • Connectivity: EBI/EMI, I2C, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 32
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 44-LQFP
  • Supplier Device Package: 44-LQFP (10x10)
paquet: 44-LQFP
Stock3 344
MC68HC908LK24CPB
NXP

IC MCU 8BIT 24KB FLASH 64LQFP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: I2C, IRSCI, SPI
  • Peripherals: LCD, LVD, POR, PWM
  • Number of I/O: 40
  • Program Memory Size: 24KB (24K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768 x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 6x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock3 328
SVF331R3K2CKU2
NXP

IC MCU 32BIT ROMLESS 176LQFP

  • Core Processor: ARM? Cortex?-A5 + Cortex?-M4
  • Core Size: 32-Bit Dual-Core
  • Speed: 266MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
  • Peripherals: LCD, SAI
  • Number of I/O: 115
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 1.5MB
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 984
ICM7555ID,623
NXP

IC OSC SGL TIMER 500KHZ 8-SOIC

  • Type: 555 Type, Timer/Oscillator (Single)
  • Count: -
  • Frequency: 500kHz
  • Voltage - Supply: 3 V ~ 16 V
  • Current - Supply: 180µA
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
  • Mounting Type: Surface Mount
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock3 248
hot MP3V5004GC6U
NXP

IC PRESSURE SENSOR 8-SOP

  • Pressure Type: Vented Gauge
  • Operating Pressure: 0.57 PSI (3.92 kPa)
  • Output Type: Analog Voltage
  • Output: 0.6 V ~ 3 V
  • Accuracy: ±2.5%
  • Voltage - Supply: 2.7 V ~ 3.3 V
  • Port Size: Male - 0.13" (3.17mm) Tube
  • Port Style: Barbless
  • Features: Temperature Compensated
  • Termination Style: PCB
  • Maximum Pressure: 2.32 PSI (16 kPa)
  • Operating Temperature: 0°C ~ 85°C
  • Package / Case: 8-SMD, Gull Wing, Top Port
  • Supplier Device Package: -
paquet: 8-SMD, Gull Wing, Top Port
Stock6 210
MMA6280QR2
NXP

ACCELEROMETER 1.5-6G ANAL 16QFN

  • Type: Analog
  • Axis: X, Z
  • Acceleration Range: ±1.5g, 2g, 4g, 6g
  • Sensitivity (LSB/g): -
  • Sensitivity (mV/g): 800 (±1.5g) ~ 200 (±6g)
  • Bandwidth: 350Hz (X), 150Hz (Z)
  • Output Type: Analog Voltage
  • Voltage - Supply: 2.2 V ~ 3.6 V
  • Features: Selectable Scale, Sleep Mode
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 16-LQFN Exposed Pad
  • Supplier Device Package: 16-QFN (6x6)
paquet: 16-LQFN Exposed Pad
Stock4 608
MCIMX7S3EVK08SD
NXP

I.MX 7SOLO: REV 1.3

  • Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Multimedia; NEON™ MPE
  • RAM Controllers: LPDDR2, LPDDR3, DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: Keypad, LCD, MIPI
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
  • Voltage - I/O: 1.8V, 3.3V
  • Operating Temperature: -20°C ~ 105°C (TJ)
  • Security Features: A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
  • Package / Case: 488-TFBGA
  • Supplier Device Package: 488-FBGA (12x12)
paquet: 488-TFBGA
Stock6 636
SPC5602DF1VLH3R
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 32MHz
  • Connectivity: CANbus, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 45
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock7 776
S32K324NHT1VMMST
NXP

S32K324 ARM CORTEX-M7, 160 MHZ,

  • Core Processor: ARM® Cortex®-M7
  • Core Size: 32-Bit Dual-Core
  • Speed: 160MHz
  • Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
  • Peripherals: DMA, I2S, Serial Audio, WDT
  • Number of I/O: 218
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 24x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-LFBGA (14x14)
paquet: -
Request a Quote
LS1028ASE7HNA
NXP

IC MPU QORIQ 800MHZ 448FBGA

  • Core Processor: ARM® Cortex®-A72
  • Number of Cores/Bus Width: 2 Core, 64-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: 1Gbps (1), 2.5Gbps (5)
  • SATA: SATA 6Gbps (1)
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 448-BFBGA
  • Supplier Device Package: 448-FBGA (17x17)
paquet: -
Request a Quote
MC33FS8430G0ESR2
NXP

SYSTEM BASIS CHIP FS8430

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
paquet: -
Request a Quote