Page 12 - Produits NXP | Heisener Electronics

Référence	Fabricant	Description	paquet	Stock
PH2030AL,115	NXP	MOSFET N-CH 30V LFPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: - Drive Voltage (Max Rds On, Min Rds On): - Vgs(th) (Max) @ Id: - Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: - Vgs (Max): - FET Feature: - Power Dissipation (Max): - Rds On (Max) @ Id, Vgs: - Operating Temperature: - Mounting Type: Surface Mount Supplier Device Package: LFPAK56, Power-SO8 Package / Case: SC-100, SOT-669	paquet: SC-100, SOT-669	Stock4 896
PSMN3R2-25YLC,115	NXP	MOSFET N-CH 25V 100A LFPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 25V Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 1.95V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 30nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 1781pF @ 12V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 79W (Tc) Rds On (Max) @ Id, Vgs: 3.4 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: LFPAK56, Power-SO8 Package / Case: SC-100, SOT-669	paquet: SC-100, SOT-669	Stock4 720
2PD602AR,115	NXP	TRANS NPN 50V 0.5A SC-59 Transistor Type: NPN Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA Current - Collector Cutoff (Max): 10nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 150mA, 10V Power - Max: 250mW Frequency - Transition: 160MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	paquet: TO-236-3, SC-59, SOT-23-3	Stock7 216
BC879,112	NXP	TRANS NPN DARL 80V 1A TO-92 Transistor Type: NPN - Darlington Current - Collector (Ic) (Max): 1A Voltage - Collector Emitter Breakdown (Max): 80V Vce Saturation (Max) @ Ib, Ic: 1.8V @ 1mA, 1A Current - Collector Cutoff (Max): 50nA DC Current Gain (hFE) (Min) @ Ic, Vce: 2000 @ 500mA, 10V Power - Max: 830mW Frequency - Transition: 200MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	paquet: TO-226-3, TO-92-3 (TO-226AA)	Stock4 512
BZX84-C3V9/LF1R	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 3.9V Tolerance: ±5% Power - Max: 250mW Impedance (Max) (Zzt): 90 Ohms Current - Reverse Leakage @ Vr: 3µA @ 1V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	paquet: TO-236-3, SC-59, SOT-23-3	Stock3 696
I74F164D,112	NXP	IC 8BIT SERIAL SHIFT REG 14SOIC Logic Type: Shift Register Output Type: Push-Pull Number of Elements: 1 Number of Bits per Element: 8 Function: Serial to Parallel Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	paquet: 14-SOIC (0.154", 3.90mm Width)	Stock5 744
74HCT93N,112	NXP	IC 4BIT BIN RIPPLE COUNT 14DIP Logic Type: Binary Counter Direction: Up Number of Elements: 1 Number of Bits per Element: 4 Reset: Asynchronous Timing: - Count Rate: 70MHz Trigger Type: Negative Edge Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 14-DIP (0.300", 7.62mm) Supplier Device Package: 14-DIP	paquet: 14-DIP (0.300", 7.62mm)	Stock7 552
TDA9889TS/V1,518	NXP	IC AGC AMPLIFIER 16SSOP Applications: Automatic Gain Control (AGC) Output Type: - Number of Circuits: 1 -3db Bandwidth: - Slew Rate: - Current - Supply: 55mA Current - Output / Channel: - Voltage - Supply, Single/Dual (±): 4.5 V ~ 5.5 V Mounting Type: Surface Mount Package / Case: 16-SSOP (0.209", 5.30mm Width) Supplier Device Package: 16-SSOP	paquet: 16-SSOP (0.209", 5.30mm Width)	Stock3 200
SC28L92A1BS,528	NXP	IC UART DUAL W/FIFO 48HVQFN Features: Configurable GPIO, Internal Oscillator, Timer/Counter Number of Channels: 2, DUART FIFO's: 16 Byte Protocol: - Data Rate (Max): 1Mbps Voltage - Supply: 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (6x6)	paquet: 48-VFQFN Exposed Pad	Stock4 928
TDA8020HL/C1,118	NXP	IC SMART CARD INTERFACE 32LQFP Applications: Set-Top Boxes Interface: - Voltage - Supply: 2.7 V ~ 6.5 V Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7) Mounting Type: Surface Mount	paquet: 32-LQFP	Stock6 272
SC26C562C1A,512	NXP	IC DUAL SRL COMM CTRLR 52-PLCC Applications: - Interface: DMA Voltage - Supply: 4.5 V ~ 5.5 V Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.2x19.2) Mounting Type: Surface Mount	paquet: 52-LCC (J-Lead)	Stock3 520
MC145574ADW	NXP	IC TRANSCEIVER ISDN 28-SOIC Type: Transceiver Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: - Mounting Type: Surface Mount Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	paquet: 28-SOIC (0.295", 7.50mm Width)	Stock16 656
UJA1018TK,118	NXP	IC TRANSCEIVER LIN 16HVSON Type: Transceiver Protocol: LIN Number of Drivers/Receivers: 1/1 Duplex: - Receiver Hysteresis: 175mV Data Rate: - Voltage - Supply: 4.9 V ~ 5.1 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 16-VDFN Exposed Pad Supplier Device Package: 16-HVSON (3.5x5.5)	paquet: 16-VDFN Exposed Pad	Stock7 872
MPC8264AVVPIBB	NXP	IC MPU MPC82XX 300MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	paquet: 480-LBGA	Stock4 112
MPC8347EZQAGDB	NXP	IC MPU MPC83XX 400MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	paquet: 620-BBGA Exposed Pad	Stock3 456
MC908GR16AVFAER	NXP	IC MCU 8BIT 16KB FLASH 48LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: LIN, SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 37 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	paquet: 48-LQFP	Stock4 176
P89V662FBC,557	NXP	IC MCU 8BIT 32KB FLASH 44TQFP Core Processor: 8051 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 36 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-TQFP Supplier Device Package: 44-TQFP (10x10)	paquet: 44-TQFP	Stock3 840
MC9S08PA32AVLH	NXP	IC MCU 8BIT 32KB FLASH 64LQFP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 57 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	paquet: 64-LQFP	Stock4 160
MMA6331LR2	NXP	ACCELEROMETER 4-9G ANALOG 14LGA Type: Analog Axis: X, Y Acceleration Range: ±4g, 9g Sensitivity (LSB/g): - Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g) Bandwidth: 400Hz Output Type: Analog Voltage Voltage - Supply: 2.2 V ~ 3.6 V Features: Selectable Scale, Sleep Mode Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 14-VFLGA Supplier Device Package: 14-LGA (3x5)	paquet: 14-VFLGA	Stock8 730
HTSICH5801EW/V7V	NXP	HITAG UNCASED Style: - Technology: - Frequency: - Memory Type: - Writable Memory: - Standards: - Operating Temperature: - Size / Dimension: -	paquet: -	Stock2 952
PCF7961MTT/D1AE13J	NXP	IC REMOTE KEYLESS ENTRY 20TSSOP Frequency: - Applications: - Modulation or Protocol: - Data Rate (Max): - Power - Output: - Current - Transmitting: - Data Interface: - Antenna Connector: - Memory Size: - Features: - Voltage - Supply: - Operating Temperature: - Package / Case: -	paquet: -	Stock4 104
NX18P3001UKZ	NXP	IC PWR SWITCH ESD PROT 12WLCSP Switch Type: USB Switch Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: On/Off Voltage - Load: 3 V ~ 30 V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 3A Rds On (Typ): 62 mOhm Input Type: - Features: Slew Rate Controlled Fault Protection: Over Temperature, UVLO Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 12-UFBGA, WLCSP Supplier Device Package: 12-WLCSP (1.6x1.3)	paquet: 12-UFBGA, WLCSP	Stock5 184
LS1023ASN7MNLB	NXP	QORIQ 2XCPU 64-BIT ARM ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	paquet: -	Stock5 488
SPC5674FF3MVR3R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z7 Core Size: 32-Bit Speed: 264MHz Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Number of I/O: 32 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V Data Converters: A/D 64x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	paquet: 416-BBGA	Stock6 400
SPC5644CF0MLU1	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 147 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 27x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	paquet: 176-LQFP	Stock6 800
MKE14Z64VLF4R	NXP	MT64P 48LQFP Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 12x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	paquet: -	Request a Quote
S9S12G64J0CLF	NXP	S12 CORE,64K FLASH,AU Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	paquet: -	Request a Quote
SPC5746CK1AVKU6	NXP	IC MCU 32BIT 3MB FLASH 176LQFP Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI Peripherals: DMA, I2S, LVD/HVD, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 128K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Data Converters: A/D 68x10b, 31x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	paquet: -	Request a Quote

PH2030AL,115

NXP

MOSFET N-CH 30V LFPAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: -
Drive Voltage (Max Rds On, Min Rds On): -
Vgs(th) (Max) @ Id: -
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: -
Vgs (Max): -
FET Feature: -
Power Dissipation (Max): -
Rds On (Max) @ Id, Vgs: -
Operating Temperature: -
Mounting Type: Surface Mount
Supplier Device Package: LFPAK56, Power-SO8
Package / Case: SC-100, SOT-669

paquet: SC-100, SOT-669

Stock4 896

PSMN3R2-25YLC,115

NXP

MOSFET N-CH 25V 100A LFPAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 25V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 30nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 1781pF @ 12V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 79W (Tc)
Rds On (Max) @ Id, Vgs: 3.4 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: LFPAK56, Power-SO8
Package / Case: SC-100, SOT-669

paquet: SC-100, SOT-669

Stock4 720

2PD602AR,115

NXP

TRANS NPN 50V 0.5A SC-59

Transistor Type: NPN
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 600mV @ 30mA, 300mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 150mA, 10V
Power - Max: 250mW
Frequency - Transition: 160MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

paquet: TO-236-3, SC-59, SOT-23-3

Stock7 216

BC879,112

NXP

TRANS NPN DARL 80V 1A TO-92

Transistor Type: NPN - Darlington
Current - Collector (Ic) (Max): 1A
Voltage - Collector Emitter Breakdown (Max): 80V
Vce Saturation (Max) @ Ib, Ic: 1.8V @ 1mA, 1A
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 2000 @ 500mA, 10V
Power - Max: 830mW
Frequency - Transition: 200MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Supplier Device Package: TO-92-3

paquet: TO-226-3, TO-92-3 (TO-226AA)

Stock4 512

BZX84-C3V9/LF1R

NXP

DIODE ZENER TO-236AB SOT23

Voltage - Zener (Nom) (Vz): 3.9V
Tolerance: ±5%
Power - Max: 250mW
Impedance (Max) (Zzt): 90 Ohms
Current - Reverse Leakage @ Vr: 3µA @ 1V
Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

paquet: TO-236-3, SC-59, SOT-23-3

Stock3 696

I74F164D,112

NXP

IC 8BIT SERIAL SHIFT REG 14SOIC

Logic Type: Shift Register
Output Type: Push-Pull
Number of Elements: 1
Number of Bits per Element: 8
Function: Serial to Parallel
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

paquet: 14-SOIC (0.154", 3.90mm Width)

Stock5 744

74HCT93N,112

NXP

IC 4BIT BIN RIPPLE COUNT 14DIP

Logic Type: Binary Counter
Direction: Up
Number of Elements: 1
Number of Bits per Element: 4
Reset: Asynchronous
Timing: -
Count Rate: 70MHz
Trigger Type: Negative Edge
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 14-DIP (0.300", 7.62mm)
Supplier Device Package: 14-DIP

paquet: 14-DIP (0.300", 7.62mm)

Stock7 552

TDA9889TS/V1,518

NXP

IC AGC AMPLIFIER 16SSOP

Applications: Automatic Gain Control (AGC)
Output Type: -
Number of Circuits: 1
-3db Bandwidth: -
Slew Rate: -
Current - Supply: 55mA
Current - Output / Channel: -
Voltage - Supply, Single/Dual (±): 4.5 V ~ 5.5 V
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 16-SSOP

paquet: 16-SSOP (0.209", 5.30mm Width)

Stock3 200

SC28L92A1BS,528

NXP

IC UART DUAL W/FIFO 48HVQFN

Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Number of Channels: 2, DUART
FIFO's: 16 Byte
Protocol: -
Data Rate (Max): 1Mbps
Voltage - Supply: 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: -
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (6x6)

paquet: 48-VFQFN Exposed Pad

Stock4 928

TDA8020HL/C1,118

NXP

IC SMART CARD INTERFACE 32LQFP

Applications: Set-Top Boxes
Interface: -
Voltage - Supply: 2.7 V ~ 6.5 V
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)
Mounting Type: Surface Mount

paquet: 32-LQFP

Stock6 272

SC26C562C1A,512

NXP

IC DUAL SRL COMM CTRLR 52-PLCC

Applications: -
Interface: DMA
Voltage - Supply: 4.5 V ~ 5.5 V
Package / Case: 52-LCC (J-Lead)
Supplier Device Package: 52-PLCC (19.2x19.2)
Mounting Type: Surface Mount

paquet: 52-LCC (J-Lead)

Stock3 520

MC145574ADW

NXP

IC TRANSCEIVER ISDN 28-SOIC

Type: Transceiver
Protocol: -
Number of Drivers/Receivers: -
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

paquet: 28-SOIC (0.295", 7.50mm Width)

Stock16 656

UJA1018TK,118

NXP

IC TRANSCEIVER LIN 16HVSON

Type: Transceiver
Protocol: LIN
Number of Drivers/Receivers: 1/1
Duplex: -
Receiver Hysteresis: 175mV
Data Rate: -
Voltage - Supply: 4.9 V ~ 5.1 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 16-VDFN Exposed Pad
Supplier Device Package: 16-HVSON (3.5x5.5)

paquet: 16-VDFN Exposed Pad

Stock7 872

MPC8264AVVPIBB

NXP

IC MPU MPC82XX 300MHZ 408TBGA

Core Processor: PowerPC G2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 300MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

paquet: 480-LBGA

Stock4 112

MPC8347EZQAGDB

NXP

IC MPU MPC83XX 400MHZ 620BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 620-BBGA Exposed Pad
Supplier Device Package: 620-PBGA (29x29)

paquet: 620-BBGA Exposed Pad

Stock3 456

MC908GR16AVFAER

NXP

IC MCU 8BIT 16KB FLASH 48LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: LIN, SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 37
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

Stock4 176

P89V662FBC,557

NXP

IC MCU 8BIT 32KB FLASH 44TQFP

Core Processor: 8051
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 36
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-TQFP
Supplier Device Package: 44-TQFP (10x10)

paquet: 44-TQFP

Stock3 840

MC9S08PA32AVLH

NXP

IC MCU 8BIT 32KB FLASH 64LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 57
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

Stock4 160

MMA6331LR2

NXP

ACCELEROMETER 4-9G ANALOG 14LGA

Type: Analog
Axis: X, Y
Acceleration Range: ±4g, 9g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
Bandwidth: 400Hz
Output Type: Analog Voltage
Voltage - Supply: 2.2 V ~ 3.6 V
Features: Selectable Scale, Sleep Mode
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 14-VFLGA
Supplier Device Package: 14-LGA (3x5)

paquet: 14-VFLGA

Stock8 730

HTSICH5801EW/V7V

NXP

HITAG UNCASED

Style: -
Technology: -
Frequency: -
Memory Type: -
Writable Memory: -
Standards: -
Operating Temperature: -
Size / Dimension: -

paquet: -

Stock2 952

PCF7961MTT/D1AE13J

NXP

IC REMOTE KEYLESS ENTRY 20TSSOP

Frequency: -
Applications: -
Modulation or Protocol: -
Data Rate (Max): -
Power - Output: -
Current - Transmitting: -
Data Interface: -
Antenna Connector: -
Memory Size: -
Features: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: -

paquet: -

Stock4 104

NX18P3001UKZ

NXP

IC PWR SWITCH ESD PROT 12WLCSP

Switch Type: USB Switch
Number of Outputs: 1
Ratio - Input:Output: 1:1
Output Configuration: High Side
Output Type: N-Channel
Interface: On/Off
Voltage - Load: 3 V ~ 30 V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3A
Rds On (Typ): 62 mOhm
Input Type: -
Features: Slew Rate Controlled
Fault Protection: Over Temperature, UVLO
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 12-UFBGA, WLCSP
Supplier Device Package: 12-WLCSP (1.6x1.3)

paquet: 12-UFBGA, WLCSP

Stock5 184

LS1023ASN7MNLB

NXP

QORIQ 2XCPU 64-BIT ARM ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock5 488

SPC5674FF3MVR3R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z7
Core Size: 32-Bit
Speed: 264MHz
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Number of I/O: 32
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V
Data Converters: A/D 64x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

paquet: 416-BBGA

Stock6 400

SPC5644CF0MLU1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 147
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 27x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

paquet: 176-LQFP

Stock6 800

MKE14Z64VLF4R

NXP

MT64P 48LQFP

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 12x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

paquet: -

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S9S12G64J0CLF

NXP

S12 CORE,64K FLASH,AU

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

paquet: -

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SPC5746CK1AVKU6

NXP

IC MCU 32BIT 3MB FLASH 176LQFP

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz, 160MHz
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Number of I/O: 129
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 128K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Data Converters: A/D 68x10b, 31x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

paquet: -

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