Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU MPC83XX 400MHZ 689TEBGA
|
paquet: 689-BBGA Exposed Pad |
Stock4 672 |
|
1 Core, 32-Bit | 400MHz | Security; SEC 3.0 | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 533MHZ 689TEBGA
|
paquet: 689-BBGA Exposed Pad |
Stock5 568 |
|
1 Core, 32-Bit | 533MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
paquet: 689-BBGA Exposed Pad |
Stock4 672 |
|
1 Core, 32-Bit | 800MHz | Communications; QUICC Engine | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 105°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
paquet: 561-FBGA |
Stock5 808 |
|
2 Core, 32-Bit | 667MHz | Communications; QUICC Engine, Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | 0°C ~ 125°C (TA) | Cryptography, Random Number Generator | 561-FBGA | 561-TEPBGA1 (23x23) |
||
NXP |
IC MPU I.MX6D 852MHZ 624FCBGA
|
paquet: 624-FBGA, FCBGA |
Stock4 160 |
|
2 Core, 32-Bit | 852MHZ | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
paquet: 561-FBGA |
Stock4 624 |
|
2 Core, 32-Bit | 667MHz | Security; SEC 3.3 | DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | -40°C ~ 125°C (TA) | Cryptography, Random Number Generator | 561-FBGA | 561-TEPBGA1 (23x23) |
||
NXP |
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
paquet: 624-FBGA, FCBGA |
Stock6 128 |
|
2 Core, 32-Bit | 1.0GHz | Multimedia; NEON? SIMD | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | 1.8V, 2.5V, 2.8V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 624-FBGA, FCBGA | 624-FCBGA (21x21) |
||
NXP |
IC MPU Q OR IQ 1.0GHZ 425TEBGA
|
paquet: 425-FBGA |
Stock4 400 |
|
1 Core, 32-Bit | 1.0GHz | - | DDR3, DDR3L | No | - | 10/100/1000 Mbps (3) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | - | -40°C ~ 105°C (TA) | - | 425-FBGA | 425-TEPBGA I (19x19) |
||
NXP |
IC MPU MPC82XX 400MHZ 516BGA
|
paquet: 516-BBGA |
Stock5 152 |
|
1 Core, 32-Bit | 400MHz | Communications; RISC CPM, Security; SEC | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC82XX 400MHZ 516BGA
|
paquet: 516-BBGA |
Stock5 616 |
|
1 Core, 32-Bit | 400MHz | Communications; RISC CPM, Security; SEC | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU Q OR IQ 1.055GHZ 689TBGA
|
paquet: 689-BBGA Exposed Pad |
Stock4 720 |
|
1 Core, 32-Bit | 1.055GHz | - | DDR2, DDR3 | No | LCD | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | 0°C ~ 105°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC8XX 50MHZ 256BGA
|
paquet: 256-BBGA |
Stock20 292 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | -40°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC8XX 50MHZ 256BGA
|
paquet: 256-BBGA |
Stock6 288 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | -40°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU M683XX 25MHZ 144LQFP
|
paquet: 144-LQFP |
Stock5 600 |
|
1 Core, 8/16-Bit | 25MHz | Communications; RISC CPM | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
IC MPU Q OR IQ 800MHZ 457TEBGA
|
paquet: 457-LFBGA |
Stock7 792 |
|
1 Core, 32-Bit | 800MHz | Security; SEC 4.2 | DDR3, DDR3L | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 457-LFBGA | 457-TEPBGA-1 (19x19) |
||
NXP |
IC MPU MPC82XX 400MHZ 516BGA
|
paquet: 516-BBGA |
Stock2 000 |
|
1 Core, 32-Bit | 400MHz | Communications; RISC CPM, Security; SEC | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC8XX 50MHZ 256BGA
|
paquet: 256-BBGA |
Stock19 080 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | 0°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC8XX 50MHZ 256BGA
|
paquet: 256-BBGA |
Stock5 488 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | USB 1.x (1) | 3.3V | 0°C ~ 95°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC83XX 400MHZ 668BGA
|
paquet: 668-BBGA Exposed Pad |
Stock4 720 |
|
1 Core, 32-Bit | 400MHz | Communications; QUICC Engine, Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (1) | - | USB 1.x (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 668-BBGA Exposed Pad | 668-PBGA-PGE (29x29) |
||
NXP |
IC MPU MPC8XX 50MHZ 357BGA
|
paquet: 357-BBGA |
Stock5 600 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC8XX 50MHZ 357BGA
|
paquet: 357-BBGA |
Stock3 808 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1), 10/100 Mbps (1) | - | - | 3.3V | -40°C ~ 95°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC52XX 400MHZ 272BGA
|
paquet: 272-BBGA |
Stock4 736 |
|
1 Core, 32-Bit | 400MHz | - | DDR, SDRAM | No | - | 10/100 Mbps (1) | - | USB 1.1 (2) | 2.5V, 3.3V | 0°C ~ 70°C (TA) | - | 272-BBGA | 272-PBGA (27x27) |
||
NXP |
IC MPU M683XX 25MHZ 132QFP
|
paquet: 132-BQFP Bumpered |
Stock7 584 |
|
1 Core, 8/16-Bit | 25MHz | Communications; RISC CPM | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) |
||
NXP |
IC MPU M683XX 25MHZ 132QFP
|
paquet: 132-BQFP Bumpered |
Stock6 432 |
|
1 Core, 8/16-Bit | 25MHz | Communications; RISC CPM | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) |
||
NXP |
IC MPU MPC82XX 400MHZ 516BGA
|
paquet: 516-BBGA |
Stock6 784 |
|
1 Core, 32-Bit | 400MHz | Communications; RISC CPM, Security; SEC | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
paquet: 620-BBGA Exposed Pad |
Stock21 144 |
|
1 Core, 32-Bit | 400MHz | Security; SEC | DDR, DDR2 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | Cryptography, Random Number Generator | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU M683XX 25MHZ 144LQFP
|
paquet: 144-LQFP |
Stock16 416 |
|
1 Core, 32-Bit | 25MHz | - | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
IC MPU M683XX 16MHZ 144LQFP
|
paquet: 144-LQFP |
Stock5 584 |
|
1 Core, 32-Bit | 16MHz | - | DRAM | No | - | - | - | - | 3.3V | 0°C ~ 70°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |