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Produits NXP - Embarqués - Microcontrôleurs

Dossiers 9 482
Page  261/339
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Core Size
Speed
Connectivity
Peripherals
Number of I/O
Program Memory Size
Program Memory Type
EEPROM Size
RAM Size
Voltage - Supply (Vcc/Vdd)
Data Converters
Oscillator Type
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
hot SPC5675KFF0MMS2
NXP

IC MCU 32BIT 2MB FLASH 473MAPBGA

  • Core Processor: e200z7d
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
  • Data Converters: A/D 34x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 473-LFBGA
  • Supplier Device Package: 473-MAPBGA (19x19)
paquet: 473-LFBGA
Stock4 064
32-Bit
180MHz
CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
DMA, POR, PWM, WDT
-
2MB (2M x 8)
FLASH
64K x 8
512K x 8
1.14 V ~ 1.32 V
A/D 34x12b
Internal
-40°C ~ 125°C (TA)
-
473-LFBGA
473-MAPBGA (19x19)
SPC5674KF0VMS2R
NXP

IC MCU 32BIT 1.5MB FLASH 473BGA

  • Core Processor: e200z7d
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 384K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
  • Data Converters: A/D 34x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 473-LFBGA
  • Supplier Device Package: 473-MAPBGA (19x19)
paquet: 473-LFBGA
Stock6 032
32-Bit
180MHz
CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
DMA, POR, PWM, WDT
-
1.5MB (1.5M x 8)
FLASH
64K x 8
384K x 8
1.14 V ~ 1.32 V
A/D 34x12b
Internal
-40°C ~ 105°C (TA)
-
473-LFBGA
473-MAPBGA (19x19)
hot MCF5475VR200
NXP

IC MCU 32BIT ROMLESS 388PBGA

  • Core Processor: Coldfire V4E
  • Core Size: 32-Bit
  • Speed: 200MHz
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 99
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 388-BBGA
  • Supplier Device Package: 388-PBGA (27x27)
paquet: 388-BBGA
Stock4 416
32-Bit
200MHz
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
DMA, PWM, WDT
99
-
ROMless
-
32K x 8
1.43 V ~ 1.58 V
-
External
0°C ~ 70°C (TA)
-
388-BBGA
388-PBGA (27x27)
SC68376BGVAB25
NXP

IC MCU 32BIT ROMLESS 160QFP

  • Core Processor: CPU32
  • Core Size: 32-Bit
  • Speed: 25MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 18
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 7.5K x 8
  • Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-QFP (28x28)
paquet: 160-BQFP
Stock3 056
32-Bit
25MHz
CAN, EBI/EMI, SCI, SPI
POR, PWM, WDT
18
-
ROMless
-
7.5K x 8
4.75 V ~ 5.25 V
A/D 16x10b
External
-40°C ~ 105°C (TA)
-
160-BQFP
160-QFP (28x28)
SC68376BGMAB20
NXP

IC MCU 32BIT ROMLESS 160QFP

  • Core Processor: CPU32
  • Core Size: 32-Bit
  • Speed: 20MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 18
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 7.5K x 8
  • Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-QFP (28x28)
paquet: 160-BQFP
Stock5 680
32-Bit
20MHz
CAN, EBI/EMI, SCI, SPI
POR, PWM, WDT
18
-
ROMless
-
7.5K x 8
4.75 V ~ 5.25 V
A/D 16x10b
External
-40°C ~ 125°C (TA)
-
160-BQFP
160-QFP (28x28)
SC68376BAMAB20
NXP

IC MCU 32BIT ROMLESS 160QFP

  • Core Processor: CPU32
  • Core Size: 32-Bit
  • Speed: 20MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 18
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 7.5K x 8
  • Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-QFP (28x28)
paquet: 160-BQFP
Stock3 376
32-Bit
20MHz
CAN, EBI/EMI, SCI, SPI
POR, PWM, WDT
18
-
ROMless
-
7.5K x 8
4.75 V ~ 5.25 V
A/D 16x10b
External
-40°C ~ 125°C (TA)
-
160-BQFP
160-QFP (28x28)
SC68376BGMAB20R
NXP

IC MCU 32BIT ROMLESS 160QFP

  • Core Processor: CPU32
  • Core Size: 32-Bit
  • Speed: 20MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 18
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 7.5K x 8
  • Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-QFP (28x28)
paquet: 160-BQFP
Stock7 920
32-Bit
20MHz
CAN, EBI/EMI, SCI, SPI
POR, PWM, WDT
18
-
ROMless
-
7.5K x 8
4.75 V ~ 5.25 V
A/D 16x10b
External
-40°C ~ 125°C (TA)
-
160-BQFP
160-QFP (28x28)
SC439639VAB25R
NXP

32BIT MCU 8K ROM

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 472
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
hot SPC5674KF0VMS2
NXP

IC MCU 32BIT 1.5MB FLASH 473BGA

  • Core Processor: e200z7d
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 384K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
  • Data Converters: A/D 34x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 473-LFBGA
  • Supplier Device Package: 473-MAPBGA (19x19)
paquet: 473-LFBGA
Stock9 660
32-Bit
180MHz
CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
DMA, POR, PWM, WDT
-
1.5MB (1.5M x 8)
FLASH
64K x 8
384K x 8
1.14 V ~ 1.32 V
A/D 34x12b
Internal
-40°C ~ 105°C (TA)
-
473-LFBGA
473-MAPBGA (19x19)
SC68376BGCAB25
NXP

IC MCU 32BIT ROMLESS 160QFP

  • Core Processor: CPU32
  • Core Size: 32-Bit
  • Speed: 25MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 18
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 7.5K x 8
  • Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-QFP (28x28)
paquet: 160-BQFP
Stock6 768
32-Bit
25MHz
CAN, EBI/EMI, SCI, SPI
POR, PWM, WDT
18
-
ROMless
-
7.5K x 8
4.75 V ~ 5.25 V
A/D 16x10b
External
-40°C ~ 85°C (TA)
-
160-BQFP
160-QFP (28x28)
SC68376BACAB25
NXP

IC MCU 32BIT ROMLESS 160QFP

  • Core Processor: CPU32
  • Core Size: 32-Bit
  • Speed: 25MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 18
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 7.5K x 8
  • Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-QFP (28x28)
paquet: 160-BQFP
Stock2 448
32-Bit
25MHz
CAN, EBI/EMI, SCI, SPI
POR, PWM, WDT
18
-
ROMless
-
7.5K x 8
4.75 V ~ 5.25 V
A/D 16x10b
External
-40°C ~ 85°C (TA)
-
160-BQFP
160-QFP (28x28)
MCF5307CAI90B
NXP

IC MCU 32BIT ROMLESS 208FQFP

  • Core Processor: Coldfire V3
  • Core Size: 32-Bit
  • Speed: 90MHz
  • Connectivity: EBI/EMI, I2C, UART/USART
  • Peripherals: DMA, POR, WDT
  • Number of I/O: 16
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-FQFP (28x28)
paquet: 208-BFQFP
Stock7 904
32-Bit
90MHz
EBI/EMI, I2C, UART/USART
DMA, POR, WDT
16
-
ROMless
-
4K x 8
3 V ~ 3.6 V
-
External
-40°C ~ 85°C (TA)
-
208-BFQFP
208-FQFP (28x28)
hot MPC5554MZP80
NXP

IC MCU 32BIT 2MB FLASH 416BGA

  • Core Processor: e200z6
  • Core Size: 32-Bit
  • Speed: 82MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 256
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
  • Data Converters: A/D 40x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BBGA
  • Supplier Device Package: 416-PBGA (27x27)
paquet: 416-BBGA
Stock18 924
32-Bit
82MHz
CAN, EBI/EMI, SCI, SPI
DMA, POR, PWM, WDT
256
2MB (2M x 8)
FLASH
-
64K x 8
1.35 V ~ 1.65 V
A/D 40x12b
External
-40°C ~ 125°C (TA)
-
416-BBGA
416-PBGA (27x27)
hot SPC5553MVZ132
NXP

IC MCU 32BIT 1.5KB FLASH 324BGA

  • Core Processor: e200z6
  • Core Size: 32-Bit
  • Speed: 132MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 220
  • Program Memory Size: 1.5KB (1.5K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
  • Data Converters: A/D 40x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 324-BBGA
  • Supplier Device Package: 324-TEPBGA (23x23)
paquet: 324-BBGA
Stock6 304
32-Bit
132MHz
CAN, EBI/EMI, Ethernet, SCI, SPI
DMA, POR, PWM, WDT
220
1.5KB (1.5K x 8)
FLASH
-
64K x 8
1.35 V ~ 1.65 V
A/D 40x12b
External
-40°C ~ 125°C (TA)
-
324-BBGA
324-TEPBGA (23x23)
hot MCF5471ZP200
NXP

IC MCU 32BIT ROMLESS 388PBGA

  • Core Processor: Coldfire V4E
  • Core Size: 32-Bit
  • Speed: 200MHz
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 99
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 388-BBGA
  • Supplier Device Package: 388-PBGA (27x27)
paquet: 388-BBGA
Stock7 344
32-Bit
200MHz
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
DMA, PWM, WDT
99
-
ROMless
-
32K x 8
1.43 V ~ 1.58 V
-
External
0°C ~ 70°C (TA)
-
388-BBGA
388-PBGA (27x27)
hot MCF5474ZP266
NXP

IC MCU 32BIT ROMLESS 388PBGA

  • Core Processor: Coldfire V4E
  • Core Size: 32-Bit
  • Speed: 266MHz
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 99
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 388-BBGA
  • Supplier Device Package: 388-PBGA (27x27)
paquet: 388-BBGA
Stock16 068
32-Bit
266MHz
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
DMA, PWM, WDT
99
-
ROMless
-
32K x 8
1.43 V ~ 1.58 V
-
External
0°C ~ 70°C (TA)
-
388-BBGA
388-PBGA (27x27)
MCF5482CZP166
NXP

IC MCU 32BIT ROMLESS 388PBGA

  • Core Processor: Coldfire V4E
  • Core Size: 32-Bit
  • Speed: 166MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 99
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 388-BBGA
  • Supplier Device Package: 388-PBGA (27x27)
paquet: 388-BBGA
Stock2 448
32-Bit
166MHz
CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
DMA, PWM, WDT
99
-
ROMless
-
32K x 8
1.43 V ~ 1.58 V
-
External
-40°C ~ 85°C (TA)
-
388-BBGA
388-PBGA (27x27)
MCF5480CZP166
NXP

IC MCU 32BIT ROMLESS 388PBGA

  • Core Processor: Coldfire V4E
  • Core Size: 32-Bit
  • Speed: 166MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 99
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 388-BBGA
  • Supplier Device Package: 388-PBGA (27x27)
paquet: 388-BBGA
Stock5 840
32-Bit
166MHz
CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
DMA, PWM, WDT
99
-
ROMless
-
32K x 8
1.43 V ~ 1.58 V
-
External
-40°C ~ 85°C (TA)
-
388-BBGA
388-PBGA (27x27)
hot MPC5554MZP132R2
NXP

IC MCU 32BIT 2MB FLASH 416BGA

  • Core Processor: e200z6
  • Core Size: 32-Bit
  • Speed: 132MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 256
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
  • Data Converters: A/D 40x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BBGA
  • Supplier Device Package: 416-PBGA (27x27)
paquet: 416-BBGA
Stock6 160
32-Bit
132MHz
CAN, EBI/EMI, SCI, SPI
DMA, POR, PWM, WDT
256
2MB (2M x 8)
FLASH
-
64K x 8
1.35 V ~ 1.65 V
A/D 40x12b
External
-40°C ~ 125°C (TA)
-
416-BBGA
416-PBGA (27x27)
hot SPC5675KFF0MMM2
NXP

IC MCU 32BIT 2MB FLASH 257MAPBGA

  • Core Processor: e200z7d
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
  • Data Converters: A/D 22x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-MAPBGA (14x14)
paquet: 257-LFBGA
Stock6 816
32-Bit
180MHz
CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
DMA, POR, PWM, WDT
-
2MB (2M x 8)
FLASH
64K x 8
512K x 8
1.14 V ~ 1.32 V
A/D 22x12b
Internal
-40°C ~ 125°C (TA)
-
257-LFBGA
257-MAPBGA (14x14)
SC68376BGCAB20
NXP

IC MCU 32BIT ROMLESS 160QFP

  • Core Processor: CPU32
  • Core Size: 32-Bit
  • Speed: 20MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 18
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 7.5K x 8
  • Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-QFP (28x28)
paquet: 160-BQFP
Stock3 936
32-Bit
20MHz
CAN, EBI/EMI, SCI, SPI
POR, PWM, WDT
18
-
ROMless
-
7.5K x 8
4.75 V ~ 5.25 V
A/D 16x10b
External
-40°C ~ 85°C (TA)
-
160-BQFP
160-QFP (28x28)
SC68376BACAB20
NXP

IC MCU 32BIT ROMLESS 160QFP

  • Core Processor: CPU32
  • Core Size: 32-Bit
  • Speed: 20MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 18
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 7.5K x 8
  • Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-QFP (28x28)
paquet: 160-BQFP
Stock5 424
32-Bit
20MHz
CAN, EBI/EMI, SCI, SPI
POR, PWM, WDT
18
-
ROMless
-
7.5K x 8
4.75 V ~ 5.25 V
A/D 16x10b
External
-40°C ~ 85°C (TA)
-
160-BQFP
160-QFP (28x28)
hot MCF5471VR200
NXP

IC MCU 32BIT ROMLESS 388PBGA

  • Core Processor: Coldfire V4E
  • Core Size: 32-Bit
  • Speed: 200MHz
  • Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 99
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 388-BBGA
  • Supplier Device Package: 388-PBGA (27x27)
paquet: 388-BBGA
Stock4 448
32-Bit
200MHz
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
DMA, PWM, WDT
99
-
ROMless
-
32K x 8
1.43 V ~ 1.58 V
-
External
0°C ~ 70°C (TA)
-
388-BBGA
388-PBGA (27x27)
hot MCF5480CVR166
NXP

IC MCU 32BIT ROMLESS 388PBGA

  • Core Processor: Coldfire V4E
  • Core Size: 32-Bit
  • Speed: 166MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 99
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.43 V ~ 1.58 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 388-BBGA
  • Supplier Device Package: 388-PBGA (27x27)
paquet: 388-BBGA
Stock6 400
32-Bit
166MHz
CAN, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
DMA, PWM, WDT
99
-
ROMless
-
32K x 8
1.43 V ~ 1.58 V
-
External
-40°C ~ 85°C (TA)
-
388-BBGA
388-PBGA (27x27)
hot SPC561MVR56D
NXP

IC MCU 32BIT ROMLESS 388PBGA

  • Core Processor: PowerPC
  • Core Size: 32-Bit
  • Speed: 56MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 64
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
  • Data Converters: A/D 32x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 388-BBGA
  • Supplier Device Package: 388-PBGA (27x27)
paquet: 388-BBGA
Stock8 376
32-Bit
56MHz
CAN, EBI/EMI, SCI, SPI, UART/USART
POR, PWM, WDT
64
-
ROMless
-
32K x 8
2.5 V ~ 2.7 V
A/D 32x10b
External
-40°C ~ 125°C (TA)
-
388-BBGA
388-PBGA (27x27)
hot MPC561MVR56
NXP

IC MCU 32BIT ROMLESS 388PBGA

  • Core Processor: PowerPC
  • Core Size: 32-Bit
  • Speed: 56MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 64
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
  • Data Converters: A/D 32x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 388-BBGA
  • Supplier Device Package: 388-PBGA (27x27)
paquet: 388-BBGA
Stock7 472
32-Bit
56MHz
CAN, EBI/EMI, SCI, SPI, UART/USART
POR, PWM, WDT
64
-
ROMless
-
32K x 8
2.5 V ~ 2.7 V
A/D 32x10b
External
-40°C ~ 125°C (TA)
-
388-BBGA
388-PBGA (27x27)
hot MPC561MZP56
NXP

IC MCU 32BIT ROMLESS 388PBGA

  • Core Processor: PowerPC
  • Core Size: 32-Bit
  • Speed: 56MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 64
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
  • Data Converters: A/D 32x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 388-BBGA
  • Supplier Device Package: 388-PBGA (27x27)
paquet: 388-BBGA
Stock32 544
32-Bit
56MHz
CAN, EBI/EMI, SCI, SPI, UART/USART
POR, PWM, WDT
64
-
ROMless
-
32K x 8
2.5 V ~ 2.7 V
A/D 32x10b
External
-40°C ~ 125°C (TA)
-
388-BBGA
388-PBGA (27x27)
hot SPC5674KFF0MMS2
NXP

IC MCU 32BIT 1.5MB FLASH 473BGA

  • Core Processor: e200z7d
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 384K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
  • Data Converters: A/D 34x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 473-LFBGA
  • Supplier Device Package: 473-MAPBGA (19x19)
paquet: 473-LFBGA
Stock4 912
32-Bit
180MHz
CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
DMA, POR, PWM, WDT
-
1.5MB (1.5M x 8)
FLASH
64K x 8
384K x 8
1.14 V ~ 1.32 V
A/D 34x12b
Internal
-40°C ~ 125°C (TA)
-
473-LFBGA
473-MAPBGA (19x19)