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Produits NXP - Embarqués - Microcontrôleurs

Dossiers 9 482
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Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Core Size
Speed
Connectivity
Peripherals
Number of I/O
Program Memory Size
Program Memory Type
EEPROM Size
RAM Size
Voltage - Supply (Vcc/Vdd)
Data Converters
Oscillator Type
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
SPC5646CCF0VMJ1
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 199
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 33x10b, 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPBGA
paquet: 256-LBGA
Stock4 640
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
199
3MB (3M x 8)
FLASH
64K x 8
256K x 8
3 V ~ 5.5 V
A/D 33x10b, 10x12b
Internal
-40°C ~ 105°C (TA)
-
256-LBGA
256-MAPBGA
SPC5646CCAVMJ1
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 199
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 33x10b, 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPBGA
paquet: 256-LBGA
Stock3 232
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
199
3MB (3M x 8)
FLASH
64K x 8
256K x 8
3 V ~ 5.5 V
A/D 33x10b, 10x12b
Internal
-40°C ~ 105°C (TA)
-
256-LBGA
256-MAPBGA
SP5748GSK0AMMJ6R
NXP

TRIPLE CORE 6M FLASH 768K RAM

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock2 096
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
FS32R274KCK2VMM
NXP

NXP 32 BIT MCU 2M FLASH 1.5MB

  • Core Processor: e200z4, e200z7 (2)
  • Core Size: 32-Bit Tri-Core
  • Speed: 180MHz, 240MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
  • Peripherals: POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 1.5M x 8
  • Voltage - Supply (Vcc/Vdd): 1.19 V ~ 5.5 V
  • Data Converters: A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-MAPBGA (14x14)
paquet: 257-LFBGA
Stock6 096
32-Bit Tri-Core
180MHz, 240MHz
CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
POR, PWM, WDT
-
2MB (2M x 8)
FLASH
64K x 8
1.5M x 8
1.19 V ~ 5.5 V
A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
Internal
-40°C ~ 105°C (TA)
-
257-LFBGA
257-MAPBGA (14x14)
SP5748GGK0AVMJ6R
NXP

32 BIT6MB FLASH768 RAM

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock5 040
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 105°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
SPC5747CK0AMMN6
NXP

32 BITDUAL CORE4M FLAS

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 246
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 324-LBGA
  • Supplier Device Package: 324-MAPBGA (19x19)
paquet: 324-LBGA
Stock3 264
32-Bit Dual-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
246
4MB (4M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
324-LBGA
324-MAPBGA (19x19)
SPC5674KAVMM2R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z7d
  • Core Size: 32-Bit Dual-Core
  • Speed: 180MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 384K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
  • Data Converters: A/D 22x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-MAPBGA (14x14)
paquet: 257-LFBGA
Stock2 160
32-Bit Dual-Core
180MHz
CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
DMA, POR, PWM, WDT
-
1.5MB (1.5M x 8)
FLASH
64K x 8
384K x 8
1.14 V ~ 5.5 V
A/D 22x12b
Internal
-40°C ~ 105°C (TA)
-
257-LFBGA
257-MAPBGA (14x14)
FS32R274KBK2VMM
NXP

2M FLASH 1.5MB SRAM 2X

  • Core Processor: e200z4, e200z7 (2)
  • Core Size: 32-Bit Tri-Core
  • Speed: 180MHz, 240MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
  • Peripherals: POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 1.5M x 8
  • Voltage - Supply (Vcc/Vdd): 1.19 V ~ 5.5 V
  • Data Converters: A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-MAPBGA (14x14)
paquet: 257-LFBGA
Stock7 088
32-Bit Tri-Core
180MHz, 240MHz
CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
POR, PWM, WDT
-
2MB (2M x 8)
FLASH
64K x 8
1.5M x 8
1.19 V ~ 5.5 V
A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
Internal
-40°C ~ 105°C (TA)
-
257-LFBGA
257-MAPBGA (14x14)
hot SPC5646CK0MMJ1R
NXP

3M FLASH256K RAM120MHZ

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 199
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 33x10b, 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPBGA
paquet: 256-LBGA
Stock3 952
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
199
3MB (3M x 8)
FLASH
64K x 8
256K x 8
3 V ~ 5.5 V
A/D 33x10b, 10x12b
Internal
-40°C ~ 125°C (TA)
-
256-LBGA
256-MAPBGA
SPC5646CF0MMJ1R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 199
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 33x10b, 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPBGA
paquet: 256-LBGA
Stock6 096
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
199
3MB (3M x 8)
FLASH
64K x 8
256K x 8
3 V ~ 5.5 V
A/D 33x10b, 10x12b
Internal
-40°C ~ 125°C (TA)
-
256-LBGA
256-MAPBGA
SPC5748GK0AMMJ6
NXP

TRIPLE CORE 6M FLASH 768K RAM

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock3 392
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
FS32R274KSK2VMM
NXP

IC SRAM 2M FLASH 257MAPBGA

  • Core Processor: e200z4, e200z7 (2)
  • Core Size: 32-Bit Tri-Core
  • Speed: 180MHz, 240MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
  • Peripherals: POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 1.5M x 8
  • Voltage - Supply (Vcc/Vdd): 1.19 V ~ 5.5 V
  • Data Converters: A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-MAPBGA (14x14)
paquet: 257-LFBGA
Stock7 936
32-Bit Tri-Core
180MHz, 240MHz
CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
POR, PWM, WDT
-
2MB (2M x 8)
FLASH
64K x 8
1.5M x 8
1.19 V ~ 5.5 V
A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
Internal
-40°C ~ 105°C (TA)
-
257-LFBGA
257-MAPBGA (14x14)
SPC5643AF0MVZ2
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 151
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.25 V
  • Data Converters: A/D 40x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 324-BBGA
  • Supplier Device Package: 324-TEPBGA (23x23)
paquet: 324-BBGA
Stock5 328
32-Bit
120MHz
CANbus, EBI/EMI, LINbus, SCI, SPI
DMA, POR, PWM, WDT
151
3MB (3M x 8)
FLASH
-
192K x 8
1.14 V ~ 5.25 V
A/D 40x12b
Internal
-40°C ~ 125°C (TA)
-
324-BBGA
324-TEPBGA (23x23)
SPC5668GAVMGR
NXP

NXP 32-BIT MCU POWER ARCH 2MB

  • Core Processor: e200z650
  • Core Size: 32-Bit
  • Speed: 116MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 155
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 592K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 36x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 208-BGA
  • Supplier Device Package: 208-MAPBGA (17x17)
paquet: 208-BGA
Stock7 264
32-Bit
116MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
155
2MB (2M x 8)
FLASH
-
592K x 8
3 V ~ 5.5 V
A/D 36x10b
Internal
-40°C ~ 105°C (TA)
-
208-BGA
208-MAPBGA (17x17)
SP5748GBK0AVMJ6R
NXP

TRIPLE CORE 6M FLASH 768K RAM

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock2 944
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 105°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
SPC5748GK0AMKU6
NXP

TRIPLE CORE, 6M FLASH

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock5 808
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SPC5747GTK1MKU6
NXP

NXP 32-BIT MCU TRIPLE CORE 4MB

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock3 440
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
4MB (4M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SPC5747GTK0AMKU6
NXP

ULTRA RELIABLE MCU WITH VAST PER

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 4MB (4M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock3 040
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
129
4MB (4M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
SPC5646CF0VLT1R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 177
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 33x10b, 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 208-LQFP
  • Supplier Device Package: 208-TQFP (28x28)
paquet: 208-LQFP
Stock5 104
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
177
3MB (3M x 8)
FLASH
64K x 8
256K x 8
3 V ~ 5.5 V
A/D 33x10b, 10x12b
Internal
-40°C ~ 105°C (TA)
-
208-LQFP
208-TQFP (28x28)
SPC5646CCK0VLU1
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock2 048
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
3MB (3M x 8)
FLASH
64K x 8
256K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5646CCF0VLU1
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock3 360
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
147
3MB (3M x 8)
FLASH
64K x 8
256K x 8
3 V ~ 5.5 V
A/D 27x10b, 5x12b
Internal
-40°C ~ 105°C (TA)
-
176-LQFP
176-LQFP (24x24)
SPC5646CCK0VMJ1R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 199
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 33x10b, 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPBGA
paquet: 256-LBGA
Stock4 688
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
199
3MB (3M x 8)
FLASH
64K x 8
256K x 8
3 V ~ 5.5 V
A/D 33x10b, 10x12b
Internal
-40°C ~ 105°C (TA)
-
256-LBGA
256-MAPBGA
SPC5646CCF0VMJ1R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 199
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 33x10b, 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPBGA
paquet: 256-LBGA
Stock4 960
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
199
3MB (3M x 8)
FLASH
64K x 8
256K x 8
3 V ~ 5.5 V
A/D 33x10b, 10x12b
Internal
-40°C ~ 105°C (TA)
-
256-LBGA
256-MAPBGA
SPC5646CCAVMJ1R
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 199
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 33x10b, 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPBGA
paquet: 256-LBGA
Stock3 456
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
199
3MB (3M x 8)
FLASH
64K x 8
256K x 8
3 V ~ 5.5 V
A/D 33x10b, 10x12b
Internal
-40°C ~ 105°C (TA)
-
256-LBGA
256-MAPBGA
SPC5646CF0VLT1
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 177
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 33x10b, 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 208-LQFP
  • Supplier Device Package: 208-TQFP (28x28)
paquet: 208-LQFP
Stock2 032
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
177
3MB (3M x 8)
FLASH
64K x 8
256K x 8
3 V ~ 5.5 V
A/D 33x10b, 10x12b
Internal
-40°C ~ 105°C (TA)
-
208-LQFP
208-TQFP (28x28)
FS32R274VCK2MMM
NXP

NXP 32 BIT MCU 2M FLASH 1.5MB

  • Core Processor: e200z4, e200z7 (2)
  • Core Size: 32-Bit Tri-Core
  • Speed: 180MHz, 240MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
  • Peripherals: POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 1.5M x 8
  • Voltage - Supply (Vcc/Vdd): 1.19 V ~ 5.5 V
  • Data Converters: A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 257-LFBGA
  • Supplier Device Package: 257-MAPBGA (14x14)
paquet: 257-LFBGA
Stock2 448
32-Bit Tri-Core
180MHz, 240MHz
CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
POR, PWM, WDT
-
2MB (2M x 8)
FLASH
64K x 8
1.5M x 8
1.19 V ~ 5.5 V
A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
Internal
-40°C ~ 125°C (TA)
-
257-LFBGA
257-MAPBGA (14x14)
SPC5748GK0AMMJ6R
NXP

TRIPLE CORE 6M FLASH 768K RAM

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock6 704
32-Bit Tri-Core
80MHz/160MHz
CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
178
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
256-LBGA
256-MAPPBGA (17x17)
SPC5646CF0VMJ1
NXP

NXP 32-BIT MCU DUAL POWER ARCH

  • Core Processor: e200z4d, e200z0h
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/120MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 199
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 33x10b, 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPBGA
paquet: 256-LBGA
Stock4 816
32-Bit Dual-Core
80MHz/120MHz
CANbus, Ethernet, I²C, LINbus, SCI, SPI
DMA, POR, PWM, WDT
199
3MB (3M x 8)
FLASH
64K x 8
256K x 8
3 V ~ 5.5 V
A/D 33x10b, 10x12b
Internal
-40°C ~ 105°C (TA)
-
256-LBGA
256-MAPBGA