Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Contact Type | Pitch - Mating | Style | Shrouding | Number of Positions | Number of Positions Loaded | Number of Rows | Row Spacing - Mating | Mounting Type | Termination | Fastening Type | Contact Length - Mating | Contact Length - Post | Overall Contact Length | Insulation Height | Contact Shape | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material | Insulation Material | Features | Operating Temperature | Ingress Protection | Material Flammability Rating | Insulation Color |
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Molex, LLC |
SLIM-GRID HEADER, 10 CIRCUITS, S
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paquet: - |
Stock7 398 |
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Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 10 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, SU
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paquet: - |
Stock6 354 |
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Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 8 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, SU
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paquet: - |
Stock3 024 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 6 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 4 CIRCUITS, SU
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paquet: - |
Stock8 856 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 4 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 22 CIRCUITS, S
|
paquet: - |
Stock8 784 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 22 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 20 CIRCUITS, S
|
paquet: - |
Stock4 158 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 20 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 18 CIRCUITS, S
|
paquet: - |
Stock3 580 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 18 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 16 CIRCUITS, S
|
paquet: - |
Stock5 328 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 16 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 14 CIRCUITS, S
|
paquet: - |
Stock4 050 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 14 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 10 CIRCUITS, S
|
paquet: - |
Stock3 528 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 10 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 8 CIRCUITS, SU
|
paquet: - |
Stock3 276 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 8 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 6 CIRCUITS, SU
|
paquet: - |
Stock2 862 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 6 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 4 CIRCUITS, SU
|
paquet: - |
Stock6 300 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 4 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Latch Holder | - | - | - | 0.279" (7.10mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | - | -55°C ~ 105°C | - | UL94 V-0 | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 24 CIRCUITS, S
|
paquet: - |
Stock5 796 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 24 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 24 CIRCUITS, S
|
paquet: - |
Stock8 766 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 24 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 24 CIRCUITS, S
|
paquet: - |
Stock7 002 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 24 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 24 CIRCUITS, S
|
paquet: - |
Stock6 570 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 24 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 22 CIRCUITS, S
|
paquet: - |
Stock6 570 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 22 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 22 CIRCUITS, S
|
paquet: - |
Stock2 880 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 22 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 22 CIRCUITS, S
|
paquet: - |
Stock5 616 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 22 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 22 CIRCUITS, S
|
paquet: - |
Stock4 734 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 22 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 22 CIRCUITS, S
|
paquet: - |
Stock5 148 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 22 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Gold | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 18 CIRCUITS, S
|
paquet: - |
Stock4 140 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 18 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 18 CIRCUITS, S
|
paquet: - |
Stock6 912 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 18 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 15µin (0.38µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 18 CIRCUITS, S
|
paquet: - |
Stock4 464 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 18 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 30µin (0.76µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 18 CIRCUITS, S
|
paquet: - |
Stock8 514 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 18 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Tin | 100µin (2.54µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 18 CIRCUITS, S
|
paquet: - |
Stock2 484 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 18 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Gold | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |
||
Molex, LLC |
SLIM-GRID HEADER, 16 CIRCUITS, S
|
paquet: - |
Stock5 778 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 16 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | 0.099" (2.51mm) | Square | Gold | 2µin (0.05µm) | Tin | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | Pick and Place | -55°C ~ 105°C | - | - | Black |