Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
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Molex, LLC |
CONN FPC 21POS .3MM SMD R/A
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paquet: - |
Stock4 284 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 21 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC 21POS .3MM SMD R/A
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paquet: - |
Stock6 534 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 21 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tabbed | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 11POS 1.25MM PCB
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paquet: - |
Stock6 966 |
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Through Hole | Contacts, Vertical, 1 Sided | 11 | 0.049" (1.25mm) | Solder | 0.30mm | 0.295" (7.50mm) | Slide Lock | Straight | Phosphor Bronze | Tin Bismuth | Polybutylene Terephthalate (PBT), Polyester | Polybutylene Terephthalate (PBT), Polyester | Zero Insertion Force (ZIF) | 200V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
05 FFCFPC ZIF E02HSGASSY12CKTEMB
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paquet: - |
Stock7 758 |
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Surface Mount, Right Angle | Contacts, Bottom | 12 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
05 FFCFPC ZIF E02HSGASSY11CKTEMB
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paquet: - |
Stock8 622 |
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Surface Mount, Right Angle | Contacts, Bottom | 11 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
05 FFCFPC ZIF E02HSGASSY10CKTEMB
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paquet: - |
Stock4 212 |
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Surface Mount, Right Angle | Contacts, Bottom | 10 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
05 FFCFPC ZIF E02 HSGASSY8CKTEMB
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paquet: - |
Stock2 700 |
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Surface Mount, Right Angle | Contacts, Bottom | 8 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 15POS 0.50MM SMD
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paquet: - |
Stock6 336 |
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Surface Mount | Contacts, Vertical, 1 Sided | 15 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC FPC TOP 5POS 0.50MM R/A
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paquet: - |
Stock6 282 |
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Surface Mount, Right Angle | Contacts, Top | 5 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
0.5 FFC ZIF BTM CONT EMBT PKG 28
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paquet: - |
Stock7 722 |
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Surface Mount, Right Angle | Contacts, Bottom | 28 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Tin | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC FPC TOP 7POS 0.50MM R/A
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paquet: - |
Stock4 680 |
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Surface Mount, Right Angle | Contacts, Top | 7 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 7POS 0.5MM R/A
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paquet: - |
Stock3 240 |
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Surface Mount, Right Angle | Contacts, Bottom | 7 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC PLUG 3POS 2.54MM
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paquet: - |
Stock2 808 |
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- | Plug | 3 | 0.100" (2.54mm) | IDC | - | - | - | - | Phosphor Bronze | Gold | Polybutylene Terephthalate (PBT) | - | - | 250V | -40°C ~ 105°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 38POS 1.25MM PCB
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paquet: - |
Stock4 500 |
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Through Hole | Contacts, Vertical, 1 Sided | 38 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.315" (8.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 13POS 0.50MM SMD
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paquet: - |
Stock3 852 |
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Surface Mount | Contacts, Vertical, 1 Sided | 13 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC TOP 25POS 1.00MM R/A
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paquet: - |
Stock5 148 |
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Through Hole, Right Angle | Contacts, Top | 25 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.142" (3.60mm) | - | Straight | Phosphor Bronze | Tin | Polyphenylene Sulfide (PPS) | - | - | 50V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 12POS 0.50MM SMD
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paquet: - |
Stock5 778 |
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Surface Mount | Contacts, Vertical, 1 Sided | 12 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 14POS 0.50MM SMD
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paquet: - |
Stock4 554 |
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Surface Mount | Contacts, Vertical, 1 Sided | 14 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 14POS 1.00MM R/A
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paquet: - |
Stock5 868 |
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Surface Mount, Right Angle | Contacts, Bottom | 14 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FFC/FPC BOTTOM 26P .5MM R/A
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paquet: - |
Stock7 416 |
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Surface Mount, Right Angle | Contacts, Bottom | 26 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 105°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 13POS 0.50MM SMD
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paquet: - |
Stock3 240 |
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Surface Mount | Contacts, Vertical, 1 Sided | 13 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC TOP 15POS 1.00MM R/A
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paquet: - |
Stock5 778 |
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Surface Mount, Right Angle | Contacts, Top | 15 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC TOP 20POS 1.00MM R/A
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paquet: - |
Stock7 182 |
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Through Hole, Right Angle | Contacts, Top | 20 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.142" (3.60mm) | - | Straight | Phosphor Bronze | Tin | Polyphenylene Sulfide (PPS) | - | - | 50V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FFC FPC TOP 4POS 0.50MM R/A
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paquet: - |
Stock5 400 |
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Surface Mount, Right Angle | Contacts, Top | 4 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 12POS 0.50MM SMD
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paquet: - |
Stock7 488 |
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Surface Mount | Contacts, Vertical, 1 Sided | 12 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 9POS 1.25MM PCB
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paquet: - |
Stock7 902 |
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Through Hole | Contacts, Vertical, 1 Sided | 9 | 0.049" (1.25mm) | Solder | 0.30mm | 0.295" (7.50mm) | Slide Lock | Straight | Phosphor Bronze | Tin Bismuth | Polybutylene Terephthalate (PBT), Polyester | Polybutylene Terephthalate (PBT), Polyester | Zero Insertion Force (ZIF) | 200V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FPC TOP 23POS 1.00MM R/A
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paquet: - |
Stock8 874 |
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Through Hole, Right Angle | Contacts, Top | 23 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.142" (3.60mm) | - | Straight | Phosphor Bronze | Tin | Polyphenylene Sulfide (PPS) | - | - | 50V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 13POS 1.00MM R/A
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paquet: - |
Stock8 586 |
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Surface Mount, Right Angle | Contacts, Bottom | 13 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 80°C | UL94 V-0 |