Produits Microchip Technology

DSC1101CI1-120.0000

Microchip Technology

OSC MEMS 120.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 120MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 35mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 6-SMD, No Lead

DSC1123DL2-200.0000T

Microchip Technology

OSC MEMS 200.0000MHZ LVDS SMD

• Type: MEMS (Silicon)
• Frequency: 200MHz
• Function: Enable/Disable
• Output: LVDS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 105°C
• Current - Supply (Max): 32mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 6-SMD, No Lead

MIC4424CN

Microchip Technology

IC DRIVER MOSFET 3A DUAL 8DIP

• Driven Configuration: Low-Side
• Channel Type: Independent
• Number of Drivers: 2
• Gate Type: N-Channel, P-Channel MOSFET
• Voltage - Supply: 4.5 V ~ 18 V
• Logic Voltage - VIL, VIH: 0.8V, 2.4V
• Current - Peak Output (Source, Sink): 3A, 3A
• Input Type: Non-Inverting
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): 28ns, 32ns
• Operating Temperature: 0°C ~ 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

paquet: 8-DIP (0.300", 7.62mm)

AT28C010-25UM/883

Microchip Technology

IC EEPROM 1MBIT 250NS 30CPGA

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 1Mb (128K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 10ms
• Access Time: 250ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C (TC)
• Mounting Type: Through Hole
• Package / Case: 30-BCPGA
• Supplier Device Package: 30-CPGA

paquet: 30-BCPGA

SST25VF040B-50-4C-S2AF

Microchip Technology

IC FLASH 4MBIT 50MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 4Mb (512K x 8)
• Memory Interface: SPI
• Clock Frequency: 50MHz
• Write Cycle Time - Word, Page: 10µs
• Access Time: -
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.209", 5.30mm Width)
• Supplier Device Package: 8-SOIC

paquet: 8-SOIC (0.209", 5.30mm Width)

PIC24FJ192GA110T-I/PT

Microchip Technology

IC MCU 16BIT 192KB FLASH 100TQFP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 192KB (65.5K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (12x12)

paquet: 100-TQFP

PIC16CE623-20E/SS

Microchip Technology

IC MCU 8BIT 896B OTP 20SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 13
• Program Memory Size: 896B (512 x 14)
• Program Memory Type: OTP
• EEPROM Size: 128 x 8
• RAM Size: 96 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

paquet: 20-SSOP (0.209", 5.30mm Width)

PIC16C710T-04I/SO

Microchip Technology

IC MCU 8BIT 896B OTP 18SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 13
• Program Memory Size: 896B (512 x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 36 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
• Data Converters: A/D 4x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 18-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 18-SOIC

paquet: 18-SOIC (0.295", 7.50mm Width)

PIC16LC773/SP

Microchip Technology

IC MCU 8BIT 7KB OTP 28SDIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 6x12b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

paquet: 28-DIP (0.300", 7.62mm)

PIC24FJ64GC010-I/BG

Microchip Technology

IC MCU 16BIT 64KB FLASH 121TFBGA

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, LCD, LVD, POR, PWM, WDT
• Number of I/O: 85
• Program Memory Size: 64KB (22K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 50x12b, 2x16b, D/A 2x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 121-TFBGA
• Supplier Device Package: 121-TFBGA (10x10)

paquet: 121-TFBGA

PIC32MX130F256B-50I/SS

Microchip Technology

IC MCU 32BIT 256KB FLASH 28SSOP

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, LIN, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

paquet: 28-SSOP (0.209", 5.30mm Width)

ATMEGA88PV-10MUR

Microchip Technology

IC MCU 8BIT 8KB FLASH 32VQFN

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 23
• Program Memory Size: 8KB (4K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-VQFN (5x5)

paquet: 32-VFQFN Exposed Pad

PIC16F1619T-I/ML

Microchip Technology

IC MCU 8BIT 14KB FLASH 20QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 12x10b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-QFN (4x4)

paquet: 20-VFQFN Exposed Pad

PIC32MX570F512H-I/PT

Microchip Technology

IC MCU 32BIT 512KB FLASH 64TQFP

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, I2C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 49
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

paquet: 64-TQFP

MCP4531T-503E/MF

Microchip Technology

IC DGTL POT 50K 129TAPS 8-DFN

• Taper: Linear
• Configuration: Potentiometer
• Number of Circuits: 1
• Number of Taps: 129
• Resistance (Ohms): 50k
• Interface: I2C
• Memory Type: Volatile
• Voltage - Supply: 1.8 V ~ 5.5 V
• Features: Selectable Address
• Tolerance: ±20%
• Temperature Coefficient (Typ): 150 ppm/°C
• Resistance - Wiper (Ohms) (Typ): 75
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-DFN-EP (3x3)

paquet: 8-VDFN Exposed Pad

MCP79521-I/MS

Microchip Technology

IC RTC CLK/CALENDAR SPI 10-MSOP

• Type: Clock/Calendar
• Features: Alarm, EEPROM, Leap Year, Square Wave Output, SRAM, Unique ID
• Memory Size: 64B
• Time Format: HH:MM:SS:hh (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: SPI
• Voltage - Supply: 1.8 V ~ 3.6 V
• Voltage - Supply, Battery: 1.3 V ~ 3.6 V
• Current - Timekeeping (Max): 1µA @ 1.8V ~ 3.6V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 10-MSOP

paquet: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)

SY100EP11UZG

Microchip Technology

IC CLK BUFFER 1:2 3GHZ 8SOIC

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 1
• Ratio - Input:Output: 1:2
• Differential - Input:Output: Yes/Yes
• Input: ECL, LVECL, LVPECL. PECL
• Output: ECL, LVECL, LVPECL. PECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

paquet: 8-SOIC (0.154", 3.90mm Width)

ATA8515-GHQW

Microchip Technology

ISM RF RECEIVER

• Frequency: 315MHz, 433MHz, 868MHz, 915MHz
• Sensitivity: -125dBm
• Data Rate (Max): -
• Modulation or Protocol: ISM
• Applications: General Purpose
• Current - Receiving: 10.5mA
• Data Interface: SPI, UART
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 1.9 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

paquet: 32-VFQFN Exposed Pad

UPD350D-I/Q8X

Microchip Technology

HIGHLY INTEGRATED SMALL FORM FAC

• Protocol: USB
• Function: Controller
• Interface: SPI
• Standards: USB 3.0
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -
• Package / Case: 28-VFQFN Exposed Pad
• Supplier Device Package: 28-QFN (4x4)

paquet: 28-VFQFN Exposed Pad

TC7660SEOA713VAO

Microchip Technology

HIGH VOLTAGE DC-DC CONVERTER

• Function: -
• Output Configuration: -
• Topology: -
• Output Type: -
• Number of Outputs: -
• Voltage - Input (Min): -
• Voltage - Input (Max): -
• Voltage - Output (Min/Fixed): -
• Voltage - Output (Max): -
• Current - Output: -
• Frequency - Switching: -
• Synchronous Rectifier: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

DSPIC33CH128MP502T-I/SS

Microchip Technology

16 BIT DSC, DUAL CORE, 128K FLAS

• Core Processor: dsPIC
• Core Size: 16-Bit Dual-Core
• Speed: 180MHz, 200MHz
• Connectivity: CANbus, I²C, IrDA, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
• Number of I/O: 21
• Program Memory Size: 152KB (152K x 8)
• Program Memory Type: FLASH/PRAM
• EEPROM Size: -
• RAM Size: 20K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 23x12b, D/A 4x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

paquet: 28-SSOP (0.209", 5.30mm Width)

ATSAML10E15A-MUT

Microchip Technology

IC MCU 32BIT 32KB FLASH 32VQFN

• Core Processor: ARM® Cortex®-M23
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.63 V
• Data Converters: A/D 10x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-VQFN (5x5)

paquet: 32-VFQFN Exposed Pad

R4210F

Microchip Technology

RECTIFIER

• Diode Type: Standard, Reverse Polarity
• Voltage - DC Reverse (Vr) (Max): 100 V
• Current - Average Rectified (Io): 125A
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 50 µA @ 100 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-205AA, DO-8, Stud
• Supplier Device Package: DO-205AA (DO-8)
• Operating Temperature - Junction: -65°C ~ 200°C

paquet: -

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JANTXV1N4985CUS-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 130 V
• Tolerance: ±2%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 190 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 98.8 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, E
• Supplier Device Package: E-MELF

paquet: -

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MSCSM120AM11T3AG

Microchip Technology

SIC 2N-CH 1200V 254A

• FET Type: Silicon Carbide (SiC)
• FET Feature: -
• Drain to Source Voltage (Vdss): 1200V (1.2kV)
• Current - Continuous Drain (Id) @ 25°C: 254A (Tc)
• Rds On (Max) @ Id, Vgs: 10.4mOhm @ 120A, 20V
• Vgs(th) (Max) @ Id: 2.8V @ 9mA
• Gate Charge (Qg) (Max) @ Vgs: 696nC @ 20V
• Input Capacitance (Ciss) (Max) @ Vds: 9060pF @ 1000V
• Power - Max: 1.067kW (Tc)
• Operating Temperature: -40°C ~ 175°C (TJ)
• Mounting Type: Chassis Mount
• Package / Case: Module
• Supplier Device Package: -

paquet: -

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JANS1N4106C-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 12 V
• Tolerance: ±2%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 200 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 9.2 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

paquet: -

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21FQ045

Microchip Technology

DIODE SCHOTTKY 45V 30A DO4

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 45 V
• Current - Average Rectified (Io): 30A
• Voltage - Forward (Vf) (Max) @ If: 630 mV @ 30 A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 1.5 mA @ 45 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-203AA, DO-4, Stud
• Supplier Device Package: DO-4 (DO-203AA)
• Operating Temperature - Junction: -55°C ~ 175°C

paquet: -

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JANS1N4116D-1

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 24 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 150 Ohms
• Current - Reverse Leakage @ Vr: 10 nA @ 18.3 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

paquet: -

Request a Quote