Produits Microchip Technology

DSC8004AL2

Microchip Technology

OSC MEMS BLANK 7.0X5.0 CMOS

• Type: MEMS (Silicon)
• Programmable Type: Blank (User Must Program)
• Available Frequency Range: 1MHz ~ 150MHz
• Function: Standby
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: -
• Frequency Stability (Total): ±25ppm
• Operating Temperature: -40°C ~ 105°C
• Spread Spectrum Bandwidth: -
• Current - Supply (Max): 16.6mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height: 0.035" (0.90mm)

paquet: 4-SMD, No Lead

DSC1001DI2-036.0000

Microchip Technology

OSC MEMS 36.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 36MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 4-SMD, No Lead

DSC1033CI1-032.0000T

Microchip Technology

OSC MEMS 32.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 32MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 3.3V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 3mA (Typ)
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 4-SMD, No Lead

DSC1001DL5-007.3728

Microchip Technology

OSC MEMS 7.3728MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 7.3728MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 105°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 4-SMD, No Lead

DSC1001DI1-133.0000

Microchip Technology

OSC MEMS 133.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 133MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 8.7mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 4-SMD, No Lead

DSC1033CI1-040.0000T

Microchip Technology

OSC MEMS 40.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 40MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 3.3V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 4mA (Typ)
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 4-SMD, No Lead

DSC1001CL5-033.0000

Microchip Technology

OSC MEMS 33.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 33MHz
• Function: Enable/Disable
• Output: CMOS
• Voltage - Supply: 1.7 V ~ 3.6 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 105°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 4-SMD, No Lead

DSC1001DI2-024.0000

Microchip Technology

OSC MEMS 24.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 24MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±25ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 4-SMD, No Lead

MIC2214-LMBML TR

Microchip Technology

IC REG LINEAR 2.7V/2.8V 10MLF

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 2
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.7V, 2.8V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.25V @ 150mA, 0.42V @ 300mA
• Current - Output: 150mA, 300mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 80µA
• PSRR: 60dB ~ 40dB (1KHz ~ 20kHz)
• Control Features: Enable, Power On Reset
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad, 10-MLF?
• Supplier Device Package: 10-MLF? (3x3)

paquet: 10-VFDFN Exposed Pad, 10-MLF?

AT49F001NT-12VC

Microchip Technology

IC FLASH 1MBIT 120NS 32VSOP

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 1Mb (128K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 50µs
• Access Time: 120ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 32-TFSOP (0.488", 12.40mm Width)
• Supplier Device Package: 32-VSOP

paquet: 32-TFSOP (0.488", 12.40mm Width)

AT17C256-10CI

Microchip Technology

IC SRL CONFIG EEPROM 256K 8LAP

• Programmable Type: Serial EEPROM
• Memory Size: 256Kb
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-TDFN
• Supplier Device Package: 8-LAP (6x6)

paquet: 8-TDFN

MCP6547T-E/SN

Microchip Technology

IC COMP 1.6V DUAL O-D 8SOIC

• Type: General Purpose
• Number of Elements: 2
• Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
• Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
• Voltage - Input Offset (Max): 7mV @ 5.5V
• Current - Input Bias (Max): 1pA @ 5.5V
• Current - Output (Typ): 30mA
• Current - Quiescent (Max): 1µA
• CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
• Propagation Delay (Max): 8µs
• Hysteresis: 6.5mV
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Mounting Type: Surface Mount
• Supplier Device Package: 8-SOIC

paquet: 8-SOIC (0.154", 3.90mm Width)

PIC24EP128MC202-E/SP

Microchip Technology

IC MCU 16BIT 128KB FLASH 28SDIP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 60 MIPs
• Connectivity: I2C, IrDA, LIN, QEI, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 21
• Program Memory Size: 128KB (43K x 24)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

paquet: 28-DIP (0.300", 7.62mm)

AT89LP4052-16PI

Microchip Technology

IC MCU 8BIT 4KB FLASH 20DIP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 15
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-PDIP

paquet: 20-DIP (0.300", 7.62mm)

ATSAMS70Q20A-CNT

Microchip Technology

IC MCU 32BIT 1MB FLASH 144LFBGA

• Core Processor: ARM? Cortex?-M7
• Core Size: 32-Bit
• Speed: 300MHz
• Connectivity: EBI/EMI, I2C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 114
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V
• Data Converters: A/D 24x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 144-LFBGA
• Supplier Device Package: 144-LFBGA (10x10)

paquet: 144-LFBGA

RN-174-K

Microchip Technology

EVALUATION KIT FOR THE RN-171 MO

• Type: Transceiver; 802.11 b/g (Wi-Fi, WiFi, WLAN)
• Frequency: 2.4GHz
• For Use With/Related Products: RN-171
• Supplied Contents: Board, Cables

paquet: -

PIC16F1516-E/ML

Microchip Technology

IC MCU 8BIT 14KB FLASH 28QFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 17x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: -
• Package / Case: 28-VQFN Exposed Pad
• Supplier Device Package: 28-QFN (6x6)

paquet: 28-VQFN Exposed Pad

PIC16F19155-I/SS

Microchip Technology

14KB FLASH, 1KB RAM, 256KB EE, L

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 20x12b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

paquet: 28-SSOP (0.209", 5.30mm Width)

PM5426C-FXI

Microchip Technology

1X10G + 1X10G/8XSFP MULTI-RATE,

• Protocol: -
• Function: -
• Interface: -
• Standards: -
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

JANTXV2N5152U3

Microchip Technology

TRANS NPN 80V 0.001A U3

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 1 mA
• Voltage - Collector Emitter Breakdown (Max): 80 V
• Vce Saturation (Max) @ Ib, Ic: 1.5V @ 500mA, 5A
• Current - Collector Cutoff (Max): 1mA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 2.5A, 5V
• Power - Max: 1 W
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 3-SMD, No Lead
• Supplier Device Package: U3

paquet: -

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JAN1N3316B

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 17 V
• Tolerance: ±5%
• Power - Max: 50 W
• Impedance (Max) (Zzt): 1.8 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 13 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 10 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-5

paquet: -

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JAN1N4467CUS-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 12 V
• Tolerance: ±2%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 7 Ohms
• Current - Reverse Leakage @ Vr: 200 nA @ 9.6 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, A
• Supplier Device Package: D-5A

paquet: -

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CDLL4583-TR

Microchip Technology

DIODE ZENER TEMP COMPENSATED

• Voltage - Zener (Nom) (Vz): -
• Tolerance: -
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 25 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: 0°C ~ 75°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

paquet: -

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JANKCA1N5520D

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 3.9 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 22 Ohms
• Current - Reverse Leakage @ Vr: 1 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

paquet: -

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JAN1N4959US-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 11 V
• Tolerance: ±5%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 2.5 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, E
• Supplier Device Package: D-5B

paquet: -

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1N1206B

Microchip Technology

STANDARD RECTIFIER

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 600 V
• Current - Average Rectified (Io): 12A
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 30 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 10 µA @ 600 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-203AA, DO-4, Stud
• Supplier Device Package: DO-4 (DO-203AA)
• Operating Temperature - Junction: -65°C ~ 200°C

paquet: -

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JAN1N6634DUS

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 3.9 V
• Tolerance: ±1%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 2 Ohms
• Current - Reverse Leakage @ Vr: 175 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, E
• Supplier Device Package: D-5B

paquet: -

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JANSD2N3637UB

Microchip Technology

RH SMALL-SIGNAL BJT

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 1 A
• Voltage - Collector Emitter Breakdown (Max): 175 V
• Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 50mA
• Current - Collector Cutoff (Max): 10µA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 10V
• Power - Max: 1 W
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 3-SMD, No Lead
• Supplier Device Package: UB

paquet: -

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