Produits Microchip Technology

DSC1101DE5-100.0000

Microchip Technology

OSC MEMS 100.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 100MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±10ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 35mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 6-SMD, No Lead

DSC1001CI1-012.2880T

Microchip Technology

OSC MEMS 12.2880MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 12.288MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 4-SMD, No Lead

DSC1001CI1-111.0000T

Microchip Technology

OSC MEMS 111.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 111MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 8.7mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 4-SMD, No Lead

DSC1123AI5-322.2656T

Microchip Technology

OSC MEMS 322.2656MHZ LVDS SMD

• Type: MEMS (Silicon)
• Frequency: 322.2656MHz
• Function: Enable/Disable
• Output: LVDS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 32mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead, Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 6-SMD, No Lead, Exposed Pad

DSC1033AI1-075.0000T

Microchip Technology

OSC MEMS 75.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 75MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 3.3V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 4mA (Typ)
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 4-SMD, No Lead Exposed Pad

DSC1001CE2-003.5800T

Microchip Technology

OSC MEMS 3.580MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 3.58MHz
• Function: Standby (Power Down)
• Output: LVCMOS
• Voltage - Supply: 1.7 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Operating Temperature: -20°C ~ 70°C
• Current - Supply (Max): 6.3mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 4-SMD, No Lead

MIC37300-2.5BR

Microchip Technology

IC REG LINEAR 2.5V 3A S-PAK-3

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 6V
• Voltage - Output (Min/Fixed): 2.5V
• Voltage - Output (Max): -
• Voltage Dropout (Max): -
• Current - Output: 3A
• Current - Quiescent (Iq): -
• Current - Supply (Max): 50mA
• PSRR: -
• Control Features: -
• Protection Features: Over Current, Over Temperature, Reverse Polarity
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: Spak-3 (3 Leads + Tab)
• Supplier Device Package: S-PAK-3

paquet: Spak-3 (3 Leads + Tab)

MIC5304-XDYMT-TR

Microchip Technology

IC REG LIN 1.85/3.15V 150MA 6MLF

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.85V, 3.15V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.15V @ 150mA
• Current - Output: 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 35µA
• PSRR: 65dB ~ 50dB (1kHz ~ 20kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 6-UFDFN Exposed Pad, 6-TMLF?
• Supplier Device Package: 6-TMLF? (1.6x1.6)

paquet: 6-UFDFN Exposed Pad, 6-TMLF?

AT49BV512-90JC

Microchip Technology

IC FLASH 512KBIT 90NS 32PLCC

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 512Kb (64K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 30µs
• Access Time: 90ns
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C (TC)
• Mounting Type: Surface Mount
• Package / Case: 32-LCC (J-Lead)
• Supplier Device Package: 32-PLCC

paquet: 32-LCC (J-Lead)

KSZ8721BA4 TR

Microchip Technology

IC TXRX ETHERNET 48SSOP

• Type: Transceiver
• Protocol: MII, RMII
• Number of Drivers/Receivers: 1/1
• Duplex: Full
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 48-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 48-SSOP

paquet: 48-BSSOP (0.295", 7.50mm Width)

TS87C51RB2-MCA

Microchip Technology

IC MCU 8BIT 16KB OTP 40PDIL

• Core Processor: 80C51
• Core Size: 8-Bit
• Speed: 40/20MHz
• Connectivity: UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 40-DIP (0.600", 15.24mm)
• Supplier Device Package: 40-PDIL

paquet: 40-DIP (0.600", 15.24mm)

PIC32MX120F032DT-50I/PT

Microchip Technology

IC MCU 32BIT 32KB FLASH 44TQFP

• Core Processor: MIPS32? M4K?
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, LIN, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

paquet: 44-TQFP

PIC16F1825-E/P

Microchip Technology

IC MCU 8BIT 14KB FLASH 14DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 11
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 14-DIP (0.300", 7.62mm)
• Supplier Device Package: 14-PDIP

paquet: 14-DIP (0.300", 7.62mm)

PIC16F18345-I/GZ

Microchip Technology

IC MCU 8BIT 14KB FLASH 20UQFN

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
• Data Converters: A/D 17x10b, D/A 1x5b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-UFQFN Exposed Pad
• Supplier Device Package: 20-UQFN (4x4)

paquet: 20-UFQFN Exposed Pad

MCP41100-I/P

Microchip Technology

IC POT DIGITAL 100K 1CH SPI 8DIP

• Taper: Linear
• Configuration: Potentiometer
• Number of Circuits: 1
• Number of Taps: 256
• Resistance (Ohms): 100k
• Interface: SPI
• Memory Type: Volatile
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: -
• Tolerance: ±30%
• Temperature Coefficient (Typ): 800 ppm/°C
• Resistance - Wiper (Ohms) (Typ): 175
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

paquet: 8-DIP (0.300", 7.62mm)

SY89808LTG

Microchip Technology

IC CLK BUFFER 2:9 500MHZ 32TQFP

• Type: Fanout Buffer (Distribution), Multiplexer, Translator
• Number of Circuits: 1
• Ratio - Input:Output: 2:9
• Differential - Input:Output: Yes/Yes
• Input: HSTL, LVPECL
• Output: HSTL
• Frequency - Max: 500MHz
• Voltage - Supply: 3.15 V ~ 3.45 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-TQFP
• Supplier Device Package: 32-TQFP (7x7)

paquet: 32-TQFP

MCP1631T-E/MLVAO

Microchip Technology

INTEGRATED HS PWM

• Output Type: Transistor Driver
• Function: Step-Up/Step-Down
• Output Configuration: Positive
• Topology: Sepic
• Number of Outputs: 1
• Output Phases: 1
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 16 V
• Frequency - Switching: -
• Duty Cycle (Max): -
• Synchronous Rectifier: No
• Clock Sync: No
• Serial Interfaces: -
• Control Features: Enable, Frequency Control, Ramp
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 20-VFQFN Exposed Pad
• Supplier Device Package: 20-QFN (4x4)

paquet: 20-VFQFN Exposed Pad

PIC32MZ1024EFF144-E/PH

Microchip Technology

IC MCU 32BIT 1MB FLASH 144TQFP

• Core Processor: MIPS32® M-Class
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, PMP, SPI, SQI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number of I/O: 120
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 2.1 V ~ 3.6 V
• Data Converters: A/D 48x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-TQFP
• Supplier Device Package: 144-TQFP (16x16)

paquet: 144-TQFP

MAX3639ETM2

Microchip Technology

IC CLOCK GENERATOR PROGR 48TQFN

• PLL: Yes
• Main Purpose: Ethernet, Fibre Channel, PCI Express (PCIe), SONET/SDH
• Input: LVCMOS, LVTTL, Crystal
• Output: LVCMOS, LVDS, LVPECL
• Number of Circuits: 1
• Ratio - Input:Output: 3:10
• Differential - Input:Output: Yes/Yes
• Frequency - Max: 800MHz
• Voltage - Supply: 3V ~ 3.6V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-WFQFN Exposed Pad
• Supplier Device Package: 48-TQFN (7x7)

paquet: 48-WFQFN Exposed Pad

1N4464D

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 9.1 V
• Tolerance: ±1%
• Power - Max: 1.5 W
• Impedance (Max) (Zzt): 4 Ohms
• Current - Reverse Leakage @ Vr: 300 nA @ 5.46 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AL, DO041, Axial
• Supplier Device Package: DO-41

paquet: -

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JANTX1N6355D

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 200 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 1800 Ohms
• Current - Reverse Leakage @ Vr: 50 nA @ 152 V
• Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: B, Axial
• Supplier Device Package: B, Axial

paquet: -

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1N5527BUR-1

Microchip Technology

DIODE ZENER

• Voltage - Zener (Nom) (Vz): 7.5 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 35 Ohms
• Current - Reverse Leakage @ Vr: 500 nA @ 6.8 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

paquet: -

PIC24FJ512GU406-E-PT

Microchip Technology

IC MCU 16BIT 512KB FLASH 64TQFP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
• Peripherals: DMA, LCD, PWM, WDT
• Number of I/O: -
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
• Data Converters: A/D 24x10/12b; D/A 1x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

paquet: -

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1N4730AUR-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 3.9 V
• Tolerance: ±5%
• Power - Max: 1 W
• Impedance (Max) (Zzt): 9 Ohms
• Current - Reverse Leakage @ Vr: 50 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AB, MELF (Glass)
• Supplier Device Package: DO-213AB (MELF, LL41)

paquet: -

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MCP47CVD11T-E-UN

Microchip Technology

IC DAC 10BIT V-OUT 10MSOP

• Number of Bits: 10
• Number of D/A Converters: 1
• Settling Time: 4µs
• Output Type: Voltage - Buffered
• Differential Output: No
• Data Interface: I2C
• Reference Type: External, Internal, Supply
• Voltage - Supply, Analog: 1.8V ~ 5.5V
• Voltage - Supply, Digital: 1.8V ~ 5.5V
• INL/DNL (LSB): ±0.25 (Max), ±0.25 (Max)
• Architecture: String DAC
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 10-MSOP
• Mounting Type: Surface Mount

paquet: -

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1N4620UR-1

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 3.3 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 1650 Ohms
• Current - Reverse Leakage @ Vr: 7.5 µA @ 1.5 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TA)
• Mounting Type: Surface Mount
• Package / Case: DO-213AA (Glass)
• Supplier Device Package: DO-213AA

paquet: -

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MVR2N2222AUA-TR

Microchip Technology

RH SMALL-SIGNAL BJT

• Transistor Type: NPN
• Current - Collector (Ic) (Max): 800 mA
• Voltage - Collector Emitter Breakdown (Max): 50 V
• Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
• Current - Collector Cutoff (Max): 50nA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
• Power - Max: 650 mW
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Supplier Device Package: UA

paquet: -

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JAN1N4150UR-1-TR

Microchip Technology

DIODE GEN PURP 50V 200MA DO213AA

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 50 V
• Current - Average Rectified (Io): 200mA
• Voltage - Forward (Vf) (Max) @ If: 1 V @ 200 mA
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 4 ns
• Current - Reverse Leakage @ Vr: 100 nA @ 50 V
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA
• Operating Temperature - Junction: -65°C ~ 175°C

paquet: -

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