Produits Microchip Technology

DSC1033AI1-050.0000

Microchip Technology

OSC MEMS 50.0000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 50MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 3.3V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 4mA (Typ)
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead Exposed Pad
• Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 4-SMD, No Lead Exposed Pad

DSC1001BI5-032.0000

Microchip Technology

OSC MEMS 32.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 32MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 V ~ 3.3 V
• Frequency Stability: ±10ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 7.2mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 4-SMD, No Lead

DSC1033CI1-014.3182T

Microchip Technology

OSC MEMS 14.3182MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 14.3182MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 3.3V
• Frequency Stability: ±50ppm
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (Max): 3mA (Typ)
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 4-SMD, No Lead

DSC1004DC1-050.0000T

Microchip Technology

OSC MEMS 50.000MHZ CMOS SMD

• Type: MEMS (Silicon)
• Frequency: 50MHz
• Function: Standby (Power Down)
• Output: CMOS
• Voltage - Supply: 1.8 ~ 3.3V
• Frequency Stability: ±50ppm
• Operating Temperature: 0°C ~ 70°C
• Current - Supply (Max): 8mA
• Ratings: -
• Mounting Type: Surface Mount
• Package / Case: 4-SMD, No Lead
• Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
• Height - Seated (Max): 0.035" (0.90mm)

paquet: 4-SMD, No Lead

AT73C238

Microchip Technology

IC POWER MANAGEMENT

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

MIC4420BN

Microchip Technology

IC DRIVER MOSFET 6A LO SIDE 8DIP

• Driven Configuration: Low-Side
• Channel Type: Single
• Number of Drivers: 1
• Gate Type: N-Channel, P-Channel MOSFET
• Voltage - Supply: 4.5 V ~ 18 V
• Logic Voltage - VIL, VIH: 0.8V, 2.4V
• Current - Peak Output (Source, Sink): 6A, 6A
• Input Type: Non-Inverting
• High Side Voltage - Max (Bootstrap): -
• Rise / Fall Time (Typ): 12ns, 13ns
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

paquet: 8-DIP (0.300", 7.62mm)

AT28C256F-15PU

Microchip Technology

IC EEPROM 256KBIT 150NS 28DIP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 256Kb (32K x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 3ms
• Access Time: 150ns
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TC)
• Mounting Type: Through Hole
• Package / Case: 28-DIP (0.600", 15.24mm)
• Supplier Device Package: 28-PDIP

paquet: 28-DIP (0.600", 15.24mm)

AT25080A-10TU-2.7-T

Microchip Technology

IC EEPROM 8KBIT 20MHZ 8TSSOP

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 8Kb (1K x 8)
• Memory Interface: SPI
• Clock Frequency: 20MHz
• Write Cycle Time - Word, Page: 5ms
• Access Time: -
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 8-TSSOP

paquet: 8-TSSOP (0.173", 4.40mm Width)

SST39VF1681-70-4C-EKE-T

Microchip Technology

IC FLASH 16MBIT 70NS 48TSOP

• Memory Type: Non-Volatile
• Memory Format: FLASH
• Technology: FLASH
• Memory Size: 16Mb (2M x 8)
• Memory Interface: Parallel
• Clock Frequency: -
• Write Cycle Time - Word, Page: 10µs
• Access Time: 70ns
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.724", 18.40mm Width)
• Supplier Device Package: 48-TSOP

paquet: 48-TFSOP (0.724", 18.40mm Width)

MCP6547-E/SN

Microchip Technology

IC COMP 1.6V DUAL O-D 8SOIC

• Type: General Purpose
• Number of Elements: 2
• Output Type: CMOS, Open-Drain, Rail-to-Rail, TTL
• Voltage - Supply, Single/Dual (±): 1.6 V ~ 5.5 V
• Voltage - Input Offset (Max): 7mV @ 5.5V
• Current - Input Bias (Max): 1pA @ 5.5V
• Current - Output (Typ): 30mA
• Current - Quiescent (Max): 1µA
• CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
• Propagation Delay (Max): 8µs
• Hysteresis: 6.5mV
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Mounting Type: Surface Mount
• Supplier Device Package: 8-SOIC

paquet: 8-SOIC (0.154", 3.90mm Width)

PIC16F639-I/P

Microchip Technology

IC MCU 8BIT 3.5KB FLASH 20DIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: -
• Peripherals: Brown-out Detect/Reset, LVD, POR, WDT
• Number of I/O: 11
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-PDIP

paquet: 20-DIP (0.300", 7.62mm)

PIC16C63T-04I/SO

Microchip Technology

IC MCU 8BIT 7KB OTP 28SOIC

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 7KB (4K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 192 x 8
• Voltage - Supply (Vcc/Vdd): 4 V ~ 6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

paquet: 28-SOIC (0.295", 7.50mm Width)

PIC18F67J90T-I/PT

Microchip Technology

IC MCU 8BIT 128KB FLASH 64TQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, LVD, POR, PWM, WDT
• Number of I/O: 51
• Program Memory Size: 128KB (64K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3.8K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-TQFP
• Supplier Device Package: 64-TQFP (10x10)

paquet: 64-TQFP

AT40K20LV-3CQI

Microchip Technology

IC FPGA 3.3V 1024 CELL 160QFP

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 1024
• Total RAM Bits: 8192
• Number of I/O: 130
• Number of Gates: 30000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 160-BQFP
• Supplier Device Package: 160-PQFP (28x28)

paquet: 160-BQFP

AT30TS750A-SS8M-B

Microchip Technology

SENSOR TEMP I2C/SMBUS 8SOIC

• Sensor Type: Digital, Local
• Sensing Temperature - Local: -55°C ~ 125°C
• Sensing Temperature - Remote: -
• Output Type: I2C/SMBus
• Voltage - Supply: 1.7 V ~ 5.5 V
• Resolution: 11 b
• Features: One-Shot, Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
• Accuracy - Highest (Lowest): ±1°C (±3°C)
• Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

paquet: 8-SOIC (0.154", 3.90mm Width)

AT86RF215-ZU

Microchip Technology

IC RF TXRX 802.15.4/ISM 48-VFQFN

• Type: TxRx Only
• RF Family/Standard: 802.15.4, General ISM < 1GHz
• Protocol: -
• Modulation: FSK, OFDM, O-QPSK
• Frequency: 389.5MHz ~ 510MHz, 779MHz ~ 1.02GHz, 2.4GHz
• Data Rate (Max): 2.4Mbps
• Power - Output: 16dBm
• Sensitivity: -123dBm
• Memory Size: -
• Serial Interfaces: SPI
• GPIO: -
• Voltage - Supply: 1.8 V ~ 3.6 V
• Current - Receiving: 5mA ~ 33mA
• Current - Transmitting: 62mA ~ 64mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-VFQFN Exposed Pad

paquet: 48-VFQFN Exposed Pad

MICRF022BM-FS24

Microchip Technology

IC RECEIVER ASK 300-440MHZ 8SOIC

• Frequency: 300MHz ~ 440MHz
• Sensitivity: -97dBm
• Data Rate (Max): 10 kbps
• Modulation or Protocol: ASK, OOK
• Applications: RKE
• Current - Receiving: 2.2mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 4.75 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

paquet: 8-SOIC (0.154", 3.90mm Width)

MT9171AN1

Microchip Technology

IC DSIC SUBSCRIBER NETWRK 24SSOP

• Function: Subscriber Line Interface Concept (SLIC)
• Interface: -
• Number of Circuits: 1
• Voltage - Supply: 4.75V ~ 5.25V
• Current - Supply: 10mA
• Power (Watts): -
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

paquet: 24-SSOP (0.209", 5.30mm Width)

PIC24FJ256GU408-E-PT

Microchip Technology

IC MCU 16BIT 256KB FLASH 80TQFP

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
• Peripherals: DMA, LCD, PWM, WDT
• Number of I/O: -
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
• Data Converters: A/D 24x10/12b; D/A 1x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP
• Supplier Device Package: 80-TQFP (12x12)

paquet: -

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2N2907AP

Microchip Technology

SMALL-SIGNAL BJT

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 600 mA
• Voltage - Collector Emitter Breakdown (Max): 60 V
• Vce Saturation (Max) @ Ib, Ic: 1.6V @ 50mA, 500mA
• Current - Collector Cutoff (Max): 50nA
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
• Power - Max: 500 mW
• Frequency - Transition: -
• Operating Temperature: -65°C ~ 200°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-206AA, TO-18-3 Metal Can
• Supplier Device Package: TO-18 (TO-206AA)

paquet: -

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GC4732-150A

Microchip Technology

SI LIMITER NON HERMETIC EPSM SMT

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 15V
• Current - Max: -
• Capacitance @ Vr, F: 0.15pF @ 6V, 1MHz
• Resistance @ If, F: 1.5Ohm @ 10mA, 100MHz
• Power Dissipation (Max): 3 W
• Operating Temperature: -55°C ~ 150°C
• Package / Case: Die
• Supplier Device Package: Chip

paquet: -

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1N4571-1-TR

Microchip Technology

DIODE ZENER TEMP COMPENSATED

• Voltage - Zener (Nom) (Vz): 6.4 V
• Tolerance: ±1%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 100 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

paquet: -

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MSCSM170DUM11T3AG

Microchip Technology

SIC 2N-CH 1700V 240A SP3F

• FET Type: Silicon Carbide (SiC)
• FET Feature: -
• Drain to Source Voltage (Vdss): 1700V (1.7kV)
• Current - Continuous Drain (Id) @ 25°C: 240A (Tc)
• Rds On (Max) @ Id, Vgs: 11.3mOhm @ 120A, 20V
• Vgs(th) (Max) @ Id: 3.2V @ 10mA
• Gate Charge (Qg) (Max) @ Vgs: 712nC @ 20V
• Input Capacitance (Ciss) (Max) @ Vds: 13200pF @ 1000V
• Power - Max: 1140W (Tc)
• Operating Temperature: -40°C ~ 175°C (TJ)
• Mounting Type: Chassis Mount
• Package / Case: Module
• Supplier Device Package: SP3F

paquet: -

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JANTX1N4938-1-TR

Microchip Technology

DIODE GEN PURP 175V 100MA DO35

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 175 V
• Current - Average Rectified (Io): 100mA
• Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 50 ns
• Current - Reverse Leakage @ Vr: 100 nA @ 175 V
• Capacitance @ Vr, F: -
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-35
• Operating Temperature - Junction: -65°C ~ 175°C

paquet: -

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2N4912

Microchip Technology

TRANS PNP 80V 4A TO66

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 4 A
• Voltage - Collector Emitter Breakdown (Max): 80 V
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: 25 W
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: Through Hole
• Package / Case: TO-213AA, TO-66-2
• Supplier Device Package: TO-66 (TO-213AA)

paquet: -

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JANTX1N3319B

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 20 V
• Tolerance: ±5%
• Power - Max: 50 W
• Impedance (Max) (Zzt): 2.4 Ohms
• Current - Reverse Leakage @ Vr: 10 µA @ 15.2 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 10 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Stud Mount
• Package / Case: DO-203AB, DO-5, Stud
• Supplier Device Package: DO-5

paquet: -

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JANS1N4954DUS

Microchip Technology

ZENER DIODE

• Voltage - Zener (Nom) (Vz): 6.8 V
• Tolerance: ±1%
• Power - Max: 5 W
• Impedance (Max) (Zzt): 1 Ohms
• Current - Reverse Leakage @ Vr: 150 µA @ 5.2 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SQ-MELF, E
• Supplier Device Package: D-5B

paquet: -

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JAN1N3168

Microchip Technology

DIODE GP 400V 300A DO205AB DO9

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 400 V
• Current - Average Rectified (Io): 300A
• Voltage - Forward (Vf) (Max) @ If: 1.55 V @ 940 A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 10 mA @ 400 V
• Capacitance @ Vr, F: -
• Mounting Type: Stud Mount
• Package / Case: DO-205AB, DO-9, Stud
• Supplier Device Package: DO-205AB (DO-9)
• Operating Temperature - Junction: -65°C ~ 200°C

paquet: -

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