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Produits Microchip Technology

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DSC1001CL2-020.0000T
Microchip Technology

OSC MEMS 20.000MHZ CMOS SMD

  • Type: MEMS (Silicon)
  • Frequency: 20MHz
  • Function: Standby (Power Down)
  • Output: CMOS
  • Voltage - Supply: 1.8 V ~ 3.3 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 105°C
  • Current - Supply (Max): 6.3mA
  • Ratings: AEC-Q100
  • Mounting Type: Surface Mount
  • Package / Case: 4-SMD, No Lead
  • Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
  • Height - Seated (Max): 0.035" (0.90mm)
paquet: 4-SMD, No Lead
Stock2 934
DSC1001CI2-018.0000T
Microchip Technology

OSC MEMS 18.000MHZ CMOS SMD

  • Type: MEMS (Silicon)
  • Frequency: 18MHz
  • Function: Standby (Power Down)
  • Output: CMOS
  • Voltage - Supply: 1.8 V ~ 3.3 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): 6.3mA
  • Ratings: AEC-Q100
  • Mounting Type: Surface Mount
  • Package / Case: 4-SMD, No Lead
  • Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
  • Height - Seated (Max): 0.035" (0.90mm)
paquet: 4-SMD, No Lead
Stock7 092
DSC1001DL2-001.8432T
Microchip Technology

OSC MEMS 1.8432MHZ CMOS SMD

  • Type: MEMS (Silicon)
  • Frequency: 1.8432MHz
  • Function: Standby (Power Down)
  • Output: CMOS
  • Voltage - Supply: 1.8 V ~ 3.3 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 105°C
  • Current - Supply (Max): 6.3mA
  • Ratings: AEC-Q100
  • Mounting Type: Surface Mount
  • Package / Case: 4-SMD, No Lead
  • Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
  • Height - Seated (Max): 0.035" (0.90mm)
paquet: 4-SMD, No Lead
Stock3 996
DSC1001DI2-100.0000T
Microchip Technology

OSC MEMS 100.000MHZ CMOS SMD

  • Type: MEMS (Silicon)
  • Frequency: 100MHz
  • Function: Standby (Power Down)
  • Output: CMOS
  • Voltage - Supply: 1.8 V ~ 3.3 V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): 8.7mA
  • Ratings: AEC-Q100
  • Mounting Type: Surface Mount
  • Package / Case: 4-SMD, No Lead
  • Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
  • Height - Seated (Max): 0.035" (0.90mm)
paquet: 4-SMD, No Lead
Stock2 502
DSC1033AI2-025.0000
Microchip Technology

OSC MEMS 25.0000MHZ CMOS SMD

  • Type: MEMS (Silicon)
  • Frequency: 25MHz
  • Function: Standby (Power Down)
  • Output: CMOS
  • Voltage - Supply: 3.3V
  • Frequency Stability: ±25ppm
  • Operating Temperature: -40°C ~ 85°C
  • Current - Supply (Max): 3mA (Typ)
  • Ratings: -
  • Mounting Type: Surface Mount
  • Package / Case: 4-SMD, No Lead Exposed Pad
  • Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
  • Height - Seated (Max): 0.035" (0.90mm)
paquet: 4-SMD, No Lead Exposed Pad
Stock3 978
MCS3142T-I/ST
Microchip Technology

IC KEELOG ENCODER DUAL 20TSSOP

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 168
LP2951-4.8YMTR
Microchip Technology

IC REG LIN POS ADJ 100MA 8SOIC

  • Output Configuration: Positive
  • Output Type: Adjustable (Fixed)
  • Number of Regulators: 1
  • Voltage - Input (Max): 30V
  • Voltage - Output (Min/Fixed): 1.24V (4.85V)
  • Voltage - Output (Max): 29V
  • Voltage Dropout (Max): 0.6V @ 100mA
  • Current - Output: 100mA
  • Current - Quiescent (Iq): -
  • Current - Supply (Max): 150µA ~ 14mA
  • PSRR: -
  • Control Features: Enable, Error Flag
  • Protection Features: -
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock5 984
AT28LV64B-25PC
Microchip Technology

IC EEPROM 64KBIT 250NS 28DIP

  • Memory Type: Non-Volatile
  • Memory Format: EEPROM
  • Technology: EEPROM
  • Memory Size: 64Kb (8K x 8)
  • Memory Interface: Parallel
  • Clock Frequency: -
  • Write Cycle Time - Word, Page: 10ms
  • Access Time: 250ns
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C (TC)
  • Mounting Type: Through Hole
  • Package / Case: 28-DIP (0.600", 15.24mm)
  • Supplier Device Package: 28-PDIP
paquet: 28-DIP (0.600", 15.24mm)
Stock6 928
93C46B-E/P
Microchip Technology

IC EEPROM 1KBIT 2MHZ 8DIP

  • Memory Type: Non-Volatile
  • Memory Format: EEPROM
  • Technology: EEPROM
  • Memory Size: 1Kb (64 x 16)
  • Memory Interface: SPI
  • Clock Frequency: 2MHz
  • Write Cycle Time - Word, Page: 2ms
  • Access Time: -
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Through Hole
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
paquet: 8-DIP (0.300", 7.62mm)
Stock3 072
SY100EL57LZG-TR
Microchip Technology

ID MULTIPLEXER 4:1 DIFF 16-SOIC

  • Type: Multiplexer
  • Circuit: 4 x 2:1
  • Independent Circuits: 1
  • Current - Output High, Low: -
  • Voltage Supply Source: Dual Supply
  • Voltage - Supply: 3 V ~ 3.8 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SOIC
paquet: 16-SOIC (0.154", 3.90mm Width)
Stock6 064
ATA6612C-PLQW-1
Microchip Technology

IC MCU 8BIT 8KB FLASH 48QFN

  • Core Processor: AVR
  • Core Size: 8-Bit
  • Speed: 16MHz
  • Connectivity: I2C, LIN, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
  • Number of I/O: 23
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TC)
  • Mounting Type: -
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
paquet: 48-VFQFN Exposed Pad
Stock2 960
PIC17C752T-16E/L
Microchip Technology

IC MCU 8BIT 16KB OTP 68PLCC

  • Core Processor: PIC
  • Core Size: 8-Bit
  • Speed: 16MHz
  • Connectivity: I2C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
  • Number of I/O: 50
  • Program Memory Size: 16KB (8K x 16)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 454 x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 12x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 68-LCC (J-Lead)
  • Supplier Device Package: 68-PLCC (24.23x24.23)
paquet: 68-LCC (J-Lead)
Stock5 552
PIC17C43-25/PT
Microchip Technology

IC MCU 8BIT 8KB OTP 44TQFP

  • Core Processor: PIC
  • Core Size: 8-Bit
  • Speed: 25MHz
  • Connectivity: UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 33
  • Program Memory Size: 8KB (4K x 16)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 454 x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 6 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-TQFP (10x10)
paquet: 44-TQFP
Stock5 440
PIC16F87-E/P
Microchip Technology

IC MCU 8BIT 7KB FLASH 18DIP

  • Core Processor: PIC
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
  • Number of I/O: 16
  • Program Memory Size: 7KB (4K x 14)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 368 x 8
  • Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 18-DIP (0.300", 7.62mm)
  • Supplier Device Package: 18-PDIP
paquet: 18-DIP (0.300", 7.62mm)
Stock7 248
PIC16F1705T-I/ML
Microchip Technology

IC MCU 8BIT 14KB FLASH 16QFN

  • Core Processor: PIC
  • Core Size: 8-Bit
  • Speed: 32MHz
  • Connectivity: I2C, LIN, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
  • Number of I/O: 12
  • Program Memory Size: 14KB (8K x 14)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 2.3 V ~ 5.5 V
  • Data Converters: A/D 8x10b, D/A 1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-VQFN Exposed Pad
  • Supplier Device Package: 16-QFN (4x4)
paquet: 16-VQFN Exposed Pad
Stock3 280
PIC12F617T-I/MS
Microchip Technology

IC MCU 8BIT 3.5KB FLASH 8MSOP

  • Core Processor: PIC
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: -
  • Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
  • Number of I/O: 5
  • Program Memory Size: 3.5KB (2K x 14)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
  • Data Converters: A/D 4x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Supplier Device Package: 8-MSOP
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Stock7 792
PIC12LF1552-E/SN
Microchip Technology

IC MCU 8BIT 3.5KB FLASH 8SOIC

  • Core Processor: PIC
  • Core Size: 8-Bit
  • Speed: 32MHz
  • Connectivity: I2C, SPI
  • Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
  • Number of I/O: 5
  • Program Memory Size: 3.5KB (2K x 14)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 4x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock6 432
RN-111B-R
Microchip Technology

RF TXRX MODULE WIFI RP-SMA ANT

  • RF Family/Standard: WiFi
  • Protocol: 802.11b
  • Modulation: CDK, DBPSK, DQPSK, DSSS
  • Frequency: 2.4GHz
  • Data Rate: 200kbps
  • Power - Output: 12dBm
  • Sensitivity: -93dBm
  • Serial Interfaces: SPI, UART
  • Antenna Type: Not Included, RP-SMA
  • Memory Size: 4MB Flash, 300kB ROM, 80kB RAM
  • Voltage - Supply: 3 V ~ 3.6 V
  • Current - Receiving: 40mA
  • Current - Transmitting: 110mA
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: Module
paquet: Module
Stock7 668
MCP103T-270E/TTVAO
Microchip Technology

SUPERVISOR PUSH-PULL ACTIVE LOW

  • Type: Simple Reset/Power-On Reset
  • Number of Voltages Monitored: 1
  • Output: Push-Pull, Totem Pole
  • Reset: Active Low
  • Reset Timeout: 80 ms Minimum
  • Voltage - Threshold: 2.63V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SOT-23-3
paquet: TO-236-3, SC-59, SOT-23-3
Stock3 216
MCP14E4T-E/SL
Microchip Technology

MOSFET DRVR 4.5A DUAL HS 16SOIC

  • Driven Configuration: Low-Side
  • Channel Type: Independent
  • Number of Drivers: 2
  • Gate Type: IGBT, N-Channel, P-Channel MOSFET
  • Voltage - Supply: 4.5V ~ 18V
  • Logic Voltage - VIL, VIH: 0.8V, 2.4V
  • Current - Peak Output (Source, Sink): 4A, 4A
  • Input Type: Non-Inverting
  • High Side Voltage - Max (Bootstrap): -
  • Rise / Fall Time (Typ): 15ns, 18ns
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SOIC
paquet: 16-SOIC (0.154", 3.90mm Width)
Stock7 776
JANS2N930
Microchip Technology

NPN TRANSISTOR

  • Transistor Type: NPN
  • Current - Collector (Ic) (Max): 30 mA
  • Voltage - Collector Emitter Breakdown (Max): 45 V
  • Vce Saturation (Max) @ Ib, Ic: 1V @ 500µA, 10mA
  • Current - Collector Cutoff (Max): 2nA
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10µA, 5V
  • Power - Max: 300 mW
  • Frequency - Transition: -
  • Operating Temperature: -55°C ~ 200°C (TJ)
  • Mounting Type: Through Hole
  • Package / Case: TO-206AA, TO-18-3 Metal Can
  • Supplier Device Package: TO-18 (TO-206AA)
paquet: -
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CD4750A
Microchip Technology

VOLTAGE REGULATOR

  • Voltage - Zener (Nom) (Vz): 27 V
  • Tolerance: ±5%
  • Power - Max: 1 W
  • Impedance (Max) (Zzt): 35 Ohms
  • Current - Reverse Leakage @ Vr: 100 nA @ 20.6 V
  • Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
  • Operating Temperature: -65°C ~ 175°C
  • Mounting Type: Surface Mount
  • Package / Case: Die
  • Supplier Device Package: Die
paquet: -
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1N4125-1
Microchip Technology

DIODE ZENER

  • Voltage - Zener (Nom) (Vz): 47 V
  • Tolerance: ±5%
  • Power - Max: 500 mW
  • Impedance (Max) (Zzt): 250 Ohms
  • Current - Reverse Leakage @ Vr: 10 nA @ 35.8 V
  • Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
  • Operating Temperature: -65°C ~ 175°C (TJ)
  • Mounting Type: Through Hole
  • Package / Case: DO-204AH, DO-35, Axial
  • Supplier Device Package: DO-204AH (DO-35)
paquet: -
Request a Quote
S50410TS
Microchip Technology

STD RECTIFIER

  • Diode Type: -
  • Voltage - DC Reverse (Vr) (Max): -
  • Current - Average Rectified (Io): -
  • Voltage - Forward (Vf) (Max) @ If: -
  • Speed: -
  • Reverse Recovery Time (trr): -
  • Current - Reverse Leakage @ Vr: -
  • Capacitance @ Vr, F: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
  • Operating Temperature - Junction: -
paquet: -
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CDS5531DUR-1
Microchip Technology

VOLTAGE REGULATOR

  • Voltage - Zener (Nom) (Vz): -
  • Tolerance: -
  • Power - Max: -
  • Impedance (Max) (Zzt): -
  • Current - Reverse Leakage @ Vr: -
  • Voltage - Forward (Vf) (Max) @ If: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
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1N4571A-TR
Microchip Technology

TEMPERATURE COMPENSATED

  • Voltage - Zener (Nom) (Vz): 6.4 V
  • Tolerance: ±5%
  • Power - Max: 500 mW
  • Impedance (Max) (Zzt): 100 Ohms
  • Current - Reverse Leakage @ Vr: 2 µA @ 3 V
  • Voltage - Forward (Vf) (Max) @ If: -
  • Operating Temperature: -65°C ~ 175°C
  • Mounting Type: Through Hole
  • Package / Case: DO-204AH, DO-35, Axial
  • Supplier Device Package: DO-204AH (DO-35)
paquet: -
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JAN1N6345US-TR
Microchip Technology

VOLTAGE REGULATOR

  • Voltage - Zener (Nom) (Vz): 75 V
  • Tolerance: ±5%
  • Power - Max: 500 mW
  • Impedance (Max) (Zzt): 180 Ohms
  • Current - Reverse Leakage @ Vr: 50 nA @ 56 V
  • Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
  • Operating Temperature: -65°C ~ 175°C
  • Mounting Type: Surface Mount
  • Package / Case: SQ-MELF, B
  • Supplier Device Package: B, SQ-MELF
paquet: -
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SM1001-M1
Microchip Technology

SI PIN HERMETIC MELF

  • Diode Type: PIN - Single
  • Voltage - Peak Reverse (Max): 700V
  • Current - Max: 1 A
  • Capacitance @ Vr, F: 1.3pF @ 50V, 1MHz
  • Resistance @ If, F: 350mOhm @ 100mA, 100MHz
  • Power Dissipation (Max): -
  • Operating Temperature: -55°C ~ 150°C (TJ)
  • Package / Case: 1208 (3020 Metric)
  • Supplier Device Package: M1
paquet: -
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