Produits Intel

HC1S80F1020AS

Intel

IC FPGA APEX 1020FBGA

• Number of LABs/CLBs: 7904
• Number of Logic Elements/Cells: 79040
• Total RAM Bits: 5658048
• Number of I/O: 782
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -
• Package / Case: 1020-BBGA
• Supplier Device Package: 1020-FBGA (33x33)

paquet: 1020-BBGA

10AX032E1F27E1SG

Intel

IC FPGA 240 I/O 672FBGA

• Number of LABs/CLBs: 119900
• Number of Logic Elements/Cells: 320000
• Total RAM Bits: 21040128
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

paquet: 672-BBGA, FCBGA

EP20K300ERC208-1X

Intel

IC FPGA

• Number of LABs/CLBs: 1152
• Number of Logic Elements/Cells: 11520
• Total RAM Bits: 147456
• Number of I/O: -
• Number of Gates: 728000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BQFP
• Supplier Device Package: 208-RQFP (28x28)

paquet: 208-BQFP

EP20K300EQC240-2X

Intel

IC FPGA 152 I/O 240QFP

• Number of LABs/CLBs: 1152
• Number of Logic Elements/Cells: 11520
• Total RAM Bits: 147456
• Number of I/O: 152
• Number of Gates: 728000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BQFP
• Supplier Device Package: 240-PQFP (32x32)

paquet: 240-BQFP

EP1S20F672C7

Intel

IC FPGA 426 I/O 672FBGA

• Number of LABs/CLBs: 1846
• Number of Logic Elements/Cells: 18460
• Total RAM Bits: 1669248
• Number of I/O: 426
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA
• Supplier Device Package: 672-FBGA (27x27)

paquet: 672-BBGA

5SEEBH40I2N

Intel

IC FPGA 696 I/O 1517HBGA

• Number of LABs/CLBs: 359250
• Number of Logic Elements/Cells: 952000
• Total RAM Bits: 65561600
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-HBGA (45x45)

paquet: 1517-BBGA, FCBGA

EP4SE530F43C2

Intel

IC FPGA 1120 I/O 1760FBGA

• Number of LABs/CLBs: 21248
• Number of Logic Elements/Cells: 531200
• Total RAM Bits: 28033024
• Number of I/O: 1120
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA, FC (42.5x42.5)

paquet: 1760-BBGA, FCBGA

EP3SL70F780C3N

Intel

IC FPGA 488 I/O 780FBGA

• Number of LABs/CLBs: 2700
• Number of Logic Elements/Cells: 67500
• Total RAM Bits: 2699264
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

paquet: 780-BBGA, FCBGA

5CGXFC9A6U19I7

Intel

IC FPGA 240 I/O 484UBGA

• Number of LABs/CLBs: 113560
• Number of Logic Elements/Cells: 301000
• Total RAM Bits: 14251008
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-FBGA
• Supplier Device Package: 484-UBGA (19x19)

paquet: 484-FBGA

5AGXBA5D4F27C5N

Intel

IC FPGA 336 I/O 672FBGA

• Number of LABs/CLBs: 8962
• Number of Logic Elements/Cells: 190000
• Total RAM Bits: 13284352
• Number of I/O: 336
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

paquet: 672-BBGA, FCBGA

5CGXBC5C6F27C7N

Intel

IC FPGA 336 I/O 672FBGA

• Number of LABs/CLBs: 29080
• Number of Logic Elements/Cells: 77000
• Total RAM Bits: 5001216
• Number of I/O: 336
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BGA
• Supplier Device Package: 672-FBGA (27x27)

paquet: 672-BGA

10CX105YU484E6G

Intel

484-PIN UBGA

• Number of LABs/CLBs: 38000
• Number of Logic Elements/Cells: 104000
• Total RAM Bits: 8641536
• Number of I/O: 188
• Number of Gates: -
• Voltage - Supply: 0.9V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 484-BFBGA, FCBGA
• Supplier Device Package: 484-UBGA (19x19)

paquet: 484-BFBGA, FCBGA

EP4CE10F17A7N

Intel

IC FPGA 179 I/O 256FBGA

• Number of LABs/CLBs: 645
• Number of Logic Elements/Cells: 10320
• Total RAM Bits: 423936
• Number of I/O: 179
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FBGA (17x17)

paquet: 256-LBGA

10M08SAU169I7G

Intel

IC FPGA 130 I/O 169UBGA

• Number of LABs/CLBs: 500
• Number of Logic Elements/Cells: 8000
• Total RAM Bits: 387072
• Number of I/O: 130
• Number of Gates: -
• Voltage - Supply: 2.85 V ~ 3.465 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 169-LFBGA
• Supplier Device Package: 169-UBGA (11x11)

paquet: 169-LFBGA

EPM7KAEFC256AB

Intel

IC CPLE 256FBGA

• Programmable Type: -
• Delay Time tpd(1) Max: -
• Voltage Supply - Internal: -
• Number of Logic Elements/Blocks: -
• Number of Macrocells: -
• Number of Gates: -
• Number of I/O: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: -
• Supplier Device Package: -

paquet: -

EPM7128EQC100-10

Intel

IC CPLD 128MC 10NS 100QFP

• Programmable Type: EE PLD
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 128
• Number of Gates: 2500
• Number of I/O: 84
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-BQFP
• Supplier Device Package: 100-PQFP (20x14)

paquet: 100-BQFP

AGFB027R24C2E3E

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.7M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

paquet: -

Request a Quote

1SG280HN3F43E2LG

Intel

IC FPGA 688 I/O 1760FBGA

• Number of LABs/CLBs: 350000
• Number of Logic Elements/Cells: 2800000
• Total RAM Bits: -
• Number of I/O: 688
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

paquet: -

Request a Quote

EP4SGX360FF35I3G

Intel

IC FPGA 564 I/O 1152FBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

Request a Quote

10M08DAF256A7G

Intel

IC FPGA 178 I/O 256FBGA

• Number of LABs/CLBs: 500
• Number of Logic Elements/Cells: 8000
• Total RAM Bits: 387072
• Number of I/O: 178
• Number of Gates: -
• Voltage - Supply: 1.15V ~ 1.25V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FBGA (17x17)

paquet: -

AGFB014R24C3I3E

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.4M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

paquet: -

Request a Quote

1SX085HN1F43E1VG

Intel

IC FPGA STRATIX 10 1760FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 850K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

paquet: -

Request a Quote

1ST040EH3F35I3XG

Intel

IC FPGA STRATIX10TX 1152FBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 378000
• Total RAM Bits: 31457280
• Number of I/O: 384
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: -

Request a Quote

EP2C8AF256I8NES

Intel

IC FPGA 182 I/O 256FBGA

• Number of LABs/CLBs: 516
• Number of Logic Elements/Cells: 8256
• Total RAM Bits: 165888
• Number of I/O: 182
• Number of Gates: -
• Voltage - Supply: 1.15V ~ 1.25V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FBGA (17x17)

paquet: -

Request a Quote

5SGXMA5H3F35C4WN

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 46080000
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: -

Request a Quote

EP4SGX230DF29C2XG

Intel

IC FPGA 372 I/O 780FBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

Request a Quote

KU82303-20

Intel

IC I/O CHIP 100QFP

• Type: I/O Chip
• Applications: -
• Mounting Type: Surface Mount
• Package / Case: 100-QFP
• Supplier Device Package: 100-PQFP

paquet: -

Request a Quote

AGFB014R24B2E3E

Intel

IC FPGA AGILEX-F 2486FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.4M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

paquet: -

Request a Quote