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Produits Intel

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5CSXFC6C6U23C8N
Intel

IC FPGA 145 I/O 672UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz
  • Primary Attributes: FPGA - 110K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-FBGA
  • Supplier Device Package: 672-UBGA (23x23)
paquet: 672-FBGA
Stock7 424
HC1S60F1020
Intel

IC FPGA APEX 1020FBGA

  • Number of LABs/CLBs: 5712
  • Number of Logic Elements/Cells: 57120
  • Total RAM Bits: 5215104
  • Number of I/O: 782
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -
  • Package / Case: 1020-BBGA
  • Supplier Device Package: 1020-FBGA (33x33)
paquet: 1020-BBGA
Stock4 224
EP2AGX95EF35C6ES
Intel

IC FPGA 452 I/O 1152FBGA

  • Number of LABs/CLBs: 3747
  • Number of Logic Elements/Cells: 89178
  • Total RAM Bits: 6839296
  • Number of I/O: 452
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock6 400
EP20K200CF484C8
Intel

IC FPGA 376 I/O 484FBGA

  • Number of LABs/CLBs: 832
  • Number of Logic Elements/Cells: 8320
  • Total RAM Bits: 106496
  • Number of I/O: 376
  • Number of Gates: 526000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BBGA
Stock5 328
hot EPF10K50EQC240-2N
Intel

IC FPGA 189 I/O 240QFP

  • Number of LABs/CLBs: 360
  • Number of Logic Elements/Cells: 2880
  • Total RAM Bits: 40960
  • Number of I/O: 189
  • Number of Gates: 199000
  • Voltage - Supply: 2.3 V ~ 2.7 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 240-BQFP
  • Supplier Device Package: 240-PQFP (32x32)
paquet: 240-BQFP
Stock4 352
10M08DCF484I7G
Intel

IC FPGA 250 I/O 484FBGA

  • Number of LABs/CLBs: 500
  • Number of Logic Elements/Cells: 8000
  • Total RAM Bits: 387072
  • Number of I/O: 250
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BGA
Stock6 448
5SGSED8K1F40I2N
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 60968960
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock2 464
5SGXEA7K2F35C2N
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock2 064
EP4SGX290FF35C3N
Intel

IC FPGA 564 I/O 1152FBGA

  • Number of LABs/CLBs: 11648
  • Number of Logic Elements/Cells: 291200
  • Total RAM Bits: 17661952
  • Number of I/O: 564
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock7 504
5SGXEA4H2F35C2N
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 43983872
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock5 552
5SGXEA4K3F35I3LN
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 43983872
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock6 704
5SGXMA3E3H29I3LN
Intel

IC FPGA 360 I/O 780HBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 23704576
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
paquet: 780-BBGA, FCBGA
Stock2 400
EPM7064TC44-3
Intel

IC CPLD 64MC 3.5NS 44TQFP

  • Programmable Type: EE PLD
  • Delay Time tpd(1) Max: 3.5ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1250
  • Number of I/O: 36
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-TQFP (10x10)
paquet: 44-TQFP
Stock6 512
EPM9400RC240-15
Intel

IC CPLD 400MC 15NS 240RQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 15.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 25
  • Number of Macrocells: 400
  • Number of Gates: 8000
  • Number of I/O: 159
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-RQFP (32x32)
paquet: 240-BFQFP Exposed Pad
Stock2 944
hot EPM7128SQC160-10N
Intel

IC CPLD 128MC 10NS 160QFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 2500
  • Number of I/O: 100
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-PQFP (28x28)
paquet: 160-BQFP
Stock5 808
5AGXFB3H4F40I3NAA
Intel

IC FPGA 704 I/O 1517FBGA

  • Number of LABs/CLBs: 17110
  • Number of Logic Elements/Cells: 362000
  • Total RAM Bits: 19822592
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 1.12V ~ 1.18V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock4 944
1SX110HN3F43I2VG
Intel

IC FPGA STRATIX 10 1760FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 1100K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
paquet: -
Request a Quote
EP3SL110F780C2G
Intel

IC FPGA 488 I/O 780FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
1SG210HN2F43E2VGAS
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 262500
  • Number of Logic Elements/Cells: 2100000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
paquet: -
Request a Quote
5SGXMA5K3F35I4WN
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: -
Request a Quote
5ASXBB3D6F31C6G
Intel

IC SOC CORTEX-A9 700MHZ 896FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 700MHz
  • Primary Attributes: FPGA - 350K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FBGA (31x31)
paquet: -
Request a Quote
5SGXEA5K1F35C2LG
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: -
Request a Quote
AGFA027R31C2I2V
Intel

IC FPGA AGILEX-F 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
AGFB006R24D1I2V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 573K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
paquet: -
Request a Quote
5SGXEB5R2F43I3G
Intel

IC FPGA 600 I/O 1760FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 41984000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: -
Request a Quote
5SGXEA5N3F45I3LG
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 46080000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
paquet: -
Request a Quote
EPM7064AEWWC
Intel

IC CPLD 64MC DIE

  • Programmable Type: -
  • Delay Time tpd(1) Max: -
  • Voltage Supply - Internal: 4.75V ~ 5.25V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1250
  • Number of I/O: -
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: Die
  • Supplier Device Package: Die
paquet: -
Request a Quote
1ST250EU2F50E2VG
Intel

IC FPGA 440 I/O 2397BGA

  • Number of LABs/CLBs: 312500
  • Number of Logic Elements/Cells: 2500000
  • Total RAM Bits: -
  • Number of I/O: 440
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2397-BBGA, FCBGA
  • Supplier Device Package: 2397-FBGA, FC (50x50)
paquet: -
Request a Quote