Produits Intel

5ASXFB5H4F40I3N

Intel

IC FPGA 528 I/O 1517FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 64KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.05GHz
• Primary Attributes: FPGA - 462K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

paquet: 1517-BBGA, FCBGA

10AX057K2F40I1SG

Intel

IC FPGA 696 I/O 1517FCBGA

• Number of LABs/CLBs: 217080
• Number of Logic Elements/Cells: 570000
• Total RAM Bits: 42082304
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

paquet: 1517-BBGA, FCBGA

EP2A70F1508C7

Intel

IC FPGA 1060 I/O 1508FBGA

• Number of LABs/CLBs: 6720
• Number of Logic Elements/Cells: 67200
• Total RAM Bits: 1146880
• Number of I/O: 1060
• Number of Gates: 5250000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1508-BBGA, FCBGA
• Supplier Device Package: 1508-FBGA (30x30)

paquet: 1508-BBGA, FCBGA

EP1K10TC144-1

Intel

IC FPGA 92 I/O 144TQFP

• Number of LABs/CLBs: 72
• Number of Logic Elements/Cells: 576
• Total RAM Bits: 12288
• Number of I/O: 92
• Number of Gates: 56000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

paquet: 144-LQFP

EPF10K50VRI240-4

Intel

IC FPGA 189 I/O 240RQFP

• Number of LABs/CLBs: 360
• Number of Logic Elements/Cells: 2880
• Total RAM Bits: 20480
• Number of I/O: 189
• Number of Gates: 116000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-RQFP (32x32)

paquet: 240-BFQFP Exposed Pad

EP2C5F256C6N

Intel

IC FPGA 158 I/O 256FBGA

• Number of LABs/CLBs: 288
• Number of Logic Elements/Cells: 4608
• Total RAM Bits: 119808
• Number of I/O: 158
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FBGA (17x17)

paquet: 256-LBGA

EP4CE55F23I8LN

Intel

IC FPGA 324 I/O 484FBGA

• Number of LABs/CLBs: 3491
• Number of Logic Elements/Cells: 55856
• Total RAM Bits: 2396160
• Number of I/O: 324
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

paquet: 484-BGA

EP4S100G4F45I2N

Intel

IC FPGA 781 I/O 1932FBGA

• Number of LABs/CLBs: 14144
• Number of Logic Elements/Cells: 353600
• Total RAM Bits: 23105536
• Number of I/O: 781
• Number of Gates: -
• Voltage - Supply: 0.92 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

paquet: 1932-BBGA, FCBGA

10AX090U2F45I2SG

Intel

IC FPGA 480 I/O 1932FCBGA

• Number of LABs/CLBs: 339620
• Number of Logic Elements/Cells: 900000
• Total RAM Bits: 59234304
• Number of I/O: 480
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

paquet: 1932-BBGA, FCBGA

5SGSMD4H3F35C2L

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 135840
• Number of Logic Elements/Cells: 360000
• Total RAM Bits: 23946240
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: 1152-BBGA, FCBGA

EP2SGX90EF1152C5

Intel

IC FPGA 558 I/O 1152FBGA

• Number of LABs/CLBs: 4548
• Number of Logic Elements/Cells: 90960
• Total RAM Bits: 4520448
• Number of I/O: 558
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: 1152-BBGA, FCBGA

EP2AGX45DF29C4N

Intel

IC FPGA 364 I/O 780FBGA

• Number of LABs/CLBs: 1805
• Number of Logic Elements/Cells: 42959
• Total RAM Bits: 3517440
• Number of I/O: 364
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

paquet: 780-BBGA, FCBGA

EP4CGX150CF23C7N

Intel

IC FPGA 270 I/O 484FBGA

• Number of LABs/CLBs: 9360
• Number of Logic Elements/Cells: 149760
• Total RAM Bits: 6635520
• Number of I/O: 270
• Number of Gates: -
• Voltage - Supply: 1.16 V ~ 1.24 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

paquet: 484-BGA

5CGXFC5C6U19C6N

Intel

IC FPGA 224 I/O 484UBGA

• Number of LABs/CLBs: 29080
• Number of Logic Elements/Cells: 77000
• Total RAM Bits: 5001216
• Number of I/O: 224
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-FBGA
• Supplier Device Package: 484-UBGA (19x19)

paquet: 484-FBGA

5CEFA2M13C7N

Intel

IC FPGA 223 I/O 383MBGA

• Number of LABs/CLBs: 9434
• Number of Logic Elements/Cells: 25000
• Total RAM Bits: 2002944
• Number of I/O: 223
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 383-TFBGA
• Supplier Device Package: 383-MBGA (13x13)

paquet: 383-TFBGA

AGFB022R31C2I1VAA

Intel

IC FPGA AGILEX-F 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.2M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

paquet: -

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HPIXP2350ACT

Intel

INTEL IXP2350 NETWORK PROCESSOR

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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5SGXMA5K3F35C2WN

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 46080000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: -

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5SGSED6K2F40I3LNCV

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 220000
• Number of Logic Elements/Cells: 583000
• Total RAM Bits: 46080000
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

paquet: -

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PF28F1604C3BD70

Intel

MEMORY CIRCUIT, 2MX16, CMOS, PBG

• Memory Type: -
• Memory Format: -
• Technology: -
• Memory Size: -
• Memory Interface: -
• Clock Frequency: -
• Write Cycle Time - Word, Page: -
• Access Time: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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NQ84001XMB

Intel

INTEL E8500 CHIPSET NORTH BRIDGE

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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5SGXMA4H2F35C2NCV

Intel

IC FPGA 600 I/O 1152FBGA

• Number of LABs/CLBs: 158500
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 37888000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: -

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EPM7512AEFI256-7

Intel

IC CPLD 512MC 7.5NS 256FBGA

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5 ns
• Voltage Supply - Internal: 3V ~ 3.6V
• Number of Logic Elements/Blocks: 32
• Number of Macrocells: 512
• Number of Gates: 10000
• Number of I/O: 212
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

paquet: -

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AGFD023R24C3E3E

Intel

IC FPGA AGILEX-F 2340BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

paquet: -

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5SGXEA5N2F40I2LG

Intel

IC FPGA 600 I/O 1517FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 46080000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

paquet: -

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10M16SAU169A7G

Intel

IC FPGA 130 I/O NV MAX10 169UBGA

• Number of LABs/CLBs: 1000
• Number of Logic Elements/Cells: 16000
• Total RAM Bits: 562176
• Number of I/O: 130
• Number of Gates: -
• Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 169-LFBGA
• Supplier Device Package: 169-UBGA (11x11)

paquet: -

AGFA014R24C2E1V

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.4M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

paquet: -

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1SG065HH3F35E3VG

Intel

IC FPGA STRATIX10GX 1152FBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 612000
• Total RAM Bits: 51380224
• Number of I/O: 392
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: -

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