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Produits Intel

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1SX250LH3F55E2VG
Intel

2912-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2500K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 408
10AS016E4F29E3LG
Intel

IC SOC FPGA 288 I/O 780FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 160K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
paquet: 780-BBGA, FCBGA
Stock4 336
EPC16UC88II
Intel

IC CONFIG DEVICE

  • Programmable Type: In System Programmable
  • Memory Size: 16Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 88-LFBGA
  • Supplier Device Package: 88-UBGA (11x8)
paquet: 88-LFBGA
Stock3 040
EPF10K200SRC240-2X
Intel

IC FPGA 182 I/O 240RQFP

  • Number of LABs/CLBs: 1248
  • Number of Logic Elements/Cells: 9984
  • Total RAM Bits: 98304
  • Number of I/O: 182
  • Number of Gates: 513000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-RQFP (32x32)
paquet: 240-BFQFP Exposed Pad
Stock3 824
hot EP1C3T100C8
Intel

IC FPGA 65 I/O 100TQFP

  • Number of LABs/CLBs: 291
  • Number of Logic Elements/Cells: 2910
  • Total RAM Bits: 59904
  • Number of I/O: 65
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
paquet: 100-TQFP
Stock6 096
10AX090S2F45I1SG
Intel

IC FPGA 624 I/O 1932FCBGA

  • Number of LABs/CLBs: 339620
  • Number of Logic Elements/Cells: 900000
  • Total RAM Bits: 59234304
  • Number of I/O: 624
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
paquet: 1932-BBGA, FCBGA
Stock3 552
EP3SL200H780I3N
Intel

IC FPGA 488 I/O 780HBGA

  • Number of LABs/CLBs: 8000
  • Number of Logic Elements/Cells: 200000
  • Total RAM Bits: 10901504
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
paquet: 780-BBGA, FCBGA
Stock7 472
5SGXEA4K2F35C3N
Intel

IC FPGA 432 I/O 1152FBGA

  • Number of LABs/CLBs: 158500
  • Number of Logic Elements/Cells: 420000
  • Total RAM Bits: 43983872
  • Number of I/O: 432
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock4 528
5SGXMA5K2F40I3LN
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 53105664
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock7 568
EP2S60F1020I4
Intel

IC FPGA 718 I/O 1020FBGA

  • Number of LABs/CLBs: 3022
  • Number of Logic Elements/Cells: 60440
  • Total RAM Bits: 2544192
  • Number of I/O: 718
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1020-BBGA
  • Supplier Device Package: 1020-FBGA (33x33)
paquet: 1020-BBGA
Stock5 536
EP3CLS150F484C8N
Intel

IC FPGA 210 I/O 484FBGA

  • Number of LABs/CLBs: 9428
  • Number of Logic Elements/Cells: 150848
  • Total RAM Bits: 6137856
  • Number of I/O: 210
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BGA
Stock4 848
5AGXBA7D4F35C5N
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 11460
  • Number of Logic Elements/Cells: 242000
  • Total RAM Bits: 15470592
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.07 V ~ 1.13 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA Exposed Pad
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: 1152-BBGA, FCBGA Exposed Pad
Stock7 792
EP2AGX45CU17C4
Intel

IC FPGA 156 I/O 358UBGA

  • Number of LABs/CLBs: 1805
  • Number of Logic Elements/Cells: 42959
  • Total RAM Bits: 3517440
  • Number of I/O: 156
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 358-LFBGA, FCBGA
  • Supplier Device Package: 358-UBGA, FC (17x17)
paquet: 358-LFBGA, FCBGA
Stock4 848
EP4CGX15BF14C7
Intel

IC FPGA 72 I/O 169FBGA

  • Number of LABs/CLBs: 900
  • Number of Logic Elements/Cells: 14400
  • Total RAM Bits: 552960
  • Number of I/O: 72
  • Number of Gates: -
  • Voltage - Supply: 1.16 V ~ 1.24 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 169-LBGA
  • Supplier Device Package: 169-FBGA (14x14)
paquet: 169-LBGA
Stock3 504
hot EPM7512AEBC256-7
Intel

IC CPLD 512MC 7.5NS 256BGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 32
  • Number of Macrocells: 512
  • Number of Gates: 10000
  • Number of I/O: 212
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-BGA (27x27)
paquet: 256-LBGA
Stock5 760
5M570ZT100C4N
Intel

IC CPLD 440MC 9NS 100TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 9.0ns
  • Voltage Supply - Internal: 1.71 V ~ 1.89 V
  • Number of Logic Elements/Blocks: 570
  • Number of Macrocells: 440
  • Number of Gates: -
  • Number of I/O: 74
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
paquet: 100-TQFP
Stock10 620
5AGXFB3H4F40I3G
Intel

IC FPGA 704 I/O 1517FBGA

  • Number of LABs/CLBs: 17110
  • Number of Logic Elements/Cells: 362000
  • Total RAM Bits: 19822592
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 1.12V ~ 1.18V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock4 784
5SGSMD8N3F45C2LG
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 51200000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
paquet: -
Request a Quote
5SGXMA7H2F35C2LG
Intel

IC FPGA 552 I/O 1152FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 552
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: -
Request a Quote
HH80552PG0882M
Intel

IC MPU 641 3.2GHZ 775LGA

  • Core Processor: Intel® Pentium® 4 Processor 641 supporting HT Technology
  • Number of Cores/Bus Width: 1 Core, 64-Bit
  • Speed: 3.2GHz
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.2V, 1.3375V
  • Operating Temperature: 69.2°C (TC)
  • Security Features: -
  • Package / Case: 775-LGA
  • Supplier Device Package: 775-LGA (37.5x37.5)
paquet: -
Request a Quote
1SG211HN2F43E2VG
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 263750
  • Number of Logic Elements/Cells: 2110000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
paquet: -
Request a Quote
5ASXBB3D4F40C4G
Intel

IC SOC CORTEX-A9 925MHZ 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 925MHz
  • Primary Attributes: FPGA - 350K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA, FC (40x40)
paquet: -
Request a Quote
5SGXMA3K2F35C2WN
Intel

IC FPGA 600 I/O 1152FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 19456000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: -
Request a Quote
LE80536VC900512
Intel

DOTHAN, CELERON M PROCESSOR, ULV

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
5SGXEA7N2F40C1G
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
paquet: -
Request a Quote
5SGXEA7K3F40I4G
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
paquet: -
Request a Quote
5SGXMA3K2F35C3G
Intel

IC FPGA 600 I/O 1152FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 19456000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: -
Request a Quote
1SX250HH2F55I1VG
Intel

IC FPGA STRATIX 10 2912FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2500K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2912-BBGA, FCBGA
  • Supplier Device Package: 2912-FBGA, FC (55x55)
paquet: -
Request a Quote