Produits Intel

NG80960JD3V50

Intel

IC MPU I960 50MHZ 132QFP

• Core Processor: i960
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 100°C (TC)
• Security Features: -
• Package / Case: 132-QFP
• Supplier Device Package: 132-PQFP (24.13x24.13)

paquet: 132-QFP

1SX280LU3F50I3VG

Intel

2397-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2800K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

paquet: -

10AS027E4F27E3SG

Intel

672-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, POR, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 270K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

paquet: -

EPC2TC32

Intel

IC CONFIG DEVICE 1.6MBIT 32TQFP

• Programmable Type: In System Programmable
• Memory Size: 1.6Mb
• Voltage - Supply: 3 V ~ 3.6 V, 4.75 V ~ 5.25 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 32-TQFP
• Supplier Device Package: 32-TQFP (7x7)

paquet: 32-TQFP

EP20K60EBC356-3

Intel

IC FPGA 196 I/O 356BGA

• Number of LABs/CLBs: 2560
• Number of Logic Elements/Cells: 2560
• Total RAM Bits: 32768
• Number of I/O: 196
• Number of Gates: 162000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 356-LBGA
• Supplier Device Package: 356-BGA (35x35)

paquet: 356-LBGA

EP20K100BC356-1

Intel

IC FPGA 252 I/O 356BGA

• Number of LABs/CLBs: 416
• Number of Logic Elements/Cells: 4160
• Total RAM Bits: 53248
• Number of I/O: 252
• Number of Gates: 263000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 356-LBGA
• Supplier Device Package: 356-BGA (35x35)

paquet: 356-LBGA

EPF10K10LC84-4

Intel

IC FPGA 59 I/O 84PLCC

• Number of LABs/CLBs: 72
• Number of Logic Elements/Cells: 576
• Total RAM Bits: 6144
• Number of I/O: 59
• Number of Gates: 31000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

paquet: 84-LCC (J-Lead)

EP3C55F484I7N

Intel

IC FPGA 327 I/O 484FBGA

• Number of LABs/CLBs: 3491
• Number of Logic Elements/Cells: 55856
• Total RAM Bits: 2396160
• Number of I/O: 327
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BGA
• Supplier Device Package: 484-FBGA (23x23)

paquet: 484-BGA

EP4SE820H40C3

Intel

IC FPGA 976 I/O 1517HBGA

• Number of LABs/CLBs: 32522
• Number of Logic Elements/Cells: 813050
• Total RAM Bits: 34093056
• Number of I/O: 976
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-HBGA (42.5x42.5)

paquet: 1517-BBGA, FCBGA

5SGXEA3K1F35C2N

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 23704576
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: 1152-BBGA, FCBGA

5SGXMA3K2F40C2LN

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 23704576
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82 V ~ 0.88 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

paquet: 1517-BBGA, FCBGA

5AGXBA1D4F27C5N

Intel

IC FPGA 336 I/O 672FBGA

• Number of LABs/CLBs: 3537
• Number of Logic Elements/Cells: 75000
• Total RAM Bits: 8666112
• Number of I/O: 336
• Number of Gates: -
• Voltage - Supply: 1.07 V ~ 1.13 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FBGA (27x27)

paquet: 672-BBGA, FCBGA

EPM9320LC84-20

Intel

IC CPLD 320MC 20NS 84PLCC

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 20.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 20
• Number of Macrocells: 320
• Number of Gates: 6000
• Number of I/O: 60
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

paquet: 84-LCC (J-Lead)

EPM7064STC44-7N

Intel

IC CPLD 64MC 7.5NS 44TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1250
• Number of I/O: 36
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

paquet: 44-TQFP

1SG065HH3F35I3XG

Intel

IC FPGA STRATIX10GX 1152FBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 612000
• Total RAM Bits: 51380224
• Number of I/O: 392
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: -

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5SGXMA9K3H40I3NCV

Intel

IC FPGA 696 I/O 1517HBGA

• Number of LABs/CLBs: 317000
• Number of Logic Elements/Cells: 840000
• Total RAM Bits: 53248000
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-HBGA (45x45)

paquet: -

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5SGXMB5R3F43C3G

Intel

IC FPGA 600 I/O 1760FBGA

• Number of LABs/CLBs: 185000
• Number of Logic Elements/Cells: 490000
• Total RAM Bits: 41984000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

paquet: -

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AGIB019R18A2E1VB

Intel

IC FPGA AGILEX-I 1805BGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1805-BBGA Exposed Pad
• Supplier Device Package: 1805-BGA (42.5x42.5)

paquet: -

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1SD280PT2F55E1VGS1

Intel

IC FPGA 816 I/O 2912FBGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 2753000
• Total RAM Bits: 240123904
• Number of I/O: 816
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2912-BBGA, FCBGA
• Supplier Device Package: 2912-FBGA (55x55)

paquet: -

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AGFD023R24C2I2V

Intel

IC

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.3M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

paquet: -

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1SX065HH2F35E2VG

Intel

IC FPGA STRATIX10SX 1152FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 650K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: -

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5962-8766803MYA

Intel

IC MPU MG80386 20MHZ 164CQFP

• Core Processor: 80386
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 20MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5V
• Operating Temperature: -55°C ~ 125°C (TC)
• Security Features: -
• Package / Case: 164-BCQFP Exposed Pad
• Supplier Device Package: 164-CQFP (28.71x28.71)

paquet: -

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5SGSMD4E2H29I3G

Intel

IC FPGA 360 I/O 780HBGA

• Number of LABs/CLBs: 135840
• Number of Logic Elements/Cells: 360000
• Total RAM Bits: 19456000
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-HBGA (33x33)

paquet: -

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AGFA027R31C2E4X

Intel

IC FPGA AGILEX-F 3184FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 2.7M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

paquet: -

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AGFA014R24C2I3V

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.4M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

paquet: -

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5SGXMA7K2F35I2LG

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 234720
• Number of Logic Elements/Cells: 622000
• Total RAM Bits: 51200000
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

paquet: -

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AGFB008R16A3I3E

Intel

IC FPGA AGILEX-F 1546FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 764K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

paquet: -

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1SX110HN2F43I2LG

Intel

IC FPGA STRATIX 10 1760FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 1100K Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

paquet: -

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