Page 101 - Produits Intel | Heisener Electronics
Contactez nous
SalesDept@heisener.com +86-755-83210559 ext. 816
Language Translation

* Please refer to the English Version as our Official Version.

Produits Intel

Dossiers 9 824
Page  101/351
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
10AS057K3F35E2LG
Intel

IC SOC FPGA 396 I/O 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 570K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock4 576
10AS048E2F29E2SG
Intel

780-PIN FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 480K Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 568
hot EPC1064LC20
Intel

IC CONFIG DEVICE 20PLCC

  • Programmable Type: OTP
  • Memory Size: 65kb
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 20-LCC (J-Lead)
  • Supplier Device Package: 20-PLCC (9x9)
paquet: 20-LCC (J-Lead)
Stock11 424
EPF10K50EFC484-3N
Intel

IC FPGA 220 I/O 484FBGA

  • Number of LABs/CLBs: 360
  • Number of Logic Elements/Cells: 2880
  • Total RAM Bits: 40960
  • Number of I/O: 220
  • Number of Gates: 199000
  • Voltage - Supply: 2.3 V ~ 2.7 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BBGA
Stock4 800
EPF10K20RC240-3N
Intel

IC FPGA 189 I/O 240RQFP

  • Number of LABs/CLBs: 144
  • Number of Logic Elements/Cells: 1152
  • Total RAM Bits: 12288
  • Number of I/O: 189
  • Number of Gates: 63000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-RQFP (32x32)
paquet: 240-BFQFP Exposed Pad
Stock2 416
hot EP1K50TI144-2
Intel

IC FPGA 102 I/O 144TQFP

  • Number of LABs/CLBs: 360
  • Number of Logic Elements/Cells: 2880
  • Total RAM Bits: 40960
  • Number of I/O: 102
  • Number of Gates: 199000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock5 520
EP3SE260F1152I3
Intel

IC FPGA 744 I/O 1152FBGA

  • Number of LABs/CLBs: 10200
  • Number of Logic Elements/Cells: 255000
  • Total RAM Bits: 16672768
  • Number of I/O: 744
  • Number of Gates: -
  • Voltage - Supply: 0.86 V ~ 1.15 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock4 768
EP4S100G3F45I2N
Intel

IC FPGA 781 I/O 1932FBGA

  • Number of LABs/CLBs: 11648
  • Number of Logic Elements/Cells: 291200
  • Total RAM Bits: 17661952
  • Number of I/O: 781
  • Number of Gates: -
  • Voltage - Supply: 0.92 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
paquet: 1932-BBGA, FCBGA
Stock6 608
5SGSMD8K1F40C2N
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 60968960
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock6 608
5SGXMB5R2F43I2LN
Intel

IC FPGA 600 I/O 1760FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 48927744
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock3 856
EP4SGX530NF45C3N
Intel

IC FPGA 920 I/O 1932FBGA

  • Number of LABs/CLBs: 21248
  • Number of Logic Elements/Cells: 531200
  • Total RAM Bits: 28033024
  • Number of I/O: 920
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
paquet: 1932-BBGA, FCBGA
Stock7 424
5SGXEA5N2F40I3N
Intel

IC FPGA 600 I/O 1517FBGA

  • Number of LABs/CLBs: 185000
  • Number of Logic Elements/Cells: 490000
  • Total RAM Bits: 53105664
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock7 744
5SGXEA7N3F45C4N
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
paquet: 1932-BBGA, FCBGA
Stock3 392
EP4SGX180DF29C3N
Intel

IC FPGA 372 I/O 780FBGA

  • Number of LABs/CLBs: 7030
  • Number of Logic Elements/Cells: 175750
  • Total RAM Bits: 13954048
  • Number of I/O: 372
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
paquet: 780-BBGA, FCBGA
Stock6 528
5SGXEA9K3H40I3N
Intel

IC FPGA 696 I/O 1517HBGA

  • Number of LABs/CLBs: 317000
  • Number of Logic Elements/Cells: 840000
  • Total RAM Bits: 64210944
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-HBGA (45x45)
paquet: 1517-BBGA, FCBGA
Stock7 584
EP3C80F484C6
Intel

IC FPGA 295 I/O 484FBGA

  • Number of LABs/CLBs: 5079
  • Number of Logic Elements/Cells: 81264
  • Total RAM Bits: 2810880
  • Number of I/O: 295
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FBGA (23x23)
paquet: 484-BGA
Stock2 320
EP3C25F324A7N
Intel

IC FPGA 215 I/O 324FBGA

  • Number of LABs/CLBs: 1539
  • Number of Logic Elements/Cells: 24624
  • Total RAM Bits: 608256
  • Number of I/O: 215
  • Number of Gates: -
  • Voltage - Supply: 1.15 V ~ 1.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 324-BGA
  • Supplier Device Package: 324-FBGA (19x19)
paquet: 324-BGA
Stock2 096
EPM7512BUC169-7N
Intel

IC CPLD 512MC 7.5NS 169UBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 2.375 V ~ 2.625 V
  • Number of Logic Elements/Blocks: 32
  • Number of Macrocells: 512
  • Number of Gates: 10000
  • Number of I/O: 141
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 169-LFBGA
  • Supplier Device Package: 169-UBGA (11x11)
paquet: 169-LFBGA
Stock2 464
EPM570GF256I5N
Intel

IC CPLD 440MC 5.4NS 256FBGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 5.4ns
  • Voltage Supply - Internal: 1.71 V ~ 1.89 V
  • Number of Logic Elements/Blocks: 570
  • Number of Macrocells: 440
  • Number of Gates: -
  • Number of I/O: 160
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
paquet: 256-BGA
Stock7 360
hot EPM7064AETC44-7
Intel

IC CPLD 64MC 7.5NS 44TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1250
  • Number of I/O: 36
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-TQFP
  • Supplier Device Package: 44-TQFP (10x10)
paquet: 44-TQFP
Stock3 968
5AGTFC7H3F35I3NAD
Intel

IC FPGA 544 I/O 1152FBGA

  • Number of LABs/CLBs: 11460
  • Number of Logic Elements/Cells: 242000
  • Total RAM Bits: 15470592
  • Number of I/O: 544
  • Number of Gates: -
  • Voltage - Supply: 1.12V ~ 1.18V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock7 632
EP2AGX45DF25I3G
Intel

IC FPGA 252 I/O 572FBGA

  • Number of LABs/CLBs: 1805
  • Number of Logic Elements/Cells: 42959
  • Total RAM Bits: 3517440
  • Number of I/O: 252
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 572-BGA, FCBGA
  • Supplier Device Package: 572-FBGA, FC (25x25)
paquet: 572-BGA, FCBGA
Stock7 344
AGFB012R24C3E3E
Intel

IC FPGA AGILEX-F 2340FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.2M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
5ASXBB5D4F40C5G
Intel

IC SOC CORTEX-A9 800MHZ 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: FPGA - 462K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA, FC (40x40)
paquet: -
Request a Quote
RK80546KF1001M
Intel

PRESCOTT CELERON PROCESSOR

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
5SGXMA3H2F35C1G
Intel

IC FPGA 600 I/O 1152FBGA

  • Number of LABs/CLBs: 128300
  • Number of Logic Elements/Cells: 340000
  • Total RAM Bits: 19456000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: -
Request a Quote
5SGSMD8K1F40C2G
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 262400
  • Number of Logic Elements/Cells: 695000
  • Total RAM Bits: 51200000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
paquet: -
Request a Quote
E28F200B5T80
Intel

IC FLASH 2MBIT CUI 48TSOP

  • Memory Type: Non-Volatile
  • Memory Format: FLASH
  • Technology: FLASH - Boot Block
  • Memory Size: 2Mbit
  • Memory Interface: CUI
  • Clock Frequency: -
  • Write Cycle Time - Word, Page: 100µs
  • Access Time: 60 ns
  • Voltage - Supply: 4.5V ~ 5.25V, 4.75V ~ 5.5V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-TFSOP (0.724", 18.40mm Width)
  • Supplier Device Package: 48-TSOP
paquet: -
Request a Quote