Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC SWITCHING REGULATOR TO66
|
paquet: TO-213AA, TO-66-4 |
Stock3 280 |
|
- | 60V | -55°C ~ 125°C | Through Hole | TO-213AA, TO-66-4 | TO-66 |
||
Active-Semi International Inc. |
IC REG BUCK LDO 40TQFN
|
paquet: 40-WFQFN Exposed Pad |
Stock5 552 |
|
420µA | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN (5x5) |
||
Microchip Technology |
IC PWR MGMT FOR MOBILES 32QFN
|
paquet: 32-VQFN Exposed Pad |
Stock11 640 |
|
6mA | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (7x7) |
||
Linear Technology |
IC PWR SUPPLY + LED DRVR 44QFN
|
paquet: 44-PowerWFQFN |
Stock3 136 |
|
16µA | 2.7 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 44-PowerWFQFN | 44-QFN (4x7) |
||
Intersil |
IC REG/CTRLR ACPI DUAL DDR 28QFN
|
paquet: 28-VQFN Exposed Pad |
Stock5 600 |
|
7mA | - | 0°C ~ 70°C | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
Diodes Incorporated |
HEATER CONTROLLER SO-8
|
paquet: - |
Stock6 608 |
|
- | - | - | - | - | - |
||
Texas Instruments |
IC PROG FEEDBK DIVIDER 14-TSSOP
|
paquet: 14-TSSOP (0.173", 4.40mm Width) |
Stock2 464 |
|
1mA | 4.3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
Diodes Incorporated |
IRON CONTROLLER SO-8
|
paquet: - |
Stock6 352 |
|
- | - | - | - | - | - |
||
Texas Instruments |
IC PWR MGMT 4DCDC/8 LDO 48VQFN
|
paquet: 48-VFQFN Exposed Pad |
Stock15 960 |
|
- | 1.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN (6x6) |
||
Allegro MicroSystems, LLC |
IC PHOTOFLASH CHARGER 8DFN
|
paquet: 8-UFDFN Exposed Pad |
Stock24 678 |
|
2mA | 2.3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-UFDFN Exposed Pad | 8-DFN/MLP (2x2) |
||
IDT, Integrated Device Technology Inc |
IC TRANSMITTER WPC-COMPL 40QFN
|
paquet: - |
Stock2 272 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER DIP-8
|
paquet: - |
Stock4 176 |
|
- | 3.5 V ~ 5.5 V | -20°C ~ 85°C (TA) | - | - | - |
||
ams |
IC PMU REGULATOR 56QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock5 200 |
|
500µA | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (7x7) |
||
Rohm Semiconductor |
IO REGULATOR 16-SSOP
|
paquet: - |
Request a Quote |
|
20mA | 4.2V ~ 13V | 0°C ~ 70°C | Surface Mount | 16-LSSOP (0.173", 4.40mm Width) | 16-SSOP-B |
||
Intersil |
340KHZ PQCC28
|
paquet: - |
Request a Quote |
|
50µA | 5.6V ~ 24V | -40°C ~ 85°C | Surface Mount | 28-VFQFN Exposed Pad | 28-QFN (5x5) |
||
Renesas Electronics Corporation |
IC PWR SOURCE MOD DISTR 12QFN
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - |
||
STMicroelectronics |
DISCRETE
|
paquet: - |
Request a Quote |
|
9.7mA | 4.5V ~ 16V | -40°C ~ 85°C (TA) | Surface Mount | 72-UFBGA, WLCSP | 72-WLCSP (3.27x3.67) |
||
Analog Devices Inc./Maxim Integrated |
AUTOMOTIVE MULTI CHANNEL PMIC FO
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - |
||
NXP |
SYSTEM BASIS CHIP, LINEAR 0.5A V
|
paquet: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
AnDAPT, Inc. |
ON DEMAND 6A PMIC 5X5 PLATFORM B
|
paquet: - |
Stock4 524 |
|
6A | 12V | -40°C ~ 85°C (TA) | Surface Mount | 65-PowerWFQFN | 65-QF (5x5) |
||
Renesas Electronics Corporation |
IC WIRELESS MODULE
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC PMIC 48VFQFPN
|
paquet: - |
Request a Quote |
|
- | - | - | Surface Mount, Wettable Flank | 48-VFQFN Exposed Pad | 48-VFQFPN (7x7) |
||
Texas Instruments |
AUTOMOTIVE LOW-EMISSION 36-V PUS
|
paquet: - |
Stock28 272 |
|
3mA | 3V ~ 36V | -55°C ~ 125°C (TA) | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad | 10-HVSSOP |
||
Renesas Electronics Corporation |
P9180A-I6 BLUEFINXP
|
paquet: - |
Request a Quote |
|
- | 4.5V ~ 5.25V | -40°C ~ 85°C | Surface Mount | 100-VFQFN Dual Rows, Exposed Pad | 100-VFQFPN (8x8) |
||
Rohm Semiconductor |
IC POWER MANAGEMENT SMD
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
CELLULAR RF POWER-MANAGEMENT
|
paquet: - |
Request a Quote |
|
180µA | 2.5V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 12-WQFN Exposed Pad | 12-TQFN (4x4) |
||
NXP |
SAFETY SYSTEM BASIS CHIP WITH LO
|
paquet: - |
Request a Quote |
|
- | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
Analog Devices Inc./Maxim Integrated |
MAX8890 INTEGRATED CELLULAR RF-S
|
paquet: - |
Request a Quote |
|
180µA | 2.5V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 12-WQFN Exposed Pad | 12-TQFN (4x4) |