Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Active-Semi International Inc. |
IC PMU MULTIFUNCTION
|
paquet: - |
Stock3 056 |
|
- | - | - | - | - | - |
||
Texas Instruments |
IC PMU FOR APP PROCESSOR 40WQFN
|
paquet: 40-WFQFN Exposed Pad |
Stock20 952 |
|
60µA | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 40-WFQFN Exposed Pad | 40-WQFN (5x5) |
||
NXP |
IC PWR MNGMNT ATLAS 3G 247MAPBGA
|
paquet: 247-TFBGA |
Stock252 240 |
|
- | - | -40°C ~ 85°C | Surface Mount | 247-TFBGA | 247-MAPBGA (10x10) |
||
Intersil |
IC REG/CTRLR ACPI DUAL DDR 28QFN
|
paquet: 28-VQFN Exposed Pad |
Stock18 828 |
|
5.25mA | - | 0°C ~ 70°C | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
ams |
IC PMU POWER/AUDIO 124-CTBGA
|
paquet: 124-TFBGA |
Stock4 400 |
|
7mA | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 124-TFBGA | 124-CTBGA (8x8) |
||
Linear Technology |
IC PWR MANAGEMENT HANDHELD 44QFN
|
paquet: 44-PowerWFQFN |
Stock3 776 |
|
- | 4.35 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 44-PowerWFQFN | 44-QFN (4x7) |
||
Monolithic Power Systems Inc. |
POWER MANAGEMENT SPECIALIZED - P
|
paquet: - |
Stock160 044 |
|
- | - | - | - | - | - |
||
Texas Instruments |
IC ENERGY HARV CTRLR BATT 16QFN
|
paquet: 16-VFQFN Exposed Pad |
Stock71 484 |
|
330nA | 2.5 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Texas Instruments |
IC LOAD SHARE CONTROLLER 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock115 152 |
|
4mA | 2.7 V ~ 20 V | -40°C ~ 100°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
HEATER CONTROLLER PDIP-8
|
paquet: - |
Stock2 128 |
|
- | - | - | - | - | - |
||
Texas Instruments |
IC PMU 4DCDC/8LDO 98BGA
|
paquet: 98-VFBGA |
Stock8 136 |
|
- | 2.7 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 98-VFBGA | 98-BGA Microstar JR |
||
Texas Instruments |
IC USB PWR SW/CTRLR CHRG SOT23-6
|
paquet: SOT-23-6 |
Stock24 030 |
|
155µA | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | SOT-23-6 | SOT-23-6 |
||
NXP |
IC TRANSMITTER 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock16 164 |
|
- | - | - | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Linear Technology |
IC PWR SUPPLY + LED DRVR 44QFN
|
paquet: 44-PowerWFQFN |
Stock7 908 |
|
16µA | 2.7 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 44-PowerWFQFN | 44-QFN (4x7) |
||
Maxim Integrated |
IC LCD BIAS SUPPLY DGT ADJ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock14 136 |
|
60µA | 2 V ~ 6 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
IC TRPL-OUT LCD SUPPLY 24-HTSSOP
|
paquet: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Stock70 272 |
|
1.9mA | 1.8 V ~ 6 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) Exposed Pad | 24-HTSSOP |
||
NXP |
FS4500
|
paquet: 48-LQFP Exposed Pad |
Stock7 200 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
IC TRANSCEIVER
|
paquet: - |
Stock5 408 |
|
- | - | - | - | - | - |
||
Maxim Integrated |
INTEGRATED CIRCUIT
|
paquet: - |
Stock4 624 |
|
- | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS RECEIVER
|
paquet: - |
Stock6 736 |
|
- | - | - | - | - | - |
||
Diodes Incorporated |
HEATER CONTROLLER DIP-8
|
paquet: - |
Stock3 408 |
|
- | - | - | - | - | - |
||
NXP |
IC POWER MANAGEMENT LS1046A
|
paquet: 56-VFQFN Exposed Pad |
Stock7 104 |
|
- | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
SYSTEM BASIS CHIP, DCDC 0.8A VCO
|
paquet: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
Analog Devices Inc./Maxim Integrated |
POWER SUPPLY SUPPORT CIRCUIT, FI
|
paquet: - |
Request a Quote |
|
20mA (Max) | 2.6V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 12-WFBGA, CSPBGA | 12-UCSP (2.02x1.54) |
||
Renesas Electronics Corporation |
ONCE OTP IS FINALIZED, PART BECO
|
paquet: - |
Request a Quote |
|
50µA | 1.2V ~ 3.6V | -40°C ~ 125°C (TJ) | Surface Mount | 100-TFBGA | 100-TFBGA (8x8) |
||
NXP |
SYSTEM BASIS CHIP, DCDC 2.2A VCO
|
paquet: - |
Request a Quote |
|
- | 2.7V ~ 40V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
NXP |
PF8200
|
paquet: - |
Request a Quote |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
Renesas Electronics Corporation |
IC CLOCK
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - |