Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Active-Semi International Inc. |
IC PMU MULTIFUNCTION
|
paquet: - |
Stock4 144 |
|
420µA | 2.3 V ~ 5.5 V | -40°C ~ 85°C | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC WIRELESS PWR RECEIVER
|
paquet: - |
Stock5 600 |
|
- | - | - | - | - | - |
||
Texas Instruments |
IC ENERGY MANAGEMENT 36USMD
|
paquet: 36-WFBGA |
Stock6 240 |
|
- | 2.7 V ~ 4.8 V | -40°C ~ 85°C | Surface Mount | 36-WFBGA | 36-uSMD |
||
Diodes Incorporated |
IC SW 7BIAS TONE H/V 2.0V 24QSOP
|
paquet: 24-QSOP |
Stock14 556 |
|
- | - | - | Surface Mount | 24-QSOP | 24-QSOP |
||
Microchip Technology |
IC PHASE CONTROL ONE-SHOT 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 312 |
|
2mA | 7.2 V ~ 9.2 V | -10°C ~ 100°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Maxim Integrated |
IC DCDC CONV STPDN DL LDO 20TQFN
|
paquet: 20-WQFN Exposed Pad |
Stock5 792 |
|
- | 3.7 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 20-WQFN Exposed Pad | 20-TQFN-EP (5x5) |
||
Maxim Integrated |
IC POWER MANAGEMENT 48-TQFN
|
paquet: 48-WFQFN Exposed Pad |
Stock23 832 |
|
- | 2.6 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-WFQFN Exposed Pad | 48-TQFN (7x7) |
||
Linear Technology |
IC DC/DC CONV DUAL CHRG 24-QFN
|
paquet: 24-WFQFN Exposed Pad |
Stock16 260 |
|
- | 3 V ~ 6 V | -40°C ~ 85°C | Surface Mount | 24-WFQFN Exposed Pad | 24-QFN (4x4) |
||
Texas Instruments |
IC PWR MGMT W/CHARGER 48WQFN
|
paquet: 48-WFQFN Exposed Pad |
Stock2 848 |
|
- | 2.5 V ~ 6 V | -40°C ~ 85°C | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (6x6) |
||
Diodes Incorporated |
HEATER CONTROLLER PDIP-8
|
paquet: - |
Stock2 656 |
|
- | - | - | - | - | - |
||
Texas Instruments |
IC BIAS PWR SUP FOR LCD 28VQFN
|
paquet: 28-VFQFN Exposed Pad |
Stock34 764 |
|
- | 9.5 V ~ 14 V | -40°C ~ 85°C | Surface Mount | 28-VFQFN Exposed Pad | 28-VQFN (5x5) |
||
Rohm Semiconductor |
IC PD CTLR USB TYPE-C 40UQFN
|
paquet: 40-VFQFN Exposed Pad |
Stock5 584 |
|
- | 4.75 V ~ 20 V | -30°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | UQFN040V5050 |
||
Maxim Integrated |
IC POWER MANAGE XSCALE 40-TQFN
|
paquet: 40-WFQFN Exposed Pad |
Stock74 436 |
|
- | 2.6 V ~ 6 V | -40°C ~ 85°C | Surface Mount | 40-WFQFN Exposed Pad | 40-TQFN-EP (5x5) |
||
Linear Technology |
IC PHOTOFLASH CAP CHARGER 6-DFN
|
paquet: 6-WFDFN Exposed Pad |
Stock4 656 |
|
5mA | 1.7 V ~ 16 V | -40°C ~ 85°C | Surface Mount | 6-WFDFN Exposed Pad | 6-DFN (2x3) |
||
Microchip Technology |
IC ULTRASOUND IMAGING 36VQFN
|
paquet: 36-VFQFN Exposed Pad |
Stock24 330 |
|
- | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 36-VFQFN Exposed Pad | 36-VQFN (6x6) |
||
NXP |
PF1550
|
paquet: 40-VFQFN Exposed Pad |
Stock5 696 |
|
- | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
||
NXP |
PF1550
|
paquet: 40-VFQFN Exposed Pad |
Stock3 920 |
|
- | 3.8 V ~ 7 V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (5x5) |
||
NXP |
REGULATOR BUCK QUAD WITH UP TO
|
paquet: 56-VFQFN Exposed Pad |
Stock6 144 |
|
250µA | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
Maxim Integrated |
IC PWR SUPPLY CDMA CELL/PCS TSSO
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock3 760 |
|
367µA | 2.5 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP-EP |
||
Rohm Semiconductor |
IC CTLR USB TYPE-C PD LSI UQFN
|
paquet: - |
Request a Quote |
|
- | 4.75V ~ 20V | -30°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | UQFN040V5050 |
||
Skyworks Solutions Inc. |
POWER ISOLATION
|
paquet: - |
Stock5 685 |
|
6.9mA | 3V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.295", 7.50mm Width) | 8-SOIC |
||
Nisshinbo Micro Devices Inc. |
300MA ULTRA-LOW POWER BUCK BOOST
|
paquet: - |
Request a Quote |
|
300nA | 1.8V ~ 5.5V | -40°C ~ 85°C | Surface Mount | 20-XFBGA, WLCSP | 20-WLCSP-P3 (2.32x1.71) |
||
Renesas Electronics Corporation |
MP-3ZK
|
paquet: - |
Request a Quote |
|
708µA | 9V ~ 28V | -20°C ~ 85°C (TA) | Surface Mount | TO-252-3, DPAK (2 Leads + Tab), SC-63 | TO-252 (MP-3ZP) |
||
Renesas Electronics Corporation |
CABGA 9.00X9.00X0.90 MM, 0.65MM
|
paquet: - |
Request a Quote |
|
- | 3.135V ~ 5.25V | -40°C ~ 85°C | - | - | - |
||
Analog Devices Inc./Maxim Integrated |
IC REG BUCK
|
paquet: - |
Request a Quote |
|
1.1mA | 3V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 32-WFQFN Exposed Pad | 32-TQFN (5x5) |
||
NXP |
SYSTEM BASIS CHIP, DCDC 1.5A VCO
|
paquet: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |
||
Renesas Electronics Corporation |
IC WIRELESS TRANSMITTER
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - |
||
NXP |
SYSTEM BASIS CHIP, DCDC 1.5A VCO
|
paquet: - |
Request a Quote |
|
- | 1V ~ 5V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-HLQFP (7x7) |