Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
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Rohm Semiconductor |
IC EEPROM 8KBIT 2MHZ 8SOPJ
|
paquet: - |
Stock5 520 |
|
EEPROM | EEPROM | 8Kb (512 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | - | - | - |
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Microchip Technology |
IC FLASH 2MBIT 150NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock2 720 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 20ms | 150ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TC) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC |
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Cypress Semiconductor Corp |
IC SRAM 36MBIT 250MHZ 165FBGA
|
paquet: 165-LBGA |
Stock3 200 |
|
SRAM | SRAM - Synchronous, DDR II | 36Mb (1M x 36) | Parallel | 250MHz | - | - | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (15x17) |
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Micron Technology Inc. |
IC FLASH 256MBIT 70NS 64TBGA
|
paquet: 64-TBGA |
Stock5 632 |
|
FLASH | FLASH - NOR | 256Mb (32M x 8, 16M x 16) | Parallel | - | 70ns | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-TBGA | 64-TBGA (10x13) |
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IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 20NS 44TSOP
|
paquet: 44-TSOP (0.400", 10.16mm Width) |
Stock2 400 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 20ns | 20ns | 2.375 V ~ 2.625 V | 0°C ~ 70°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
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Maxim Integrated |
IC NVSRAM 256KBIT 100NS 256BGA
|
paquet: 256-BGA |
Stock2 896 |
|
NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 100ns | 100ns | 4.75 V ~ 5.25 V | -40°C ~ 85°C (TA) | Surface Mount | 256-BGA | 256-BGA (27x27) |
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Cypress Semiconductor Corp |
IC SRAM 64KBIT 15NS 64TQFP
|
paquet: 64-LQFP |
Stock4 640 |
|
SRAM | SRAM - Dual Port, Asynchronous | 64Kb (8K x 8) | Parallel | - | 15ns | 15ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 64-LQFP | 64-TQFP (14x14) |
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Cypress Semiconductor Corp |
IC SRAM 4MBIT 10NS 44TSOP
|
paquet: 44-TSOP (0.400", 10.16mm Width) |
Stock377 232 |
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SRAM | SRAM - Asynchronous | 4Mb (256K x 16) | Parallel | - | 10ns | 10ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-TSOP (0.400", 10.16mm Width) | 44-TSOP II |
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IDT, Integrated Device Technology Inc |
IC SRAM 256KBIT 25NS 68PLCC
|
paquet: 68-LCC (J-Lead) |
Stock7 680 |
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SRAM | SRAM - Dual Port, Asynchronous | 256Kb (32K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 68-LCC (J-Lead) | 68-PLCC (24.21x24.21) |
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Cypress Semiconductor Corp |
IC NVSRAM 256KBIT 25NS 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock5 760 |
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NVSRAM | NVSRAM (Non-Volatile SRAM) | 256Kb (32K x 8) | Parallel | - | 25ns | 25ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
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IDT, Integrated Device Technology Inc |
IC SRAM 9MBIT 166MHZ 165CABGA
|
paquet: 165-TBGA |
Stock6 192 |
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SRAM | SRAM - Synchronous | 9Mb (512K x 18) | Parallel | 166MHz | - | 3.5ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 165-TBGA | 165-CABGA (13x15) |
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Micron Technology Inc. |
IC SDRAM 256MBIT 167MHZ 54VFBGA
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paquet: 54-VFBGA |
Stock5 040 |
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DRAM | SDRAM | 256Mb (16M x 16) | Parallel | 167MHz | 12ns | 5.4ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-VFBGA | 54-VFBGA (8x8) |
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Microchip Technology |
IC EEPROM 8KBIT 10MHZ 8DIP
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paquet: 8-DIP (0.300", 7.62mm) |
Stock5 904 |
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EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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Winbond Electronics |
IC FLASH 4MBIT 104MHZ 8SOIC
|
paquet: 8-SOIC (0.209", 5.30mm Width) |
Stock2 768 |
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FLASH | FLASH | 4Mb (512K x 8) | SPI | 104MHz | 800µs | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOIC |
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Cypress Semiconductor Corp |
IC SRAM 36MBIT 250MHZ 165FBGA
|
paquet: 165-LBGA |
Stock6 756 |
|
SRAM | SRAM - Synchronous, DDR II | 36Mb (2M x 18) | Parallel | 250MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
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Maxim Integrated |
IC OTP 1KBIT 1WIRE SOT23-3
|
paquet: TO-236-3, SC-59, SOT-23-3 |
Stock155 376 |
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EPROM | EPROM - OTP | 1Kb (1K x 1) | 1-Wire? | - | - | 15µs | - | -40°C ~ 85°C (TA) | Surface Mount | TO-236-3, SC-59, SOT-23-3 | SOT-23-3 |
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Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER
|
paquet: Die |
Stock6 432 |
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EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
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Cypress Semiconductor Corp |
IC FLASH 32M PARALLEL 64BGA
|
paquet: 64-LBGA |
Stock3 376 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8, 2M x 16) | Parallel | - | 90ns | 90ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (13x11) |
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ISSI, Integrated Silicon Solution Inc |
IC DRAM 128M PARALLEL 90TFBGA
|
paquet: 90-TFBGA |
Stock4 224 |
|
DRAM | SDRAM | 128Mb (4M x 32) | Parallel | 143MHz | - | - | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 90-TFBGA | 90-TFBGA (8x13) |
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Micron Technology Inc. |
SPI FLASH NOR 2G 45NM IT QDP
|
paquet: 24-TBGA |
Stock4 160 |
|
FLASH | FLASH | 2Gb (256M x 8) | Xccela Bus | 200MHz | - | - | 1.7 V ~ 2 V | -40°C ~ 125°C | Surface Mount | 24-TBGA | 24-TPBGA |
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Micron Technology Inc. |
IC FLASH 4G SPI UPDFN
|
paquet: - |
Stock6 688 |
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FLASH | FLASH - NAND | 4Gb (4G x 1) | SPI | - | - | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
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Micron Technology Inc. |
IC FLASH RAM 4G PARALLEL 208MHZ
|
paquet: - |
Stock5 408 |
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FLASH, RAM | FLASH - NAND, Mobile LPDRAM | 4Gb (512M x 8)(NAND), 2G (64M x 32)(LPDRAM) | Parallel | 208MHz | - | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | - | - | - |
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Renesas Electronics Corporation |
DDR SRAM, 1MX36, 0.45NS
|
paquet: - |
Request a Quote |
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- | - | - | - | - | - | - | - | - | - | - | - |
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Winbond Electronics |
2GB LPDDR4X, DDP, X32, 2133MHZ,
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4X | 2Gbit | LVSTL_06 | 2.133 GHz | 18ns | 3.6 ns | 1.06V ~ 1.17V, 1.7V ~ 1.95V | -40°C ~ 105°C (TC) | Surface Mount | 200-TFBGA | 200-TFBGA (10x14.5) |
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ATP Electronics, Inc. |
IC FLASH 512GBIT EMMC 153BGA
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NAND (pSLC) | 512Gbit | eMMC | - | - | - | - | -40°C ~ 105°C | Surface Mount | 153-FBGA | 153-BGA (11.5x13) |
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Spansion |
2 GB, 3 V, SLC NAND FLASH
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
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GigaDevice Semiconductor (HK) Limited |
IC FLASH 512KBIT SPI/DUAL 8USON
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 512Kbit | SPI - Dual I/O | 50 MHz | 55µs, 6ms | 12 ns | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 8-XFDFN Exposed Pad | 8-USON (1.5x1.5) |
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Infineon Technologies |
INFINEON
|
paquet: - |
Request a Quote |
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- | - | - | - | - | - | - | - | - | - | - | - |