Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology Inc. |
MCP 5MX16 PLASTIC 2.0V IND
|
paquet: - |
Stock6 256 |
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- | - | - | - | - | - | - | - | - | - | - | - |
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ON Semiconductor |
IC FLASH 2MBIT 90NS 32TSOP
|
paquet: 32-TFSOP (0.724", 18.40mm Width) |
Stock4 144 |
|
FLASH | FLASH | 2Mb (256K x 8) | Parallel | - | 90ns | 90ns | 4.75 V ~ 5.25 V | 0°C ~ 70°C (TA) | Surface Mount | 32-TFSOP (0.724", 18.40mm Width) | 32-TSOP |
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Micron Technology Inc. |
IC FLASH 1GBIT 35NS 63VFBGA
|
paquet: 63-VFBGA |
Stock2 000 |
|
FLASH | FLASH - NAND | 1Gb (64M x 16) | Parallel | - | - | - | 1.7 V ~ 1.95 V | 0°C ~ 70°C (TA) | Surface Mount | 63-VFBGA | 63-VFBGA |
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STMicroelectronics |
IC OTP 256KBIT 90NS 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock41 832 |
|
EPROM | EPROM - OTP | 256Kb (32K x 8) | Parallel | - | - | 90ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.35x13.89) |
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IDT, Integrated Device Technology Inc |
IC SRAM 4.5MBIT 183MHZ 119BGA
|
paquet: 119-BGA |
Stock5 200 |
|
SRAM | SRAM - Synchronous | 4.5Mb (128K x 36) | Parallel | 183MHz | - | 3.3ns | 3.135 V ~ 3.465 V | 0°C ~ 70°C (TA) | Surface Mount | 119-BGA | 119-PBGA (14x22) |
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IDT, Integrated Device Technology Inc |
IC SRAM 1MBIT 15NS 44SOJ
|
paquet: 44-BSOJ (0.400", 10.16mm Width) |
Stock2 608 |
|
SRAM | SRAM - Asynchronous | 1Mb (64K x 16) | Parallel | - | 15ns | 15ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 44-BSOJ (0.400", 10.16mm Width) | 44-SOJ |
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ISSI, Integrated Silicon Solution Inc |
IC SDRAM 256MBIT 133MHZ 54TFBGA
|
paquet: 54-TFBGA |
Stock117 000 |
|
DRAM | SDRAM | 256Mb (16M x 16) | Parallel | 133MHz | - | 5.5ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 54-TFBGA | 54-TFBGA (8x13) |
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Cypress Semiconductor Corp |
IC SRAM 18MBIT 250MHZ 165FBGA
|
paquet: 165-LBGA |
Stock5 264 |
|
SRAM | SRAM - Synchronous, QDR II | 18Mb (512K x 36) | Parallel | 250MHz | - | - | 1.7 V ~ 1.9 V | 0°C ~ 70°C (TA) | Surface Mount | 165-LBGA | 165-FBGA (13x15) |
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Microchip Technology |
IC EEPROM 32KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 424 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 3MHz | 5ms | - | 2.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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IDT, Integrated Device Technology Inc |
IC SRAM 18KBIT 55NS 52PLCC
|
paquet: 52-LCC (J-Lead) |
Stock4 576 |
|
SRAM | SRAM - Dual Port, Asynchronous | 18Kb (2K x 9) | Parallel | - | 55ns | 55ns | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 52-LCC (J-Lead) | 52-PLCC (19.13x19.13) |
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Winbond Electronics |
IC FLASH 32MBIT 133MHZ 24TFBGA
|
paquet: 24-TBGA |
Stock4 896 |
|
FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI | 133MHz | 3ms | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
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Microchip Technology |
IC EEPROM 2KBIT 10MHZ SOT23-6
|
paquet: SOT-23-6 |
Stock3 648 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 10MHz | 5ms | - | 1.8 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | SOT-23-6 | SOT-23-6 |
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STMicroelectronics |
IC EEPROM 256KBIT 1MHZ 8MLP
|
paquet: 8-UFDFN Exposed Pad |
Stock140 292 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 1MHz | 5ms | 450ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-MLP (2x3) |
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Rohm Semiconductor |
IC EEPROM 2KBIT 400KHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock2 656 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 400kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
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ISSI, Integrated Silicon Solution Inc |
IC FLASH 128M SPI 133MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock8 280 |
|
FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI - Quad I/O, QPI, DTR | 133MHz | 800µs | - | 1.65 V ~ 1.95 V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
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Cypress Semiconductor Corp |
IC FLASH 512M PARALLEL 64FBGA
|
paquet: 64-LBGA |
Stock7 296 |
|
FLASH | FLASH - NOR | 512Mb (32M x 16) | Parallel | - | 60ns | 110ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-FBGA (9x9) |
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STMicroelectronics |
IC EEPROM 16K SPI 20MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock2 608 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 20MHz | 4ms | - | 2.5 V ~ 5.5 V | -40°C ~ 145°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
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IDT, Integrated Device Technology Inc |
IC SRAM 288K PARALLEL 100TQFP
|
paquet: 100-LQFP |
Stock7 024 |
|
SRAM | SRAM - Dual Port, Synchronous | 288Kb (16K x 18) | Parallel | - | - | 9ns | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
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Winbond Electronics |
IC FLASH 64MBIT SPI/QUAD 8WSON
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR | 64Mbit | SPI - Quad I/O, QPI, DTR | 133 MHz | 3ms | 6 ns | 1.7V ~ 1.95V | -40°C ~ 105°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
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Alliance Memory, Inc. |
MEMORY
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR2 | 2Gbit | HSUL_12 | 400 MHz | 15ns | 5.5 ns | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | 134-FBGA (10x11.5) |
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Infineon Technologies |
IC FRAM 16MBIT SPI/QUAD 24FBGA
|
paquet: - |
Stock96 |
|
FRAM | FRAM (Ferroelectric RAM) | 16Mbit | SPI - Quad I/O, QPI | 108 MHz | - | 6.7 ns | 1.71V ~ 1.89V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-FBGA (6x8) |
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Winbond Electronics |
IC DRAM 2GBIT HSUL 12 134VFBGA
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR2-S4B | 2Gbit | HSUL_12 | 533 MHz | 15ns | - | 1.14V ~ 1.3V, 1.7V ~ 1.95V | -40°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
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Winbond Electronics |
IC DRAM 4GBIT PAR 78VFBGA
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - DDR3L | 4Gbit | Parallel | 1.06 GHz | 15ns | 20 ns | 1.283V ~ 1.45V | -40°C ~ 95°C (TC) | Surface Mount | 78-VFBGA | 78-VFBGA (8x10.5) |
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Micron Technology Inc. |
LPDDR4 96GBIT 64 556/841 TFBGA 8
|
paquet: - |
Request a Quote |
|
DRAM | SDRAM - Mobile LPDDR4 | 96Gbit | - | 2.133 GHz | - | - | - | -25°C ~ 85°C | Surface Mount | 556-TFBGA | 556-WFBGA (12.4x12.4) |
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Infineon Technologies |
IC FLASH 256MBIT SPI/QUAD 24BGA
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NOR (SLC) | 256Mbit | SPI - Quad I/O | 80 MHz | 750µs | 6.5 ns | 2.7V ~ 3.6V | -40°C ~ 125°C (TA) | Surface Mount | 24-TBGA | 24-BGA (8x6) |
||
Micron Technology Inc. |
LPDDR5 128GBIT 64 1159/2021 VFBG
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC EEPROM 512KBIT I2C 1MHZ 8UDFN
|
paquet: - |
Stock11 211 |
|
EEPROM | EEPROM | 512Kbit | I2C | 1 MHz | 5ms | 900 ns | 1.7V ~ 5.5V | -40°C ~ 125°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | 8-UDFN (2x3) |
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Delkin Devices, Inc. |
IC FLASH 32GBIT EMMC 153FBGA
|
paquet: - |
Request a Quote |
|
FLASH | FLASH - NAND (MLC) | 32Gbit | eMMC | 200 MHz | - | - | 2.7V ~ 3.6V | -40°C ~ 85°C | Surface Mount | 153-VFBGA | 153-FBGA (11.5x13) |